公开(公告)号：EP4391228A1

公开(公告)日：2024-06-26

申请号：EP22883883.5

申请日：2022-10-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： PARK, Sanghoon ,  PARK, Jungho ,  BAEK, Kwanghyun ,  LEE, Youngju ,  LEE, Jungyub ,  LEE, Juneseok ,  HA, Dohyuk ,  HEO, Jinsu

IPC: H01Q1/38 ,  H01Q1/24 ,  H01Q1/02

CPC classification number: H01Q21/28 ,  H01Q21/065 ,  H01Q1/246 ,  H01Q9/0414 ,  H01Q9/0457

Abstract: An antenna assembly is provided. The antenna assembly includes a first flexible printed circuit board (FPCB) for multiple first antennas, a second flexible printed circuit board (FPCB) for multiple second antennas, a metal plate including multiple holes, a first adhesive material layer for bonding between the metal plate and the first FPCB, and a second adhesive material layer for bonding between the metal plate and the second FPCB, wherein the metal plate is disposed such that the multiple first antennas are located in the multiple holes, respectively and the multiple second antennas to be located in the multiple holes, respectively.

公开(公告)号：EP4246720A1

公开(公告)日：2023-09-20

申请号：EP22752988.0

申请日：2022-02-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： LEE, Juneseok ,  KIM, Youngsub ,  PARK, Sanghoon ,  PARK, Jungho ,  BAEK, Kwanghyun ,  LEE, Youngju ,  LEE, Jungyub ,  HA, Dohyuk ,  HEO, Jinsu

IPC: H01Q1/38 ,  H01Q1/24 ,  H01Q1/22

Abstract: The present disclosure relates to a pre-5th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4th-Generation (4G) communication system such as Long Term Evolution (LTE). According to various embodiments of the present disclosure, an antenna device may include a first printed circuit board (PCB), a second PCB for a plurality of antenna elements, and a radio frequency integrated circuit (RFIC) coupled through a first surface of the first PCB. The second PCB may include an RF routing layer including RF lines for the respective plurality of antenna elements. The first PCB may include a feeding structure for connecting the RF routing layer and the RFIC. The second PCB may be electrically connected to a second surface of the first PCB opposite to the first surface of the first PCB, through a first surface of the second PCB. The second PCB may be coupled to the plurality of antenna elements through a second surface of the second PCB opposite the first surface of the second PCB.

公开(公告)号：EP4049437A1

公开(公告)日：2022-08-31

申请号：EP20905614.2

申请日：2020-11-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： PARK, Sanghoon ,  LEE, Juneseok ,  HA, Dohyuk ,  LEE, Jungyub ,  HEO, Jinsu ,  LEE, Youngju

IPC: H04M1/02

公开(公告)号：EP4033608A1

公开(公告)日：2022-07-27

申请号：EP20876541.2

申请日：2020-10-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： HA, Dohyuk ,  BAEK, Kwanghyun ,  LEE, Juneseok ,  HEO, Jinsu ,  LEE, Youngju ,  LEE, Jungyub

IPC: H01Q21/06 ,  H01Q1/46 ,  H01Q1/02 ,  H01Q1/24 ,  H04B1/40

Abstract: The present disclosure relates to a 5 th generation (5G) or pre-5G communication system for supporting higher data transmission rates than a 4 th generation (4G) communication system such as long-term evolution (LTE). An antenna module in a wireless communication system includes: a printed circuit board (PCB); a radio frequency integrated circuit (RFIC); and a plurality of antenna elements for emitting a radio frequency (RF) signal, wherein the plurality of antenna elements may be disposed in a first area of a first surface of the PCB, and the RFIC may be disposed in a second area, different from the first area, of the first surface of the PCB.

公开(公告)号：EP3605728A1

公开(公告)日：2020-02-05

申请号：EP18791998.0

申请日：2018-04-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： KIM, Hyunjin ,  KIM, Byungchul ,  PARK, Jungmin ,  BAEK, Kwanghyun ,  LEE, Youngju ,  LEE, Jungyub ,  PARK, Sungchul

IPC: H01Q1/38 ,  H01Q1/24 ,  H05K1/05 ,  H05K1/11

Abstract: Disclosed is an electronic device having a space formed between front and rear surfaces thereof, the electronic device comprising: a first cover arranged on the front surface; a second cover arranged on the rear surface; a frame surrounding the first cover and the second cover; and a multilayered circuit board coupled to the second cover so as to constitute the housing of the electronic device, wherein the multilayered circuit board may comprises an insulated metal layer having a surface coupled to the second cover and a substrate-structured antenna device having a surface coupled to the insulated metal layer.

公开(公告)号：EP3525284A1

公开(公告)日：2019-08-14

申请号：EP17874039.5

申请日：2017-11-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： HA, Dohyuk ,  KUM, Junsig ,  LEE, Jungyub ,  LEE, Youngju

IPC: H01Q1/24 ,  H01Q21/00 ,  H01Q1/40 ,  H04M1/02

Abstract: An antenna device can include: an antenna substrate, on which an array antenna including at least one radiation element is arranged; and a cover spaced apart from the antenna substrate at at least a predetermined distance and further including at least one relay radiation element arranged to correspond to the at least one radiation element.