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公开(公告)号:US20240105764A1
公开(公告)日:2024-03-28
申请号:US18168068
申请日:2023-02-13
Applicant: Samsung Electronics Co., Ltd.
Inventor: Changsoo LEE , Jinhong Kim , Yong-Hee Cho , Cheheung Kim , Jooho Lee
IPC: H10B12/00
Abstract: A capacitor includes a lower electrode, an upper electrode disposed to face the lower electrode, and a dielectric layer between the lower electrode and the upper electrode. The lower electrode includes a first lower electrode layer apart from the dielectric layer and a second lower electrode layer between the first lower electrode layer and the dielectric layer. The second lower electrode layer includes vanadium oxide.
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22.
公开(公告)号:US20230402231A1
公开(公告)日:2023-12-14
申请号:US18312827
申请日:2023-05-05
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jinhong Kim , Changsoo Lee , Cheheung Kim , Jooho Lee , Yong-Hee Cho
CPC classification number: H01G4/33 , H01G4/008 , H01G4/10 , H10B12/31 , H10B12/033 , G11C11/401
Abstract: A capacitor including a first thin-film electrode layer, a second thin-film electrode layer, a dielectric layer between the first and second thin-film electrode layers, and a first interlayer between the first thin-film electrode layer and the dielectric layer and/or between the second thin-film electrode layer and the dielectric layer may be provided. The first interlayer includes first metal oxide, at least one of the first and second thin-film electrode layers includes second metal having a conductive rutile crystal structure, the second metal oxide includes non-noble metal, the dielectric layer includes third metal oxide having a dielectric rutile crystal structure, and the first metal oxide, the second metal oxide, and third metal oxide have different compositions from each other, the first metal oxide includes GeO2, the third metal oxide includes TiO2, and a thickness of the first interlayer is smaller than that of the dielectric layer.
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公开(公告)号:US11785851B2
公开(公告)日:2023-10-10
申请号:US16749357
申请日:2020-01-22
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jinhong Kim , Seyun Kim
IPC: H10N10/855 , H10N10/17 , C01B32/914
CPC classification number: H10N10/855 , C01B32/914 , H10N10/17
Abstract: A thermoelectric composite includes: a first layer including a thermoelectric semiconductor material; and a second layer including a conductive inorganic filler, wherein the first and second layers are stacked in layered form constituting a superlattice structure.
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24.
公开(公告)号:US11444229B2
公开(公告)日:2022-09-13
申请号:US16428208
申请日:2019-05-31
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Se Yun Kim , Jinhong Kim , Hyun Sik Kim , Chang Soo Lee
Abstract: A thermoelectric material including a thermoelectric element including thermoelectric inorganic material represented by Chemical Formula 1; and a conduction path in contact with a surface of the thermoelectric element, wherein the conduction path is formed of a conductive material having electrical conductivity of greater than or equal to about 1,000 Siemens per centimeter BixSb(2-x)Te(3-y-z)SeySz Chemical Formula 1 wherein 0
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公开(公告)号:US10779362B2
公开(公告)日:2020-09-15
申请号:US15836002
申请日:2017-12-08
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hiesang Sohn , Seyun Kim , Haengdeog Koh , Doyoon Kim , Soichiro Mizusaki , Jinhong Kim , Hajin Kim , Minjong Bae , Changsoo Lee
IPC: H05B1/02 , H05B3/14 , B29C70/88 , C03C14/00 , B29C70/02 , C03C4/14 , C03C17/00 , C03C8/16 , C03C8/14 , H05B3/26
Abstract: A heating element includes a plurality of matrix particles and a conductive inorganic filler disposed at interfaces between the plurality of matrix particles to provide a conductive network.
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公开(公告)号:US20200287116A1
公开(公告)日:2020-09-10
申请号:US16749357
申请日:2020-01-22
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jinhong Kim , Seyun Kim
IPC: H01L35/22 , H01L35/32 , C01B32/914
Abstract: A thermoelectric composite includes: a first layer including a thermoelectric semiconductor material; and a second layer including a conductive inorganic filler, wherein the first and second layers are stacked in layered form constituting a superlattice structure.
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公开(公告)号:US20180163971A1
公开(公告)日:2018-06-14
申请号:US15833519
申请日:2017-12-06
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Soichiro MIZUSAKI , Haengdeog Koh , Doyoon Kim , Seyun Kim , Jinhong Kim , Hajin Kim , Minjong Bae , Hiesang Sohn , Changsoo Lee
CPC classification number: F24C7/081 , F24C7/043 , F24C7/062 , F24C7/067 , H05B3/141 , H05B3/145 , H05B6/6482
Abstract: An electric oven includes a top plate and a bottom plate facing each other, two side plates facing each other, and a rear plate connecting the top plate, the bottom plate and the two side plates where the top plate, the bottom plate, the two side plates and the rear plate define a cavity having a front opening, a door which selectively opens and closes the front opening of the cavity, a casing which surrounds the cavity, a support member interposed between the casing and the cavity, and one or more planar heating elements which extend along one plane, are detachably supported by the support member, and apply radiant heat to the cavity.
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公开(公告)号:US20180160479A1
公开(公告)日:2018-06-07
申请号:US15830213
申请日:2017-12-04
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jinhong Kim , Changsoo Lee , Doyoon Kim , Haengdeog Koh , Seyun Kim , Hajin Kim , Soichiro MIZUSAKI , Minjong Bae , Hiesang Sohn
Abstract: A sheet heater includes a substrate; a first and second finger electrode each on the substrate to lengthwise extend in a first direction and be spaced apart from each other in a second direction; and a heating layer on the substrate to have a stripe shape lengthwise extended in the second direction to cross each of the first and second finger electrodes. The first finger electrode or the second finger electrode crossed by the heating layer is a pattern electrode in which an opening is defined, for the pattern electrode in which the opening is defined, an opening ratio is defined by a total planar area of the opening to a total planar area of the pattern electrode, and the opening ratio is in a range from about 40% to about 80%.
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公开(公告)号:US20180063890A1
公开(公告)日:2018-03-01
申请号:US15468451
申请日:2017-03-24
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Doyoon Kim , Haengdeog Koh , Seyun Kim , Jinhong Kim , Hajin Kim , Soichiro Mizusaki , Minjong Bae , Hiesang Sohn , Changsoo Lee
CPC classification number: H05B3/34 , H05B3/141 , H05B3/145 , H05B3/26 , H05B2203/011 , H05B2203/017 , H05B2214/04
Abstract: A planar heating device includes a substrate, first and second electrodes disposed on both ends of the substrate, a heating layer disposed on the substrate and configured to contact the first and second electrodes, a first additional heating layer disposed on one end of the heating layer, and a second additional heating layer disposed on the other end of the heating layer.
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公开(公告)号:US12034679B2
公开(公告)日:2024-07-09
申请号:US18105376
申请日:2023-02-03
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Eunsang Jeon , Jieun Kim , Jinhong Kim , Yeseul Park , Seokjae Oh , Bongsung Yu , Byoungho Yun , Seunghoon Lee , Yuseong Jeon , Sejun Han
IPC: H04L51/04 , H04L67/146
CPC classification number: H04L51/04 , H04L67/146
Abstract: An example method of operating a display apparatus includes obtaining display apparatus state information indicating data processing performance of the display apparatus, transmitting the display apparatus state information to a server that provides a chat service, receiving chat messages transmitted from the server according to a message throughput determined based on the display apparatus state information, and outputting the received chat messages.
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