Method for manufacturing ic medium, and the ic medium
    21.
    发明专利
    Method for manufacturing ic medium, and the ic medium 审中-公开
    制造IC介质的方法和IC介质

    公开(公告)号:JP2007316893A

    公开(公告)日:2007-12-06

    申请号:JP2006145018

    申请日:2006-05-25

    Inventor: SAKURAI TAKAHIRO

    Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing an IC medium, such as an IC card capable of freely transmitting/receiving data, an IC tag or a noncontact type IC module built in a mobile terminal, and to improve the flatness and quality of the IC medium. SOLUTION: An adhesive layer 13 that uses an adhesive which does not lose viscosity is formed on a first sheet 12, an IC module 14 smaller than the first sheet 12 is formed on the adhesive layer 13, an adhesive layer 15 that uses an adhesive capable of holding adhesive power by solidification is formed on the surfaces of the adhesive layer 13 and the IC module 14, and then a second sheet 16 is formed on the adhesive layer 15. COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题:提供一种制造IC介质的方法,诸如能够自由地发送/接收数据的IC卡,内置于移动终端中的IC标签或非接触型IC模块,并且改善 平坦度和质量的IC介质。 解决方案:在第一片12上形成使用不失去粘度的粘合剂的粘合层13,在粘合剂层13上形成比第一片12小的IC模块14,使用粘合剂层15 在粘合剂层13和IC模块14的表面上形成能够固化粘合力的粘合剂,然后在粘合层15上形成第二片16.权利要求(C)2008,JPO&INPIT

    Non-contact ic card and production method therefor
    22.
    发明专利
    Non-contact ic card and production method therefor 审中-公开
    非接触式IC卡及其生产方法

    公开(公告)号:JP2003058853A

    公开(公告)日:2003-02-28

    申请号:JP2001247794

    申请日:2001-08-17

    Inventor: SAKURAI TAKAHIRO

    CPC classification number: H01L2224/16225 H01L2924/16152

    Abstract: PROBLEM TO BE SOLVED: To further reduce possibility for an IC module to be destroyed or for the IC module and an antenna to be disconnected at a contact when external force is applied to a non-contact IC card in a folding direction or external force is applied to the IC module while being concentrated.
    SOLUTION: An IC module 11 packaged on a resin sheet 15 is covered with a resin 16 for sealing and further, a reinforcing member 13 which is formed in the shape of flange such that a portion to be in contact with the resin sheet 15 is in plane-contact to the resin sheet 15, a while being U-shaped for covering the resin 16 for sealing, is packaged on the resin sheet 15.
    COPYRIGHT: (C)2003,JPO

    Abstract translation: 要解决的问题:为了进一步降低IC模块被破坏的可能性,或者当外部力在折叠方向或外力施加到非接触式IC卡时,IC模块和天线在接触处被断开的可能性是 在集中时应用于IC模块。 解决方案:封装在树脂片15上的IC模块11被用于密封的树脂16覆盖,此外,形成为凸缘形状的加强构件13,使得与树脂片15接触的部分处于 与树脂片15平面接触,同时被覆盖用于密封的树脂16的U形被包装在树脂片15上。

    Recording medium and method for manufacturing the same
    23.
    发明专利
    Recording medium and method for manufacturing the same 审中-公开
    记录介质及其制造方法

    公开(公告)号:JP2003044819A

    公开(公告)日:2003-02-14

    申请号:JP2001231670

    申请日:2001-07-31

    Abstract: PROBLEM TO BE SOLVED: To utilize a space provided with antenna patterns also for other usages.
    SOLUTION: In the antenna patterns 12a and 12b provided to write and read information to/from a non-contact type IC card 10 in a non-contact state, image information 19 represented with a plurality of colors, such as a facial photograph is displayed by exposing a base material 15, cream color layers 21a and 21b and white color layers 22a and 22b by laser beams.
    COPYRIGHT: (C)2003,JPO

    Abstract translation: 要解决的问题:为了利用提供天线图案的空间也可以用于其他用途。 解决方案:在非接触状态下向非接触式IC卡10写入信息的天线方向图12a,12b中,显示有面部照片等多种颜色的图像信息19 通过用激光束曝光基材15,奶油色层21a和21b以及白色层22a和22b。

    CONTACTLESS IC TAG AND METHOD FOR USING CONTACTLESS IC TAG AND CONTACTLESS IC CARD HAVING CONTACTLESS IC TAG

    公开(公告)号:JP2002298117A

    公开(公告)日:2002-10-11

    申请号:JP2001101018

    申请日:2001-03-30

    Inventor: SAKURAI TAKAHIRO

    Abstract: PROBLEM TO BE SOLVED: To replacably adhere to an object on which antenna patterns having a predetermined area are formed without weakening adhesive property even when a number of replacement is large. SOLUTION: In this contactless IC tag having an IC chip 31 that can write and read information, conductive hook-and-loop fasteners 34a, 34b are fixed to each of the two antenna patterns 32a, 32b connected with the chip 31 in an electrically connected manner, and the contactless IC tag is fixed to the object whereon two conductive patterns having a predetermined interval with each other similarly as the antenna patterns 32a, 32b are formed using the hook-and-loop fasteners such that the antenna patterns 32a, 32b are electrically connected with the conductive patterns.

    Noncontact data transmission/reception object and heavy load detector using the same
    25.
    发明专利
    Noncontact data transmission/reception object and heavy load detector using the same 审中-公开
    非连接数据传输/接收对象和重负载检测器

    公开(公告)号:JP2011159212A

    公开(公告)日:2011-08-18

    申请号:JP2010022231

    申请日:2010-02-03

    Inventor: SAKURAI TAKAHIRO

    Abstract: PROBLEM TO BE SOLVED: To provide a noncontact data transmission/reception object which has two different radio wave directivities and is capable of changing directivity of an antenna in accordance with a using method, and a heavy load detector using the same. SOLUTION: A noncontact data transmission/reception object 10 includes a base material 14 folded with a boundary 13 between a first member 11 and a second member 12 as an origin, and an antenna 15 and an IC chip 16 electrically connected to each other. A spacing member 17 is disposed in the vicinity of the boundary 13, and a radiation element 15B constituting an antenna 15 and the IC chip 16 are provided on one surface 11a of the first member 11, and a waveguide element 15A constituting the antenna 15 and the radiation element 15C are provided on one surface 12a of the second member 12. When two members are put one over the other, the waveguide element 15A, the radiation element 15B, and a reflection element 15C are spaced from one another by a prescribed gap in a plane where the two members are put one over the other and are arranged in parallel in this order. COPYRIGHT: (C)2011,JPO&INPIT

    Abstract translation: 要解决的问题:提供一种具有两种不同的无线电波方向性并且能够根据使用方法改变天线的方向性的非接触式数据发送/接收对象以及使用该方法的重负载检测器。 解决方案:非接触数据发送/接收对象10包括以第一构件11和第二构件12为原点的边界13折叠的基材14,以及与每个状态电连接的天线15和IC芯片16 其他。 在边界13附近设置间隔部件17,在第一部件11的一个面11a上设置构成天线15的发光元件15B和IC芯片16,构成天线15的波导元件15A和 辐射元件15C设置在第二构件12的一个表面12a上。当两个构件彼此放置时,波导元件15A,辐射元件15B和反射元件15C彼此间隔规定的间隙 在两个构件相互放置的平面中,并排设置。 版权所有(C)2011,JPO&INPIT

    Antenna forming method
    26.
    发明专利
    Antenna forming method 审中-公开
    天线形成方法

    公开(公告)号:JP2009004852A

    公开(公告)日:2009-01-08

    申请号:JP2007161273

    申请日:2007-06-19

    Inventor: SAKURAI TAKAHIRO

    Abstract: PROBLEM TO BE SOLVED: To provide an antenna forming method for forming an antenna for RFID use inexpensively and safely without using a method complicated in process and high in manufacturing cost such as an etching technology or a winding coil forming technology. SOLUTION: This antenna forming method is characterized by forming a masking 4 for shielding an antenna pattern formed of a metal film 2, on the metal film 2 provided on a base material 1, and then chipping an exposed portion of the metal film 2 by blasting to form the antenna consisting of the metal film 2. COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题:提供一种天线形成方法,用于廉价且安全地形成用于RFID的天线的天线,而不需要使用复杂的工艺和制造成本高的方法,例如蚀刻技术或绕组线圈成形技术。 解决方案:该天线形成方法的特征在于,在设置在基材1上的金属膜2上形成用于屏蔽由金属膜2形成的天线图案的掩模4,然后将金属膜的暴露部分 2.通过喷砂形成由金属膜2组成的天线。版权所有(C)2009,JPO&INPIT

    Card with built-in module
    27.
    发明专利
    Card with built-in module 有权
    卡内置模块

    公开(公告)号:JP2008117273A

    公开(公告)日:2008-05-22

    申请号:JP2006301520

    申请日:2006-11-07

    Abstract: PROBLEM TO BE SOLVED: To provide an easy-to-manufacture card with built-in module that has a display element as an electronic part and exposes a display part of the display element to the outside. SOLUTION: The card 10 with built-in module comprises a module 13 having the display element 12, an adhesive layer 14 for covering the module 13, and a pair of first and second substrates 15 and 16 for sandwiching the module 13 via the adhesive layer 14. The display part 12a of the display element 12 is fixed to the first substrate 15 via a transparent adhesive layer 17. The first substrate 15 is transparent and the adhesive layer 14 is colored. COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题:提供具有内置模块的易于制造的卡,其具有作为电子部件的显示元件,并将显示元件的显示部分暴露于外部。 解决方案:具有内置模块的卡10包括具有显示元件12的模块13,用于覆盖模块13的粘合剂层14和用于将模块13夹持在一起的一对第一和第二基板15和16 粘合剂层14.显示元件12的显示部分12a通过透明粘合剂层17固定到第一基底15.第一基底15是透明的,粘合层14着色。 版权所有(C)2008,JPO&INPIT

    Meeting support system
    28.
    发明专利
    Meeting support system 有权
    会议支持系统

    公开(公告)号:JP2007208451A

    公开(公告)日:2007-08-16

    申请号:JP2006022861

    申请日:2006-01-31

    Abstract: PROBLEM TO BE SOLVED: To support smooth progress of meeting by the opinion of participants to the meeting. SOLUTION: A participant to a meeting specifies a designation number by a terminal 20-1 to 20-n for participants. When the number of the terminals 20-1 to 20-n for participants, specified by that designation number, satisfies the preset numerical conditions, a controller 20 displays a content indicating the opinion of a participant associated with that designation number on the terminals 20-1 to 20-n for participant or a monitor 10 for advancing the meeting. COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题:通过与会者的意见支持会议顺利进行。

    解决方案:会议的参与者由参与者指定终端20-1至20-n的指定号码。 当由该指定号码指定的参与者的终端20-1至20-n的数量满足预设的数值条件时,控制器20在终端20至20上显示指示与该指定号码相关联的与会者的意见的内容, 1至20-n用于参加者或监视器10用于推进会议。 版权所有(C)2007,JPO&INPIT

    Rf-id media and its manufacturing method
    29.
    发明专利

    公开(公告)号:JP2004094559A

    公开(公告)日:2004-03-25

    申请号:JP2002254272

    申请日:2002-08-30

    Inventor: SAKURAI TAKAHIRO

    Abstract: PROBLEM TO BE SOLVED: To provide an RF-ID media manufactured without using any highly precise device or expensive materials so as to be made easily suitable for mass production. SOLUTION: This RF-ID media is formed so that a conductive antenna 12 can be formed on a resin sheet 15, and that an inlet 10 electrically connected to an antenna 12, and configured by mounting an IC module 11 capable of writing and reading information from the outside through the antenna 12 can be interposed between core members 20a and 20b and over-sheets 30a and 30b. In this case, a reinforcing member 21 is formed in an area opposite to the IC module 11 of the core member 20a. COPYRIGHT: (C)2004,JPO

    METHOD FOR MANUFACTURING RF-ID MEDIA
    30.
    发明专利

    公开(公告)号:JP2003236937A

    公开(公告)日:2003-08-26

    申请号:JP2002036902

    申请日:2002-02-14

    Inventor: SAKURAI TAKAHIRO

    Abstract: PROBLEM TO BE SOLVED: To eliminate a step on the surface of an IR-ID media even when the size of an inlet of an individual piece shape is smaller than that of a layer for constituting the RF-ID media by allowing the deviation of the inlet from the layer to be suppressed when the inlet is adhered to the layer by using a thermal activation type adhesive. SOLUTION: A method for manufacturing the RF-ID media comprises the steps of sandwiching the inlet 10 of the individual piece shape to be sandwiched between surface sheets 130a and 130b via adhesive sheets 120a, 120b between the sheets 130a and 130b via the sheets 120a, 120b in a state in which an opening to be assembled with the inlet 10 is assembled in the opening of a frame sheet 140 formed with the opening, and fusing the sheets 120a, 120b in this state. COPYRIGHT: (C)2003,JPO

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