Abstract:
A triangular pyramidal semiconductor structure which precisely splits light is provided by preventing an unnecessary crystal plane from growing on the boundary of side surface crystal planes of the triangular pyramidal semiconductor structure. The triangular pyramidal semiconductor structure is formed of either one of a {111} A crystal plane and a {111} B crystal plane and two {110} crystal planes.
Abstract:
A triangular pyramidal semiconductor structure which precisely splits light is provided by preventing an unnecessary crystal plane from growing on the boundary of side surface crystal planes of the triangular pyramidal semiconductor structure. The triangular pyramidal semiconductor structure is formed of either one of a {111} A crystal plane and a {111} B crystal plane and two {110} crystal planes.
Abstract:
PROBLEM TO BE SOLVED: To provide a light emitting element in which the nonradiative recombination at the end surface of an active layer is suppressed and its light emission efficiency is improved, and a method of manufacturing the light emitting element.SOLUTION: A light emitting element includes: a laminated body including a first conductive semiconductor layer, the active layer, and a second conductive semiconductor layer in this order, the second conductive semiconductor layer having a light extraction surface; and a recombination suppression structure provided at least in the vicinity of an end surface of the active layer, the recombination suppression structure having a bandgap larger than a bandgap of the active layer.
Abstract:
PROBLEM TO BE SOLVED: To provide a light-emitting diode with extremely high luminous efficiency, capable of being manufactured at low cost through a single processing of an epitaxial growth, and to provide a method of manufacturing the same. SOLUTION: A protrusion 12 is formed on one principal surface of a substrate 11, such as a sapphire substrate and the like, by means of a material different from that of the substrate 11. A nitride group III-V compound semiconductor layer 15 is grown up in a recess 13 having an invesely trapezoidal shape at both sides of the protrusion 12, in such structure as a pentagon-shaped sectional form by way of a triangular sectional form with the bottom of the recess 13 as the base of a triangle. Otherwise, the nitride group III-V compound semiconductor layer 15 is grown up in the lateral direction, after it is grown up to the triangular sectional shape with the bottom of the recess 13 as its base. The nitride group III-V compound semiconductor layer 15 with an active layer contained therein is grown up on the nitride group III-V compound semiconductor to constitute the structure of a light-emitting diode. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To easily peel off a substrate inexpensively without giving physical damage to a nitride-based III-V group compound semiconductor layer after the nitride-based III-V group compound semiconductor layer forming a light-emitting diode structure is grown on the substrate. SOLUTION: Projections 12 made of magnetostriction material are formed on one main surface of a substrate 11, and a nitride-based III-V group compound semiconductor layer 15 is grown on recessed parts 13 among the projections 12, which has first a triangular sectional shape with a bottom side as their bottom surfaces, and is further grown from the nitride-based III-V group compound semiconductor layer 15 in horizontal direction. The nitride-based III-V group compound semiconductor layer including an active layer 17 is grown on the nitride-based III-V group compound semiconductor layer 15 to form a light emitting diode structure. Then, magnetic field is applied to the projections 12 to generate magnetostriction, so as to peel off the nitride-based III-V group compound semiconductor layers from the substrate 11. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a surface emission semiconductor laser device which emits stable a laser beam by a unimodal lateral mode, and to provide a manufacturing method therefor. SOLUTION: The device includes a lower reflecting mirror 14 consisting of a semiconductor multilayer film, an active layer 18 and an upper reflecting mirror 22 consisting of a semiconductor multilayer film, in this order on a substrate 12. The device includes a compound semiconductor layer 24 extending to the upper reflecting mirror 22, provided with a first opening part 30 for exposing the upper reflecting mirror 22, and a metal film 36 extending on the compound semiconductor layer 24, provided with a second opening part 38 for exposing the upper reflecting mirror 22 inside of the first opening 30. The inside diameter of the first opening part 30 is set larger than that of the second opening part 38. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a surface emitting semiconductor laser in which reliability of an element is improved. SOLUTION: A lower DBR mirror layer 11 and an upper DBR mirror layer 15 each have a structure in which a plurality of combinations of high refractive index layer 11Ai (15Aj) and a low refractive index layer 11Bi (15Bj) are laminated. In each of the DBR mirror layers 11 and 15 of the plurality of layers 11Ai (15Aj), the impurity concentration of a layer near an active layer 13 is lower (first impurity concentration) than that of a layer other than the layer near the active layer 13. Also, of the plurality of layers 11Bi (15Bj), the impurity concentration of the layer near the active layer 13 is higher (second impurity concentration) than the first impurity concentration in the layers 11Ai (15Aj). COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a method of manufacturing a surface emitting semiconductor laser capable of lasing by a unimodal beam in a single lateral mode or the like easily and with a high yield. SOLUTION: In manufacturing the surface emitting semiconductor laser having a post mesa structure on an n-type semiconductor substrate 11, a mesa portion is formed. After forming the mesa portion to a p-side electrode 20 and an n-side electrode 23, voltage is applied between the p-side electrode 20 and the n-side electrode 23. While drawing out output light, the surface emitting semiconductor laser is exposed to a steam atmosphere to form an Al oxidation layer 21 on a p-type Al w Ga 1-w As layer 17b which is the most upper layer of a p-type DBR layer 17, and to form a refractive index distribution like that of a concave lens. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a compact and light weighted image displaying apparatus which reduces a burden of a user's eye in a wearable display. SOLUTION: The present invention relates to the image displaying apparatus 1 comprising: an optical fiber 2 which propagates laser light outputted from an external laser light source 11 into a body case 10; a signal cable 3 which propagates an image signal generated with an external image generating apparatus 12 into the body case 10; a modulation means 4 which is provided in the body case 10 and modulates the laser beam obtained by the propagation in the optical fiber 2 on the basis of the image signal obtained by the propagation in the signal cable 3; a scan mirror 5 which is provided in the body case 10 and scans the laser beam modulated with the modulation means 4; and a diffusing plate 6 which is provided in the body case 10 and diffuses the laser beam scanned with the scan mirror 5. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a compound semiconductor which has a base plate and a compound semiconductor layer formed on the base plate and has a lattice mismatch of 2% or higher between the base plate and the compound semiconductor layer, and which can reduce generation of crystalline defect or dislocation. SOLUTION: A first epitaxial growth step of forming a buffer layer 3 on a base plate and a second epitaxial growth step of forming a compound semiconductor layer 4 on the buffer layer 3 are carried out at a growth temperature of ≤600°C by an MOCVD (metal organic chemical vapor deposition) method. When the growth temperature is selected, compatibility among the reduction of crystalline defect in the compound semiconductor layer 4, the maintenance or improvement of a dissociation efficiency of a source material such as group V and III elements, and the prevention of reduction of a growth rate can be attained. COPYRIGHT: (C)2005,JPO&NCIPI