中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

44 records (took 0.033 seconds)

    IC CARD AND METHOD FOR MANUFACTURING THE SAME IC
    1.
    发明专利
    IC CARD AND METHOD FOR MANUFACTURING THE SAME IC 未知

    公开(公告)号：HK1131457A1

    公开(公告)日：2010-01-22

    申请号：HK09111142

    申请日：2009-11-27

    Applicant: TOPPAN FORMS CO LTD

    Inventor： SAKURAI TAKAHIRO ,  ITO YUICHI

    IPC: B42D20060101 ,  G06K20060101

    Abstract: This IC card is provided with a module having an inlet, an adhesive layer covering the module, and a first base material and second base material sandwiching the module with interposition of the adhesive layer. The module is disposed on one face of the first base material with interposition of a viscous layer which has a thickness that varies according to the thickness at each area of the module, and its two ends are narrower than its other parts when viewed from the outer face side of the first base material or the outer face side of the second base material. According to this IC card, it is possible to offer the IC card with a flat surface, and without occurrence of strain in the embedded IC chip.

    CARD HAVING MODULE HOUSED THEREIN, AND METHOD FOR MANUFACTURING CARD HAVING MODULE HOUSED THEREIN
    2.
    发明专利
    CARD HAVING MODULE HOUSED THEREIN, AND METHOD FOR MANUFACTURING CARD HAVING MODULE HOUSED THEREIN 未知

    公开(公告)号：HK1131836A1

    公开(公告)日：2010-02-05

    申请号：HK09110797

    申请日：2009-11-18

    Applicant: TOPPAN FORMS CO LTD

    Inventor： SAKURAI TAKAHIRO ,  ITO YUICHI

    IPC: B42D20060101 ,  G06K20060101

    Abstract: The window base material of the present invention is provided with an intermediate layer having a window section composed of transparent resin and a colored section composed of colored resin surrounding the window section, and a transparent first base material and second base material which sandwich the intermediate layer. The card with embedded module of the present invention is provided with a module having a display element, an adhesive layer covering the module, and a paired third base material and fourth base material which sandwich the module with interposition of the adhesive layer, wherein the third base material is composed of the window base material, and the display section of the display element is disposed so as to face the window section of the window base material. According to the present invention, a card with embedded module is offered, which incorporates a display element as an electronic component, which renders the display section of this display element visible from the outside, and which is easy to manufacture.

    Contactless data transmitter/receiver, and method of manufacturing the same
    5.
    发明专利
    Contactless data transmitter/receiver, and method of manufacturing the same 审中-公开
    无连续数据发送器/接收器及其制造方法

    公开(公告)号：JP2010231297A

    公开(公告)日：2010-10-14

    申请号：JP2009075470

    申请日：2009-03-26

    Applicant: Toppan Forms Co Ltd ,  トッパン・フォームズ株式会社

    Inventor： SAKURAI TAKAHIRO ,  ITO YUICHI

    IPC: G06K19/077 ,  B42D15/10 ,  G06K19/07

    Abstract: PROBLEM TO BE SOLVED: To provide a contactless data transmitter/receiver whose prescribed position is applied with emboss working without receiving any restriction to an antenna shape, and to provide a method of manufacturing the same. SOLUTION: The contactless data transmitter/receiver 10 is configured of: an inlet 11 having a base substrate 14, an antenna 15 formed on one face 14a of the base substrate 14 and an IC chip 16 connected to the antenna 15; and a coating member 12 coating the inlet 11, wherein a protrusion 13 formed of a foam which part of the coating member 12 is foamed, and configured to show inherent information written in the IC chip 16 is arranged on one face 12a of the coating member 12. COPYRIGHT: (C)2011,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种在不受天线形状限制的情况下施加规定位置进行压纹加工的非接触式数据发送器和接收器，并提供其制造方法。 非接触式数据发送器/接收器10由以下部分构成：具有基底基板14的入口11，形成在基底基板14的一个面14a上的天线15和与天线15连接的IC芯片16。 以及涂覆入口11的涂布部件12，其中，由涂覆部件12的一部分发泡的泡沫形成的突起13布置在涂覆部件的一个面12a上，并且被配置为显示写入IC芯片16中的固有信息 12.版权所有（C）2011，JPO＆INPIT

    Contactless data transmitter/receiver
    6.
    发明专利
    Contactless data transmitter/receiver 审中-公开
    无连接数据发射器/接收器

    公开(公告)号：JP2008204139A

    公开(公告)日：2008-09-04

    申请号：JP2007039101

    申请日：2007-02-20

    Applicant: Toppan Forms Co Ltd ,  トッパン・フォームズ株式会社

    Inventor： SAKURAI TAKAHIRO

    IPC: G06K19/077 ,  B42D15/10 ,  C09J201/00 ,  G06K19/07

    Abstract: PROBLEM TO BE SOLVED: To provide a contactless data transmitter/receiver easily collecting a built-in inlet or electronic components without imposing a burden on an environment or an operator, and reusing the inlet or electronic components. SOLUTION: The contactless transmitter/receiver 10 is provided with: an inlet 14 configured of a base material 11 and an antenna 12 and an IC chip 13 which are formed on one face 11a of the material 11 and connected to each other; and a base material 16 formed through an adhesive layer 15 on the one face 11a of the base material 11 so that the antenna 12 and the IC chip 13 can be covered. The adhesive layer 15 is configured of thermal expansion release adhesive or hot water release adhesive. COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种非接触式数据发送器/接收器，其容易地收集内置的入口或电子部件，而不会对环境或操作者造成负担，并且重新使用入口或电子部件。 解决方案：非接触式发射器/接收器10设置有：形成在材料11的一个面11a上并彼此连接的基材11和天线12和IC芯片13的入口14; 以及通过基材11的一个面11a上的粘合剂层15形成的基材16，从而能够覆盖天线12和IC芯片13。 粘合剂层15由热膨胀剥离粘合剂或热水释放粘合剂构成。 版权所有（C）2008，JPO＆INPIT

    Ic card and manufacturing method thereof
    7.
    发明专利
    Ic card and manufacturing method thereof 有权
    IC卡及其制造方法

    公开(公告)号：JP2008117272A

    公开(公告)日：2008-05-22

    申请号：JP2006301519

    申请日：2006-11-07

    Applicant: Toppan Forms Co Ltd ,  トッパン・フォームズ株式会社

    Inventor： SAKURAI TAKAHIRO ,  ITO YUICHI

    IPC: G06K19/077 ,  B42D15/10 ,  G06K19/07

    CPC classification number: G06K19/07749 ,  G06K19/07728 ,  G06K19/07745 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To provide a flat IC card and a manufacturing method thereof that prevent distortion of a built-in IC chip. SOLUTION: The IC card 10 comprises a module 12 having an inlet 11, an adhesive layer 13 for covering the module 12, and a first substrate 14 and a second substrate 15 for sandwiching the module 12 via the adhesive layer 13. The module 12 is arranged on one surface 14a of the first substrate 14 via adhesive layers 21 to 23 having different thicknesses depending on the thicknesses of each portion, and the adhesive layers 21 to 23 have both ends tapered when viewed from an outer surface 14b of the first substrate 14 or an outer surface 15a of the second substrate. COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种防止内置IC芯片变形的扁平IC卡及其制造方法。 解决方案：IC卡10包括具有入口11的模块12，用于覆盖模块12的粘合层13，以及经由粘合剂层13夹持模块12的第一基板14和第二基板15。 模块12通过具有不同厚度的粘合剂层21至23布置在第一基板14的一个表面14a上，这取决于每个部分的厚度，并且当从粘合剂层21至23的外表面14b观察时，粘合剂层21至23具有锥形 第一基板14或第二基板的外表面15a。 版权所有（C）2008，JPO＆INPIT

    Pressure-contact roller
    8.
    发明专利
    Pressure-contact roller 审中-公开
    压力接触辊

    公开(公告)号：JP2007145548A

    公开(公告)日：2007-06-14

    申请号：JP2005344479

    申请日：2005-11-29

    Applicant: Toppan Forms Co Ltd ,  トッパン・フォームズ株式会社

    Inventor： YOSHIDA RIE ,  SAKURAI TAKAHIRO

    IPC: B65H27/00

    Abstract: PROBLEM TO BE SOLVED: To avoid the state that sheets after conveyance is charged by static electricity when conveyance is performed while pinching a sheet having possibility that static electricity is generated.
    SOLUTION: In this pressure-contact roller structured of a pair of rollers so as to pinch a sheet with the pair of rollers for conveyance, at least one of the pair of rollers is provided with a hollow shape, and has a discharging part 13 provided inside the hollow shape to discharge and a plurality of fine holes 11a provided in the roller surface to supply the charge discharged from the discharging part 13 to the outside of the hollow shape.
    COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题：为了避免当在产生静电的可能性的同时进行输送时在输送之后的静电带电的状态。 解决方案：在由一对辊构成的压接辊中，用一对辊夹持片材进行输送，所述一对辊中的至少一个设置有中空形状，并且具有放电 设置在中空形状内部以排出的部分13和设置在辊表面中的多个细孔11a，以将从排出部13排出的电荷提供给中空形状的外部。 版权所有（C）2007，JPO＆INPIT

    Noncontact ic card
    9.
    发明专利
    Noncontact ic card 审中-公开
    非接线IC卡

    公开(公告)号：JP2003303327A

    公开(公告)日：2003-10-24

    申请号：JP2002109150

    申请日：2002-04-11

    Applicant: Toppan Forms Co Ltd ,  トッパン・フォームズ株式会社

    Inventor： TATEBAYASHI NAOYUKI ,  SAKURAI TAKAHIRO

    IPC: B42D15/10 ,  G06K19/07 ,  G06K19/077 ,  G06K19/10 ,  H01L31/04 ,  H01Q1/22 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q7/00

    CPC classification number: Y02E10/50

    Abstract: PROBLEM TO BE SOLVED: To provide a noncontact IC card having printed information with an inlet visible from an outside and preventing forgery. SOLUTION: The inlet 110 is formed of a coil antenna 112 that incorporates an IC module 111 for writing and reading information and is connected with the IC module 111 for writing or reading information to or from the IC module 111 in a noncontact state. Intermediate layers 120a and 120b of transparent material including a printed layer 131 having the printed information are laminated on the card so as to sandwich the inlet 110 in an area not facing the IC module 111. Surface sheets 130a and 130b made of transparent film layers are further laminated on the card so as to sandwich the intermediate layers 120a and 120b. COPYRIGHT: (C)2004,JPO

    Abstract translation: 要解决的问题：提供具有打印信息的非接触式IC卡，其具有可从外部看到的入口并防止伪造。 入口110由线圈天线112形成，线圈天线112包括用于写入和读取信息的IC模块111，并且与IC模块111连接，用于以非接触状态向IC模块111写入或读取信息 。 包含具有印刷信息的印刷层131的透明材料的中间层120a和120b层叠在卡上，以将入口110夹在不面向IC模块111的区域中。由透明膜层制成的表面片130a和130b是 进一步层压在卡上以夹住中间层120a和120b。 版权所有（C）2004，JPO

    NON-CONTACT INFORMATION RECORDING MEDIUM AND METHOD FOR MANUFACTURING THE SAME
    10.
    发明专利
    NON-CONTACT INFORMATION RECORDING MEDIUM AND METHOD FOR MANUFACTURING THE SAME 审中-公开

    公开(公告)号：JP2003162704A

    公开(公告)日：2003-06-06

    申请号：JP2002032173

    申请日：2002-02-08

    Applicant: TOPPAN FORMS CO LTD

    Inventor： TAKATSU HIDEFUMI ,  SAKURAI TAKAHIRO

    IPC: B42D15/10 ,  G06K19/07 ,  G06K19/077 ,  G09F3/00

    Abstract: PROBLEM TO BE SOLVED: To provide a non-contact information recording medium whose design proprieties are made excellent at a low cost. SOLUTION: This non-contact information recording medium is constituted of an IC layer on which a non-contact IC is mounted and a resin layer formed on the IC layer so that the reading/writing of information can be executed in a non-contact state. In this case, the resin layer is supplied and hardened on the IC layer so that the surrounding can be rounded according to the surface tension of resin liquid forming the resin layer. Also, this non-contact information recording medium is constituted of the IC layer on which the non-contact IC is mounted and resin layers formed on the both faces of the IC layer so that the reading/writing of information can be realized in the non-contact state. In this case, the resin layers are supplied and hardened on the both faces of the IC layers so that the surrounding can be rounded by the surface tension of resin liquid forming the resin layers. COPYRIGHT: (C)2003,JPO

Patent Agency Ranking