公开(公告)号：WO2006121478A2

公开(公告)日：2006-11-16

申请号：PCT/US2006004676

申请日：2006-02-09

Applicant: STAKTEK GROUP LP ,  GOODWIN PAUL

Inventor： GOODWIN PAUL

IPC: H05K7/02

CPC classification number: H01L25/105 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00014 ,  H05K1/141 ,  H05K1/147 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/3436 ,  H05K3/363 ,  H05K2201/10734 ,  H05K2201/2009 ,  H05K2201/2018 ,  H05K2203/1572 ,  H05K2203/302 ,  H01L2224/0401

Abstract: In some embodiments, a high density circuit module is provided having a support frame supporting a flexible circuit. A main integrated circuit and one or more supporting integrated circuit are mounted to the flexible circuit. Electrical connections between the main integrated circuit and the one or more integrated circuits are made on the flexible circuit. In other embodiments, a main integrated circuit such as, for example, a network processor, is mounted to a flexible circuit. Supporting integrated circuits, such as, for example, memory devices used by the network processor, are mounted on side portions of the flexible circuit. The side portions are folded to place the supporting integrated circuits higher than the main integrated circuit. Such placement may direct cooling airflow over the main integrated circuit's heat sink.

Abstract translation: 在一些实施例中，提供了具有支撑柔性电路的支撑框架的高密度电路模块。 主要集成电路和一个或多个支持集成电路安装到柔性电路。 主集成电路和一个或多个集成电路之间的电连接在柔性电路上制成。 在其他实施例中，诸如网络处理器的主要集成电路安装到柔性电路。 支持集成电路，例如网络处理器使用的存储器件，安装在柔性电路的侧部上。 侧面部分被折叠以使支撑集成电路比主集成电路高。 这种放置可以引导主集成电路的散热器上的冷却气流。