Abstract:
PROBLEM TO BE SOLVED: To provide a magnetic recording and reproducing device which surely suppresses the occurrence of seizing material without causing any gradation of characteristics by wear. SOLUTION: In this helical scanning type magnetic recording and reproducing device equipped with a magnetoresistance effect reproducing head or induction thin film magnetic head, a magnetic recording medium or a cleaning tape holding a seizing inhibitor is travelled. The seizing inhibitor contains a compound having a pyridine skeleton and two or more coordination positions. The compound having a pyridine structure and two or more coordination positions has excellent complex-forming ability with metal atoms so that metal oxides produced on the surface of the head 6a, 6b are changed into complex salts, which easily drop off from the surface of the head 6a, 6b and do not remain on the head surface. COPYRIGHT: (C)2000,JPO
Abstract:
PROBLEM TO BE SOLVED: To enable insulating film to be stabilized for a long term without causing a void by laminating insulating films made of an organic material on the surface of silicon oxide films after feeding silane coupling agent. SOLUTION: Firstly, the first silicon oxide film 2 is formed on a silicon substrate 1 and after the formation of a wiring pattern 3, the second silicon oxide film 4 is formed. Next, a wafer is spin coated with carbon tetrachloride melted with one wt.% of silane coupling agent. Thus, silane coupling agent is chemically coupled with hydroxyl group on the silicon oxide film surface. Next, an organic insulating film 5 made of amorphous teflon is formed. Later, the third silicon oxide film 6 is formed. In such a constitution, the laminated layer films made of the second silicon oxide film 4, the organic insulating film 5 and the third silicon oxide film 6 are formed into an interlayer insulating film at low dielectric constant due to the existance of the organic insulating film 5.
Abstract:
PURPOSE:To relieve the restriction on the recording material to be used for a recording layer by laminating the recording layer which contains a thermally decomposing material and a metallic layer which absorbs a laser beam to some extent on a substrate. CONSTITUTION:The metallic layer 3 to be provided on the recording layer 2 has the reflectivity which is high to some extent; in addition, the layer is required to make photo-thermal conversion by partly absorbing the laser beam; therefore, this layer is required to have some absorption to the laser beam. The reflectivity in the laser wavelength of the metallic layer 3 is consequently required to be >=70% and
Abstract:
PURPOSE:To greatly enhance the sensitivity by forming a dye layer containing a dye and a polymer and having a specific film thickness on a substrate and specifying the ratio of the polymer contained in the dye layer and the absolute of the temp. gradient of the surface tension of the polymer. CONSTITUTION:A dye layer containing a dye and a polymer and having a film thickness of 1400Angstrom or more is formed on a substrate and the ratio of the polymer contained in the dye layer is 20-50% on a wt. basis and the absolute value of the temp. gradient of the surface tension of the polymer is 0.07dyne/ cm.K or more. Herein, as the org. dye material contained in the dye layer, concretely, a cyanine dye, a metal complex dye, a phthalocyanine dye, a naphthalocyanine dye or the like are designated. As the polymer to be added, the temp. gradient of the surface tension thereof is important and a polymer wherein the absolute value thereof is 0.07dyne/cm.K or more is selectively used. That is, by using the polymer high in the absolute value of the temp. gradient of surface tension as a binder, moving force becomes large and the sensitivity of an optical recording medium is estimated to be enhanced.
Abstract:
PURPOSE:To form an org. dye layer and a polymer layer at the same time and to enable wide selection of materials by coating a substrate with a coating material prepared by dissolving the org. dye and the polymer which are insoluble to each other into one solvent. CONSTITUTION:On a transparent substrate 1 in which guide grooves are formed as required, the org. dye layer 2 which absorbs semiconductor laser light to effect photothermal conversion, the polymer layer 3 to protect the dye layer 2 are successively laminated. The org. solvent used for preparation of the coating material is properly selected from org. solvents used in the field of optical recording and from those compounds that have enough solubility to both of the org. dye and the polymer and give no damage on the substrate. As for the org. dye, those used in the filed of optical recording can be used, but it is required that the dye is insoluble with the polymer. Thereby, the uniform org. dye layer is formed without damaging the substrate, which improves the reliability of the medium.
Abstract:
PROBLEM TO BE SOLVED: To provide a chemical sensor, a chemical sensor module, a biomolecule detection device, and a biomolecule detection method that enable biomolecules to be detected with high precision.SOLUTION: A chemical sensor of the present invention comprises a substrate, an on-chip lens, and a planarization layer. The substrate has a plurality of photodiodes formed thereon and arranged in a flat shape. The on-chip lens is provided on the substrate and condenses incident light on the photodiodes. The planarization layer covers and planarizes the on-chip lens and forms a probe support surface for supporting a probe material.
Abstract:
PROBLEM TO BE SOLVED: To provide a method for forming a multi-resist pattern comprising a positive chemically amplified resist, and to provide a processing method of a functional material layer using the multi-resist pattern, and a multi-resist pattern structure.SOLUTION: A first resist pattern 4 is formed, comprising a positive chemically amplified resist containing a photo-acid generator and a resin component showing changes in solubility by an action of an acid. The surface of the pattern is coated with an aqueous solution 6 of a modification material containing a crosslinking agent that permeates into the pattern and can carry out crosslink with the resist resin component by an action of an acid, and a permeation promoter that promotes the permeation of the crosslinking agent. The first resist pattern 4 where the crosslinking agent permeates is irradiated with UV light to generate an acid, and is heated to react the resin component with the crosslinking agent so as to form a cured layer 9 in at least the surface layer portion 7. A second resist layer 11 is formed so as to fill a space between the first resist patterns, being selectively exposed to light and developed to form a second resist pattern 12.
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a resist material for improving transmittance for light of a resist layer in a wavelength region of extreme UV rays, and to provide a resist material and an exposure method. SOLUTION: Silicon atoms are incorporated into a resist material to obtain a line absorption coefficient of 1.7433 μm -1 or less in an extreme UV wavelength region. The proportion (ϕ Si ) of silicon atom content in the polymer material and the density ρ of the polymer material are determined to satisfy formula (1). COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an antireflection film capable of sufficiently reducing reflectance at an interface between a resist layer and a silicon semiconductor substrate even when exposure light is made incident obliquely by one layer in a liquid immersion lithography technique. SOLUTION: The bi-layer structure antireflection film is used when a resist layer is exposed by means of an exposure system which has a wavelength of 190 to 195 nm and has a numerical aperture of ≤1.0, and is formed between the resist layer and the surface of the silicon semiconductor substrate. When complex refractive indexes N 1 , N 2 of upper layer and lower layer constituting the antireflection film are expressed by the expressions; N 1 =n 1 -k 1 i, N 2 =n 2 -k 2 i, film thicknesses of the upper layer and lower layer are d 1 , d 2 and a prescribed combination is selected as the combination of values [n 10 , k 10 , d 10 , n 20 , k 20 , d 20 ], n 1 , k 1 , d 1 , n 2 , k 2 , d 2 satisfy the following relation; ä(n 1 -n 10 )/(n 1m -n 10 )} 2 +ä(k 1 -k 10 )/(k 1m -k 10 )} 2 +ä(d 1 -d 10 )/(d 1m -d 10 )} 2 +ä(n 2 -n 20 )/(n 2m -n 20 )} 2 +ä(k 2 -k 20 )/(k 2m -k 20 )} 2 +ä(d 2 -d 20 )/(d 2m -d 20 )} 2 ≤1. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To enable an ultra-microfabrication exceeding the conventional techniques by using a polymeric material having low absorption in the wavelength region of vacuum ultraviolet radiation (VUV). SOLUTION: In an exposure method in which a resist layer is selectively exposed with UV and patterned in a prescribed shape, a polymeric material having an introduced adamantane group in which two or more hydrogen atoms have been replaced with at least one selected from a fluorine atom, a trifluoromethyl group and a difluoromethylene group is used as a polymeric material forming the resist layer. COPYRIGHT: (C)2003,JPO