HUMIDIFIER
    22.
    发明申请

    公开(公告)号:US20210140656A1

    公开(公告)日:2021-05-13

    申请号:US17090011

    申请日:2020-11-05

    Abstract: A humidifier includes a storage water tank configured to accommodate a predetermined amount of water; a circulation water tank having a smaller capacity than the storage water tank and including a circulation low water level sensor; a supply pump configured to supply water from the storage water tank to the circulation water tank; a circulation pump configured to supply water from the circulation water tank to a humidifying member; a residual water tank configured to accommodate water discharged from the circulation water tank; a drainage member disposed between the circulation water tank and the residual water tank selectively to discharge water from the circulation water tank to the residual water tank and a processor configured to control the drainage member to discharge water from the circulation water tank to the residual water tank when a low water level signal is received from the circulation low water level sensor.

    APPARATUS AND METHOD OF MANUFACTURING SOLDER BUMP

    公开(公告)号:US20210074560A1

    公开(公告)日:2021-03-11

    申请号:US17012624

    申请日:2020-09-04

    Abstract: An apparatus for forming a solder bump on a substrate including a supporter configured to support the substrate to be provided thereon, a housing surrounding the supporter, a cover defining a manufacturing space in combination with the housing and including an edge heating zone along a perimeter thereof, the manufacturing space surrounding the supporter, and an oxide remover supply nozzle configured to supply an oxide remover to the manufacturing space may be provided.

    I/Q MISMATCH COMPENSATION METHOD AND APPARATUS
    24.
    发明申请
    I/Q MISMATCH COMPENSATION METHOD AND APPARATUS 有权
    I / Q MISMATCH补偿方法和装置

    公开(公告)号:US20150195050A1

    公开(公告)日:2015-07-09

    申请号:US14589584

    申请日:2015-01-05

    Abstract: An In-phase/Quadrature phase (I/Q) mismatch compensation method of a transceiver is provided. The method includes establishing a first loopback path between a transmitter and a receiver, transmitting a training sequence from the transmitter to the receiver through the established first loopback path, acquiring, at the receiver, a first correlation result value by correlating the training sequence received through the established first loopback path, establishing a second loopback path between the transmitter and the receiver, transmitting the training sequence from the transmitter to the receiver through the established second loopback path, acquiring, at the receiver, a second correlation result value by correlating the training sequence received through the second loopback path, and estimating I/Q mismatch values of the transmitter and the receiver using the first and second correlation result values.

    Abstract translation: 提供收发器的同相/正交相位(I / Q)失配补偿方法。 该方法包括建立发射机和接收机之间的第一环回路径,通过建立的第一环回路径将训练序列从发射机发射到接收机,在接收机处通过将接收到的训练序列相关联来获取第一相关结果值 建立的第一环回路径,在发射机和接收机之间建立第二环回路径,通过所建立的第二环回路径将训练序列从发射机发送到接收机,在接收机处通过将训练相关联来获取第二相关结果值 通过第二环回路径接收的序列,以及使用第一和第二相关结果值估计发射机和接收机的I / Q不匹配值。

    SEMICONDUCTOR DEVICES INCLUDING SUBSTRATE STRUCTURE

    公开(公告)号:US20250107190A1

    公开(公告)日:2025-03-27

    申请号:US18652010

    申请日:2024-05-01

    Abstract: A semiconductor device may include a first semiconductor structure including a first device layer on an upper surface of a first substrate structure, the first device layer including a first region of the semiconductor device; and a second semiconductor structure including a second device layer on a lower surface of a second substrate structure, the second device layer connected to the first device layer and including a second region of the semiconductor device. The first substrate structure may include a first wafer and a second wafer on the first wafer. The second wafer may be in contact with the first device layer. The second substrate structure may include a third wafer and a fourth wafer on a lower surface of the third wafer. The fourth wafer may be in contact with the second device layer. An upper surface of the second wafer may be a (100) crystal plane.

    HUMIDIFIER FOR PREVENTING POLLUTION OF HUMIDIFYING WATER

    公开(公告)号:US20230408118A1

    公开(公告)日:2023-12-21

    申请号:US18241568

    申请日:2023-09-01

    CPC classification number: F24F6/04 F24F11/0008 F24F11/30 F24F13/28 F24F2110/20

    Abstract: The humidifier includes a humidifying member, a storage water tank, a circulating water tank, a residual water tank, a supply pump configured to supply water accommodated in the storage water tank to the circulating water tank, a circulating pump configured to supply water accommodated in the circulating water tank to the humidifying member. A fan configured to blow air toward the humidifying member and thereby cause water evaporated to be discharged outside the humidifier, an internal pipe configured to form a flow passage through which water not evaporated by the humidifying member is recovered to the circulating water tank, a drainage member configured to selectively discharge water accommodated in the circulating water tank to the residual water tank, and a controller configured to operate the humidifier in humidity mode based on the water level in the storage water tank.

    ELECTRONIC APPARATUS AND POWER SUPPLY

    公开(公告)号:US20210194352A1

    公开(公告)日:2021-06-24

    申请号:US17126290

    申请日:2020-12-18

    Abstract: A power supply capable of protecting a rectifier circuit using a switching element from an overvoltage or an overcurrent is provided. The power supply includes a power input terminal; an output capacitor; a synchronous rectifier configured to rectify an AC voltage input through the power input terminal; a converter configured to convert the rectified AC voltage into a DC voltage following a preset voltage and supply the DC voltage to the output capacitor; and a protection circuit provided between the power input terminal and the output capacitor, and configured to supply an AC voltage higher than the voltage charged in the output capacitor to the output capacitor by bypassing the synchronous rectifier.

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