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    METHOD FOR SOLDERING CHIP ON METALLIC-CERAMIC COMPOSITE BOARD AND METALLIC-CERAMIC COMPOSITE BOARD FOR SOLDERING CHIP THEREON
    1.
    发明申请
    METHOD FOR SOLDERING CHIP ON METALLIC-CERAMIC COMPOSITE BOARD AND METALLIC-CERAMIC COMPOSITE BOARD FOR SOLDERING CHIP THEREON 审中-公开
    在金属陶瓷复合板和金属陶瓷复合板上焊接芯片的方法，用于焊接芯片

    公开(公告)号：WO2017032334A1

    公开(公告)日：2017-03-02

    申请号：PCT/CN2016/096746

    申请日：2016-08-25

    Applicant: BYD COMPANY LIMITED

    Inventor： GONG, Qing ,  LIN, Xinping ,  XU, Qiang ,  ZHANG, Weifeng ,  SHAO, Changjian ,  WEN, Huaitong

    IPC: H01L23/00

    CPC classification number: H01L23/3735 ,  H01L21/4807 ,  H01L23/562 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/291 ,  H01L2224/32227 ,  H01L2224/83447 ,  H01L2224/83815 ,  H01L2924/15159 ,  H01L2924/3511 ,  H01L2924/014 ,  H01L2924/00014

    Abstract: A method for soldering a chip on a metallic-ceramic composite board is provided, the metallic-ceramic composite board comprising a ceramic substrate, a first metal plate, and a second metal plate, plate faces at two sides of the ceramic substrate being configured to be a circuit face and a non-circuit face respectively, the first metal plate being connected to the circuit face, and the second metal plate being connected to the non-circuit face, wherein the method comprises: etching the second metal plate, such that the metallic-ceramic composite board forms a bent plate shape protruding towards the side at which the non-circuit face is located； and soldering the chip on the first metal plate, so as to obtain a substantially flat-straight metallic-ceramic composite board on which the chip is soldered. In addition, a metallic-ceramic composite board for soldering a chip thereon is provided.

    Abstract translation: 提供了一种在金属陶瓷复合板上焊接芯片的方法，所述金属陶瓷复合板包括陶瓷基板，第一金属板和第二金属板，所述陶瓷基板的两侧的板面构成为 分别是电路面和非电路面，第一金属板连接到电路面，第二金属板连接到非电路面，其中所述方法包括：蚀刻所述第二金属板，使得 金属陶瓷复合板形成朝向非电路面所在的一侧突出的弯曲板状; 并将芯片焊接在第一金属板上，以获得芯片焊接在其上的基本上平直的金属陶瓷复合板。 另外，提供了用于在其上焊接芯片的金属陶瓷复合板。

    ELECTRIC HEATER, DEFROSTER, HEATING AND AIR CONDITIONING SYSTEM AND VEHICLE
    2.
    发明申请
    ELECTRIC HEATER, DEFROSTER, HEATING AND AIR CONDITIONING SYSTEM AND VEHICLE 审中-公开
    电加热器，除油器，加热和空调系统和车辆

    公开(公告)号：WO2014176988A1

    公开(公告)日：2014-11-06

    申请号：PCT/CN2014/075735

    申请日：2014-04-18

    Applicant: SHENZHEN BYD AUTO R&D COMPANY LIMITED ,  BYD COMPANY LIMITED

    Inventor： GONG, Qing ,  LIN, Xinping ,  REN, Maolin ,  LI, Xiaofang ,  DENG, Tianyou ,  WANG, Shumin ,  WU, Hui ,  WU, Mengxiang ,  QIU, Hongmei ,  WEN, Huaitong ,  ZHANG, Weifeng

    IPC: H05B3/50 ,  H05B3/84 ,  F24D13/02 ,  B60H1/22

    CPC classification number: F24H3/0405 ,  B60H1/00471 ,  B60H1/2225 ,  B60H2001/2287 ,  F24H3/0435 ,  F24H9/0063 ,  F24H9/0073 ,  F24H9/1872 ,  F24H9/2071 ,  H05B3/04 ,  H05B3/50 ,  H05B2203/02 ,  H05B2203/023

    Abstract: An electric heater, a defroster, a heating and air conditioning system and a vehicle are provided. The electric heater includes an outer frame (8); a heating core (100) disposed within the outer frame (8) and defining first and second ends (101,102), at least one of the first and second ends (101,102) being configured to connect to a power source; a sealing-waterproof glue member (l) disposed within the outer frame (8) and configured to encase the at least one of the first and second ends (101,102) of the heating core (100); wherein the heating core (100) includes: a plurality of heat dissipating components (3), a plurality of heating components (2), the heating components (2) and the heat dissipating components (3) being arranged alternately, adjacent heating component (2) and heat dissipating component (3) being spaced apart from each other and connected with each other via a thermally conductive silicone rubber, the heating component (2) including a core tube (21) and a positive temperature coefficient thermistor (22) disposed in the core tube (21).

    Abstract translation: 提供电加热器，除霜器，加热和空调系统以及车辆。 电加热器包括外框架（8）; 设置在所述外框架（8）内并且限定第一和第二端（101,102）的加热芯（100），所述第一端和第二端（101,102）中的至少一个被配置为连接到电源; 密封防水胶构件（1），设置在所述外框架（8）内并且构造成包围所述加热芯（100）的所述第一端和第二端（101,102）中的至少一个; 其特征在于，所述加热芯（100）包括：多个散热部件（3），多个加热部件（2），所述加热部件（2）和所述散热部件（3）交替布置， 2）和散热部件（3）彼此间隔开并通过导热硅橡胶彼此连接，所述加热部件（2）包括芯管（21）和正温度系数热敏电阻（22），所述芯管 在芯管（21）中。

    POSITIVE TEMPERATURE COEFFICIENT HEATING ASSEMBLY AND DEFROSTER FOR A VEHICLE
    3.
    发明申请
    POSITIVE TEMPERATURE COEFFICIENT HEATING ASSEMBLY AND DEFROSTER FOR A VEHICLE 审中-公开
    积极温度系数加热组件和车辆除霜器

    公开(公告)号：WO2015058692A1

    公开(公告)日：2015-04-30

    申请号：PCT/CN2014/089164

    申请日：2014-10-22

    Applicant: BYD COMPANY LIMITED

    Inventor： GONG, Qing ,  LIN, Xinping ,  WU, Hui ,  LI, Xiaofang ,  REN, Maolin ,  WANG, Shumin ,  WU, Mengxiang ,  DENG, Tianyou ,  WEN, Huaitong ,  ZHANG, Weifeng ,  QIU, Hongmei

    IPC: H05B3/32 ,  H05B3/84

    CPC classification number: B60S1/026 ,  F24H3/0435 ,  H05B3/03 ,  H05B3/04 ,  H05B3/141 ,  H05B3/40 ,  H05B3/50 ,  H05B2203/009 ,  H05B2203/02 ,  H05B2203/023 ,  H05B2214/02

    Abstract: A positive temperature coefficient heating assembly includes a heating core (10) including a first metal electrode plate (2a), a second metal electrode plate (2b) and a plurality of PTC ceramic chips (1); an insulating layer coated on the heating core (10); and a metal tube (8); the PTC ceramic chip (1) includes a positive electrode layer, a negative electrode layer, and a ceramic sintered layer; a plurality of first limit grooves (21a) are formed in the first metal electrode plate (2a), a plurality of second limit grooves (2b) are formed in the second metal electrode plate (21b), a first end of each of the PTC ceramic chips (1) is embedded in one of the first limit grooves (21a), and a second end of each of the PTC ceramic chips (1) is embedded in one of the second limit grooves (21b).

    Abstract translation: 正温度系数加热组件包括包括第一金属电极板（2a），第二金属电极板（2b）和多个PTC陶瓷芯片（1）的加热芯（10）; 涂覆在加热芯（10）上的绝缘层; 和金属管（8）; PTC陶瓷芯片（1）包括正极层，负极层和陶瓷烧结层; 在第一金属电极板（2a）中形成有多个第一限制槽（21a），在第二金属电极板（21b）中形成有多个第二限制槽（2b），每个PTC的第一端 陶瓷芯片（1）嵌入在第一极限槽（21a）中的一个中，并且每个PTC陶瓷芯片（1）的第二端嵌入在第二限制槽（21b）中的一个中。

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