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公开(公告)号：US20210074560A1
公开(公告)日：2021-03-11
申请号：US17012624
申请日：2020-09-04
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sungyong YUN , Sanghoon LEE , Sungil LEE
Abstract: An apparatus for forming a solder bump on a substrate including a supporter configured to support the substrate to be provided thereon, a housing surrounding the supporter, a cover defining a manufacturing space in combination with the housing and including an edge heating zone along a perimeter thereof, the manufacturing space surrounding the supporter, and an oxide remover supply nozzle configured to supply an oxide remover to the manufacturing space may be provided.
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