公开(公告)号：JP2001244607A

公开(公告)日：2001-09-07

申请号：JP2000049754

申请日：2000-02-25

Applicant: SONY CORP

Inventor： OGAWA MINORU ,  ITO SHIGEYASU ,  IZUMI MASAHIRO

IPC: H05K3/40 ,  H05K1/11 ,  H05K3/00 ,  H05K3/10 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a method of quickly manufacturing a mounting board that can maintain higher reliability and show sufficient performance of mounted elements while improving the manufacturing yield in the simplified process and also provide a mounting board with the same method. SOLUTION: A groove is formed in the region corresponding to wirings at both surfaces of a base material 1. In this case, the groove can be formed simultaneously with the molding of the base material. The groove formed on the base material 1 is filled with a conductive paste 3 and thereby the wiring is formed. The wirings at both surfaces of the base material 1 at the area where a through-hole is formed are electrically connected with a metal ball 2 embedded to the base material 1. Thereby, the wirings at both surfaces are connected with the metal ball 2 to structure a through-hole.

公开(公告)号：JP2001230526A

公开(公告)日：2001-08-24

申请号：JP2000035223

申请日：2000-02-14

Applicant: SONY CORP

Inventor： OGAWA MINORU ,  ITO SHIGEYASU ,  IZUMI MASAHIRO

IPC: H05K3/10 ,  B29C43/18 ,  B29C59/02

Abstract: PROBLEM TO BE SOLVED: To provide the manufacturing method of a mounted substrate, which suppresses migration by a wiring material and can copy a pattern without troubles, and to provide mounted substrate obtained by the method. SOLUTION: Core base materials 12 are arranged on both sides of a bonding sheet 11, and resin sheets 13 are arranged outside the core base materials 12. Molds 14 are pressed from both sides of a laminate. By making the molds 14 abutted on both sides of the laminate, they are depressed. Thus, a projecting part is pressed to the resin sheet 12, and the resin sheet 12 is deformed by following the projection part. Consequently, a wiring pattern is copied to the resin sheet 12. When the mold 14 is pressed against to the resin sheet 12, the mold 14 is heated. Thus, the laminate is integrated at time same as that when the pattern in the projecting part of the mold 14 is transferred. In this way, a substrate body 15 having a groove 16 in a wiring pattern is obtained by pressing against the laminate by the mold 14.

公开(公告)号：JPH11345901A

公开(公告)日：1999-12-14

申请号：JP14975598

申请日：1998-05-29

Applicant: SONY CORP

Inventor： TAKASHIMA TAKESHI ,  ITO SHIGEYASU

IPC: H01L23/12 ,  H01L21/52

Abstract: PROBLEM TO BE SOLVED: To accomplish a semiconductor package with which the chip crack caused by the difference in a linear thermal expansion coefficient can be prevented by a relatively simple method. SOLUTION: This is a semiconductor package provided with a semiconductor die 1, an interposer substrate 2 on which the semiconductor die 1 is placed, and the sealing resin 3 with which the semiconductor die 1 and the interposer substrate 2 are sealed up. When the semiconductor die 1 is fixed to the interposer substrate 2, they are fixed in such a manner that at least a part between them is constituted by a void or a non-fixing material.

公开(公告)号：JPH10135254A

公开(公告)日：1998-05-22

申请号：JP29191596

申请日：1996-11-01

Applicant: SONY CORP

Inventor： ITO SHIGEYASU ,  TAKASHIMA TAKESHI

IPC: H01L23/28 ,  H01L21/56

Abstract: PROBLEM TO BE SOLVED: To eliminate the need for accurately adjusting the viscosity of a resin in a potting method, by placing a frame to surround a semiconductor chip on a substrate, dripping a liq. resin inside the frame, and cutting the resin and substrate along a semiconductor chip after hardening the resin. SOLUTION: Many semiconductor chips or bare chips 10 are mounted on a substrate 20' and adhered to the top surface of the substrate with adhesives 12. Electrodes or lands of both are connected by the wire bonding method. A liq. resin 15 is dripped by the potting method and stored in pot-like parts defined by the substrate 20' at the bottoms and frame 30 at the side walls. The resin liq. level rises to penetrate the resin 15 among the chips 10. The potting ends to harden the resin 15. The substrate 20' and resin 15 are divided to produce many semiconductor devices, thus mounting the semiconductor chips 10 at a high density on the substrate 20'.

公开(公告)号：JP2003303938A

公开(公告)日：2003-10-24

申请号：JP2002362558

申请日：2002-12-13

Applicant: Mitsubishi Plastics Ind Ltd ,  Sony Corp ,  ソニー株式会社 ,  三菱樹脂株式会社

Inventor： OGAWA MINORU ,  IZUMI MASAHIRO ,  ITO SHIGEYASU ,  YAMADA SHINGETSU ,  SUZUKI HIDEJI ,  KUROSAKI NORIO

IPC: H05K3/22 ,  H01L21/48 ,  H01L23/14 ,  H01L23/498 ,  H01L23/52 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H05K1/18 ,  H05K3/04 ,  H05K3/10 ,  H05K3/12 ,  H05K3/46

CPC classification number: H05K3/4632 ,  H01L21/4857 ,  H01L23/145 ,  H01L23/49822 ,  H01L24/24 ,  H01L24/82 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H05K1/185 ,  H05K3/041 ,  H05K3/107 ,  H05K3/1258 ,  H05K3/4617 ,  H05K2201/0129 ,  H05K2201/09036 ,  H05K2203/0108 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/249994 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a multilayer wiring board with a built-in semiconductor device and the manufacturing method of the same, provided with a high resistance with respect to heat, capable of effecting low-temperature fusion welding without causing resin flow, capable of highly accurate and precise conductor wiring, capable of realizing turning high in density and super-miniaturized three-dimensional mounting module or the like and, further, applied optimally to the manufacturing form of small amount and many kinds while being reduced in a load in an environment. SOLUTION: In the multilayer wiring board with built-in semiconductor device, the wiring boards 1-8, into which the conductor wirings 14, 15 are embedded in a state that the surfaces of the wirings 14, 15 are exposed, are laminated on insulation substrates 11, consisting of a thermosetting resin composition having the principal constituent of polyaryl ketone resin having the crystalline melting peak temperature of 260°C or higher and amorphous polyether-imide resin. An IC chip 17 is mounted on the interconnection base boards 4, 6, while the wiring boards 1-8 are welded to each other through thermal adhesion. The wiring circuit of the wiring boards 1-8 and wirings in between respective wiring boards are constituted of a conductive material 15, constituted of a cured conductive paste. COPYRIGHT: (C)2004,JPO

Abstract translation: 要解决的问题：为了提供具有内置半导体器件的多层布线板及其制造方法，其具有相对于热量的高电阻，能够进行低温熔融而不引起树脂 能够实现高精度，高精度的导体布线，能够实现高密度化和超小型化三维安装模块等，并且进一步优选地应用于少量多种制造形式，同时减少 环境中的负载。 解决方案：在具有内置半导体器件的多层布线板中，以布线14,15的表面露出的状态嵌入导体布线14,15的布线板1-8 层叠在绝缘基板11上，由具有260℃以上的结晶熔融峰温度的聚芳基酮树脂的主要成分的热固性树脂组合物和无定形聚醚酰亚胺树脂组成。 IC芯片17安装在互连基板4,6上，同时通过热粘合将布线板1-8彼此焊接。 布线板1-8的布线电路和布线板之间的布线由导电材料15构成，导电材料15由固化的导电膏构成。 版权所有（C）2004，JPO

公开(公告)号：JP2001230528A

公开(公告)日：2001-08-24

申请号：JP2000036630

申请日：2000-02-15

Applicant: SONY CORP

Inventor： ITO SHIGEYASU

IPC: H05K3/32

Abstract: PROBLEM TO BE SOLVED: To uniformly mount semiconductor elements on a printed circuit board and to forma fillet in batch, even if the dispersion of thickness exists between the semiconductor elements. SOLUTION: IC chips 14 are mounted on the land of a substrate 11. When the IC chips 14 are mounted resin 13 which is a bonding member is supplied to a mounting area and the IC chips 14 are mounted on the substrate 11 in a state, where metal bumps being the bonding parts of the IC chips 14 are turned to the side of the substrate 11. Diaphragms 15 of elastic members are fitted to the side of the substrate 11 of an upper die 18. The upper die 18 is lowered, and the IC chips 14 are pressurized by the diaphragms 15. Thus, the diaphragms 15 are deformed along the shapes of the substrate 11 and the IC chips 14, and the substrate 11 and the IC chips 14 are pressurized uniformly as a whole.

公开(公告)号：JP2000332155A

公开(公告)日：2000-11-30

申请号：JP2000039780

申请日：2000-02-14

Applicant: SONY CORP

Inventor： ITO SHIGEYASU

IPC: H01L23/12 ,  H01L23/29 ,  H01L23/31

Abstract: PROBLEM TO BE SOLVED: To provide an efficient manufacturing method of a semiconductor device and to realize a thin and high density semiconductor chip. SOLUTION: The semiconductor device comprises a substrate 11, a semiconductor chip 12 formed with an integrated circuit and having one end face bonded with the substrate 11 and the other end face 12b provided with an electrode part 12c connected electrically and externally, a sealing layer 13 formed on the side face and the other end face 12b of the semiconductor chip 12 and having an opening 18 at the part where the electrode part 12c of the semiconductor chip 12 is formed, and a wiring layer 14 formed on the opening 18 and the sealing layer 13 in order to be connected electrically with the electrode part 12c of the semiconductor chip 12.

公开(公告)号：JPH09162241A

公开(公告)日：1997-06-20

申请号：JP34448795

申请日：1995-12-05

Applicant: SONY CORP

Inventor： KOSUGE KATSUYA ,  ITO SHIGEYASU

IPC: H01L21/60 ,  H01L23/12 ,  H05K1/11 ,  H05K3/30 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To facilitate positioning an electronic device and ensure reliable connections of bump electrodes by providing reinforcing bumps for maintaining electrical connections between the bump electrodes and wiring on a circuit board. SOLUTION: An electronic device 20 having bump electrodes 11 for connection to wiring on the circuit board is provided with reinforcement bumps 40 for maintaining the connections between the bump electrodes and the wiring on the board. For example, four reinforcement bumps 40 (reinforcement lands) are provided at four corners of the reverse side 21 of the electronic device in such a manner that they are outside a predetermined arrangement of a large number of bump electrodes 11. The reinforcement bumps 4 and bump electrodes 11 are both made of solder and spherical or semispherical. The diameter 11 of the reinforcement bumps is greater than the diameter 12 of the bump electrodes so that users can definitely discriminate them.

公开(公告)号：JP2005353420A

公开(公告)日：2005-12-22

申请号：JP2004173018

申请日：2004-06-10

Applicant: Mitsubishi Plastics Ind Ltd ,  Sony Corp ,  ソニー株式会社 ,  三菱樹脂株式会社

Inventor： ITO SHIGEYASU ,  OGAWA MINORU ,  OTANI MOTOHIKO ,  YAMADA SHINGETSU ,  SUZUKI TAKANOBU ,  KUROSAKI NORIAKI

IPC: H05K1/09 ,  H01B1/20 ,  H01B5/14 ,  H05K3/10 ,  H05K3/12 ,  H05K3/40

Abstract: PROBLEM TO BE SOLVED: To provide a conductive material filled flatly in a through-hole even with thermosetting treatment by filling it once in a substrate.
SOLUTION: The conductive material, containing at least thermosetting binder resin and a conductive filler, gets solid state at room temperature by being heated beforehand at a temperature in which hardening reaction does advance to let a substantial volume of solvent evaporated, and is softened as the binder resin is heated up to a temperature lower than a hardening reaction starting temperature.
COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：即使通过在基板中填充一次而通过热固化处理来提供平坦地填充在通孔中的导电材料。

解决方案：至少含有热固性粘合剂树脂和导电填料的导电材料在室温下通过预先加热固化反应的温度，使大量溶剂蒸发而得到固态，并且 随着粘合剂树脂被加热到低于硬化反应开始温度的温度而软化。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2005197344A

公开(公告)日：2005-07-21

申请号：JP2004000311

申请日：2004-01-05

Applicant: Sony Corp ,  ソニー株式会社

Inventor： ITO SHIGEYASU

IPC: H01R12/06 ,  H05K1/11 ,  H05K3/40 ,  H05K3/46 ,  H01R12/16

Abstract: PROBLEM TO BE SOLVED: To provide print-circuit boards being miniaturized or thinned and easily attaching and detaching terminals of two boards, and to provide a manufacturing method for the print-circuit boards. SOLUTION: The printed-circuit board 1 has laminated boards formed by laminating boards 3, 4, 5, 6 and 7 having wirings in layers. The printed-circuit board 1 further has a housing 2 having an opening 2a while having a terminal group for the electrical external connections of the wirings through the opening 2a and being formed by a holding by two layers of the boards 4 and 6, together with the boards 5 and 5 held by two layers of the boards 4 and 6 in the laminated boards so that the opening 2a is exposed to the outside. Accordingly, when the opening 2a and the shapes and sizes or the like of terminals for external boards are set previously, the terminals for the external boards are fitted easily only by inserting the terminals into the opening section 2a. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：为了提供小型化或薄型化的打印电路板，并且容易地安装和拆卸两个板的端子，并且为印刷电路板提供制造方法。 解决方案：印刷电路板1具有通过层叠具有布线的板3,4,5,6和7形成的层压板。 印刷电路板1还具有开口2a的壳体2，同时具有用于通过开口2a的布线的电外部连接的端子组，并且通过两层板4和6的保持形成，以及 板5和5由层叠板中的两层板4和6保持，使得开口2a暴露于外部。 因此，当预先设定开口2a以及用于外部板的端子的形状和尺寸等时，仅通过将端子插入开口部2a来容易地安装用于外部板的端子。 版权所有（C）2005，JPO＆NCIPI