Optical reflectors for spectrometer gas cells

    公开(公告)号:AU2013359242A1

    公开(公告)日:2015-06-18

    申请号:AU2013359242

    申请日:2013-12-12

    Abstract: A spectrometer cell can include a spacer, at least one end cap, and at least one mirror with a reflective surface. The end cap can be positioned proximate to a first contact end of the spacer such that the end cap and spacer at least partially enclose an internal volume of the spectrometer cell. The mirror can be secured in place by a mechanical attachment that may include attachment materials that are chemically inert to at least one reactive gas compound, be thermally stable above at least 120 °C, and be capable of holding an optical axis of the reflective surface in a fixed orientation relative to other components of the spectrometer cell and or a spectrometer device that comprises the spectrometer cell. The mirror can optionally be constructed of a material such as stainless steel, copper, aluminum, alumino-silicate, ceramic, or the like. Related methods, articles of manufacture, systems, etc. are described.

    OPTICAL REFLECTORS FOR SPECTROMETER GAS CELLS

    公开(公告)号:CA2893089A1

    公开(公告)日:2014-06-19

    申请号:CA2893089

    申请日:2013-12-12

    Abstract: A spectrometer cell can include a spacer, at least one end cap, and at least one mirror with a reflective surface. The end cap can be positioned proximate to a first contact end of the spacer such that the end cap and spacer at least partially enclose an internal volume of the spectrometer cell. The mirror can be secured in place by a mechanical attachment that may include attachment materials that are chemically inert to at least one reactive gas compound, be thermally stable above at least 120 °C, and be capable of holding an optical axis of the reflective surface in a fixed orientation relative to other components of the spectrometer cell and or a spectrometer device that comprises the spectrometer cell. The mirror can optionally be constructed of a material such as stainless steel, copper, aluminum, alumino-silicate, ceramic, or the like. Related methods, articles of manufacture, systems, etc. are described.

    SOLDERLESS MOUNTING FOR SEMICONDUCTOR LASERS

    公开(公告)号:CA2887911A1

    公开(公告)日:2014-05-01

    申请号:CA2887911

    申请日:2013-10-23

    Abstract: A first contact surface (310) of a semiconductor laser chip (302) can be formed to a first target surface roughness and a second contact surface (312) of a carrier mounting (304) can be formed to a second target surface roughness. A first bond preparation layer (306) comprising a first metal can optionally be applied to the formed first contact surface, and a second bond preparation layer (308) comprising a second metal can optionally be applied to the formed second contact surface. Both preparation layers may be made of gold and diffusion bonding results from a heating of device under pressure. The first contact surface can be contacted with the second contact surface, and a solderless securing process can secure the semiconductor laser chip to the carrier mounting. Related systems, methods, articles of manufacture, and the like are also described.

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