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    METHOD FOR SOLDERING CHIP ON METALLIC-CERAMIC COMPOSITE BOARD AND METALLIC-CERAMIC COMPOSITE BOARD FOR SOLDERING CHIP THEREON
    23.
    发明申请
    METHOD FOR SOLDERING CHIP ON METALLIC-CERAMIC COMPOSITE BOARD AND METALLIC-CERAMIC COMPOSITE BOARD FOR SOLDERING CHIP THEREON 审中-公开
    在金属陶瓷复合板和金属陶瓷复合板上焊接芯片的方法，用于焊接芯片

    公开(公告)号：WO2017032334A1

    公开(公告)日：2017-03-02

    申请号：PCT/CN2016/096746

    申请日：2016-08-25

    Applicant: BYD COMPANY LIMITED

    Inventor： GONG, Qing ,  LIN, Xinping ,  XU, Qiang ,  ZHANG, Weifeng ,  SHAO, Changjian ,  WEN, Huaitong

    IPC: H01L23/00

    CPC classification number: H01L23/3735 ,  H01L21/4807 ,  H01L23/562 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/291 ,  H01L2224/32227 ,  H01L2224/83447 ,  H01L2224/83815 ,  H01L2924/15159 ,  H01L2924/3511 ,  H01L2924/014 ,  H01L2924/00014

    Abstract: A method for soldering a chip on a metallic-ceramic composite board is provided, the metallic-ceramic composite board comprising a ceramic substrate, a first metal plate, and a second metal plate, plate faces at two sides of the ceramic substrate being configured to be a circuit face and a non-circuit face respectively, the first metal plate being connected to the circuit face, and the second metal plate being connected to the non-circuit face, wherein the method comprises: etching the second metal plate, such that the metallic-ceramic composite board forms a bent plate shape protruding towards the side at which the non-circuit face is located； and soldering the chip on the first metal plate, so as to obtain a substantially flat-straight metallic-ceramic composite board on which the chip is soldered. In addition, a metallic-ceramic composite board for soldering a chip thereon is provided.

    Abstract translation: 提供了一种在金属陶瓷复合板上焊接芯片的方法，所述金属陶瓷复合板包括陶瓷基板，第一金属板和第二金属板，所述陶瓷基板的两侧的板面构成为 分别是电路面和非电路面，第一金属板连接到电路面，第二金属板连接到非电路面，其中所述方法包括：蚀刻所述第二金属板，使得 金属陶瓷复合板形成朝向非电路面所在的一侧突出的弯曲板状; 并将芯片焊接在第一金属板上，以获得芯片焊接在其上的基本上平直的金属陶瓷复合板。 另外，提供了用于在其上焊接芯片的金属陶瓷复合板。

    BASE PLATE FOR HEAT SINK AS WELL AS HEAT SINK AND IGBT MODULE HAVING THE SAME
    26.
    发明申请
    BASE PLATE FOR HEAT SINK AS WELL AS HEAT SINK AND IGBT MODULE HAVING THE SAME 审中-公开
    散热片基板和散热片以及IGBT模块相同

    公开(公告)号：WO2017071652A1

    公开(公告)日：2017-05-04

    申请号：PCT/CN2016/103806

    申请日：2016-10-28

    Applicant: BYD COMPANY LIMITED

    Inventor： GONG, Qing ,  SUN, Yaxuan ,  LIN, Xinping ,  ZHAO, Shuming ,  WU, Bo ,  LUO, Jingjing ,  CHENG, Donghai

    IPC: H05K7/20

    CPC classification number: H05K7/20 ,  H01L23/473

    Abstract: A base plate for a heat sink as well as a heat sink and an IGBT module having the same are provided. The base plate includes: a base plate body, including a body part; and a first surface layer and a second surface layer disposed respectively on two opposing surfaces of the body part; and N pins disposed on the first surface layer and spaced apart from one another, each pin having a first end fixed on the first surface layer and a second end configured as a free end, in which the first surface layer and the N pins are configured to contact a coolant, an area of a first portion of the first surface layer contacting the coolant is denoted as S1, and an area of a second portion of the first surface layer contacting each pin is denoted as S2, in which 180≤S1/S2≤800, and 300≤N

    Abstract translation: 提供了一种用于散热器的基板以及具有该基板的散热器和IGBT模块。 基板包括：基板主体，其包括主体部分; 以及分别设置在所述主体部分的两个相对表面上的第一表面层和第二表面层; 以及N个销，所述N个销设置在所述第一表面层上并且彼此间隔开，每个销具有固定在所述第一表面层上的第一端和构造为自由端的第二端，其中配置所述第一表面层和所述N个销 接触冷却剂时，第一表面层的与冷却剂接触的第一部分的面积表示为S1，并且接触每个销的第一表面层的第二部分的面积表示为S2，其中180≤S1/ S2≤800，并且300≤N<650。

    POSITIVE TEMPERATURE COEFFICIENT HEATING ASSEMBLY AND DEFROSTER FOR A VEHICLE
    28.
    发明申请
    POSITIVE TEMPERATURE COEFFICIENT HEATING ASSEMBLY AND DEFROSTER FOR A VEHICLE 审中-公开
    积极温度系数加热组件和车辆除霜器

    公开(公告)号：WO2015058692A1

    公开(公告)日：2015-04-30

    申请号：PCT/CN2014/089164

    申请日：2014-10-22

    Applicant: BYD COMPANY LIMITED

    Inventor： GONG, Qing ,  LIN, Xinping ,  WU, Hui ,  LI, Xiaofang ,  REN, Maolin ,  WANG, Shumin ,  WU, Mengxiang ,  DENG, Tianyou ,  WEN, Huaitong ,  ZHANG, Weifeng ,  QIU, Hongmei

    IPC: H05B3/32 ,  H05B3/84

    CPC classification number: B60S1/026 ,  F24H3/0435 ,  H05B3/03 ,  H05B3/04 ,  H05B3/141 ,  H05B3/40 ,  H05B3/50 ,  H05B2203/009 ,  H05B2203/02 ,  H05B2203/023 ,  H05B2214/02

    Abstract: A positive temperature coefficient heating assembly includes a heating core (10) including a first metal electrode plate (2a), a second metal electrode plate (2b) and a plurality of PTC ceramic chips (1); an insulating layer coated on the heating core (10); and a metal tube (8); the PTC ceramic chip (1) includes a positive electrode layer, a negative electrode layer, and a ceramic sintered layer; a plurality of first limit grooves (21a) are formed in the first metal electrode plate (2a), a plurality of second limit grooves (2b) are formed in the second metal electrode plate (21b), a first end of each of the PTC ceramic chips (1) is embedded in one of the first limit grooves (21a), and a second end of each of the PTC ceramic chips (1) is embedded in one of the second limit grooves (21b).

    Abstract translation: 正温度系数加热组件包括包括第一金属电极板（2a），第二金属电极板（2b）和多个PTC陶瓷芯片（1）的加热芯（10）; 涂覆在加热芯（10）上的绝缘层; 和金属管（8）; PTC陶瓷芯片（1）包括正极层，负极层和陶瓷烧结层; 在第一金属电极板（2a）中形成有多个第一限制槽（21a），在第二金属电极板（21b）中形成有多个第二限制槽（2b），每个PTC的第一端 陶瓷芯片（1）嵌入在第一极限槽（21a）中的一个中，并且每个PTC陶瓷芯片（1）的第二端嵌入在第二限制槽（21b）中的一个中。

    METHOD FOR SELECTIVELY METALLIZING SURFACE OF CERAMIC SUBSTRATE, CERAMIC PRODUCT AND USE OF CERAMIC PRODUCT
    29.
    发明申请
    METHOD FOR SELECTIVELY METALLIZING SURFACE OF CERAMIC SUBSTRATE, CERAMIC PRODUCT AND USE OF CERAMIC PRODUCT 审中-公开
    陶瓷基材表面的选择性金属化方法，陶瓷产品和陶瓷产品的使用

    公开(公告)号：WO2012155811A1

    公开(公告)日：2012-11-22

    申请号：PCT/CN2012/075368

    申请日：2012-05-11

    Applicant: BYD COMPANY LIMITED ,  GONG, Qing ,  LIN, Xinping ,  REN, Yongpeng ,  ZHANG, Baoxiang

    Inventor： GONG, Qing ,  LIN, Xinping ,  REN, Yongpeng ,  ZHANG, Baoxiang

    IPC: C04B41/88 ,  C23C18/16

    CPC classification number: H05K3/181 ,  C04B41/009 ,  C04B41/5127 ,  C04B41/88 ,  C04B2111/00844 ,  C23C18/06 ,  C23C18/1245 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1639 ,  H05K1/0306 ,  H05K3/182 ,  H05K3/185 ,  H05K2203/107 ,  Y10T428/24917 ,  C04B35/00 ,  C04B35/04 ,  C04B35/10 ,  C04B35/18 ,  C04B35/19 ,  C04B35/195 ,  C04B35/44 ,  C04B35/48 ,  C04B35/505 ,  C04B35/563 ,  C04B35/565 ,  C04B35/583 ,  C04B35/584 ,  C04B35/597 ,  C04B41/0036 ,  C04B41/4541 ,  C04B41/4572 ,  C04B41/0045 ,  C04B35/185 ,  C04B35/443 ,  C04B35/20

    Abstract: A method for selectively metallizing a surface of a ceramic substrate, a ceramic product and use of the ceramic product are provided. The method comprises steps of: A) molding and sintering a ceramic composition to obtain the ceramic substrate, in which the ceramic composition comprises a ceramic powder and a functional powder dispersed in the ceramic powder; the ceramic powder is at least one selected from a group consisting of an oxide of E, a nitride of E, a oxynitride of E, and a carbide of E; E is at least one selected from a group consisting of Li, Na, K, Rb, Cs, Be, Mg, Ca, Sr, Ba, B, Al, Ga, Si, Ge, P, As, Sc, Y, Zr, Hf, and lanthanide elements; the functional powder is at least one selected from a group consisting of an oxide of M, a nitride of M, a oxynitride of M, a carbide of M, and a simple substance of M; and M is at least one selected from a group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Ta, W, Re, Os, Ir, Pt, Au, In, Sn, Sb, Pb, Bi, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu; B) radiating a predetermined region of the surface of the ceramic substrate using an energy beam to form a chemical plating active center on the predetermined region of the surface of the ceramic substrate; and C) performing chemical plating on the ceramic substrate formed with the chemical plating active center to form a metal layer on the predetermined region of the surface of the ceramic substrate.

    Abstract translation: 提供了选择性地金属化陶瓷基板的表面，陶瓷产品和陶瓷产品的用途的方法。 该方法包括以下步骤：A）模制和烧结陶瓷组合物以获得陶瓷基体，其中陶瓷组合物包含分散在陶瓷粉末中的陶瓷粉末和功能性粉末; 陶瓷粉末是选自E的氧化物，E的氮化物，E的氮氧化物和E的碳化物中的至少一种。 E是选自Li，Na，K，Rb，Cs，Be，Mg，Ca，Sr，Ba，B，Al，Ga，Si，Ge，P，As，Sc，Y，Zr中的至少一种 ，Hf和镧系元素; 功能性粉末是选自M的氧化物，M的氮化物，M的氧氮化物，M的碳化物和M的单质中的至少一种; 并且M是选自由Ti，V，Cr，Mn，Fe，Co，Ni，Cu，Zn，Nb，Mo，Tc，Ru，Rh，Pd，Ag，Cd，Ta， Re，Os，Ir，Pt，Au，In，Sn，Sb，Pb，Bi，Ce，Pr，Nd，Pm，Sm，Eu，Gd，Tb，Dy，Ho，Er，Tm，Yb和Lu; B）使用能量束照射陶瓷衬底的表面的预定区域，以在陶瓷衬底的表面的预定区域上形成化学电镀活性中心; 和C）在形成有化学电镀活性中心的陶瓷衬底上进行化学镀以在陶瓷衬底的表面的预定区域上形成金属层。

    CERAMIC AND MANUFACTURING METHOD THEREOF
    30.
    发明公开
    CERAMIC AND MANUFACTURING METHOD THEREOF 审中-公开
    陶瓷及其制造方法

    公开(公告)号：EP3231781A1

    公开(公告)日：2017-10-18

    申请号：EP15868073.6

    申请日：2015-11-24

    Applicant: BYD Company Limited

    Inventor： GONG, Qing ,  LIN, Xinping ,  CHEN, Ge ,  LIN, Yongzhao ,  WU, Bo

    IPC: C04B35/48 ,  C04B35/622

    Abstract: A ceramic and a preparation method therefor are provided. The ceramic includes a zirconia matrix, and an additive dispersed inside and on an outer surface of the zirconia matrix. The additive is an oxide including elements A and B, where A is selected from at least one of Ca, Sr, Ba, Y, and La, and B is selected from at least one of Cr, Mn, Fe, Co, and Ni.

    Abstract translation: 提供一种陶瓷及其制备方法。 陶瓷包括氧化锆基体和分散在氧化锆基体内部和外表面上的添加剂。 添加剂是包含元素A和B的氧化物，其中A选自Ca，Sr，Ba，Y和La中的至少一种，并且B选自Cr，Mn，Fe，Co和Ni中的至少一种 。

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