Abstract:
Rare earth compositions comprising nanoparticles, methods of making nanoparticles, and methods of using nanoparticles are described. The compositions of the nanomaterials discussed may include scandium (Sc), yttrium (Y), lanthanum (La), cerium (Ce), praseodymium (Pr), neodymium (Nd), promethium (Pm), samarium (Sm), europium (Eu), gadolinium (Gd), terbium (Tb), dysprosium (Dy), holmium (Ho), erbium (Er), thulium (Tm), ytterbium (Yb), and lutetium (Lu). The nanoparticles can be used to make organometallics, nitrates, and hydroxides. The nanoparticles can be used in a variety of applications, such as pigments, catalysts, polishing agents, coatings, electroceramics, catalysts, optics, phosphors, and detectors.
Abstract:
Polishing powders of nanoscale dimensions are disclosed. Complex, multi-metal oxides are disclosed as constituents for chemical mechanical planarization, (CMP) as well as polishes for optical components, photonic devices, and other applications.
Abstract:
Methods for slurry processing of nanomaterials into products. These methods are useful for organic, inorganic, metallic, alloy, ceramic, conducting polymer, non-conducting polymer, ion conducting, non-metallic, ceramic-ceramic composite, ceramic-polymer composite, ceramic-metal composite, metal-polymer composite, polymer-polymer composite, metal-metal composite, processed materials including paper and fibers, and natural materials such as mica, dielectrics, ferrites, stoichiometric, non-stoichiometric, or a combination of one or more of these. These methods also allow the fabrication of a functionally graded products.
Abstract:
Nanoparticles comprising tungsten, methods of manufacturing nanoparticles comprising tungsten, and applications of nanoparticles comprising tungsten, such as electronics, optical devices, photonics, reagents for fine chemical synthesis, pigments, and catalysts are provided.
Abstract:
Device nanotechnology based on silicon wafers and other substrates is described. Methods for preparing such devices are discussed. The teachings allow integration of current semiconductor device, sensor device and other device fabrication methods with nanotechnology. Integration of nanotubes and nanowires to wafers is discussed. Sensors, electronics, biomedical and other devices are presented.
Abstract:
Nanocomposites from nanofillers with preferred form of whiskers, rods, plates and fibers are disclosed. The matrix composition described includes polymers, ceramics and metals. The composition disclosed include inorganic, organic and metallic. These nanocomposites are useful in wide range of applications given their unusual properties such as refractive index, transparency to light, reflection characteristics, resistivity, permittivity, permeability, coercivity, B-H product, magnetic hysteresis, breakdown voltage, skin depth, curie temperature, dissipation factor, work function, band gap, electromagnetic shielding effectiveness, radiation hardness, chemical reactivity, thermal conductivity, temperature coefficient of an electrical property, voltage coefficient of an electrical property, thermal shock resistance, biocompatibility, and wear rate.
Abstract:
The production and selection of precursor mixtures used to produce fine powders and methods for making fine powders using the selected precursor. The precursor mixture comprises at least one metal containing precursor, the metal containing precursor has an average molecular weight of less than 2000 grams per unit mol of the metal, the metal containing precursor has a normal boiling point greater than 350K, and the viscosity of the precursor mixture is between 0.1 to 250 cP. The precursor mixture is processed under conditions that produce a fine powder from the precursor mixture. Fine powders produced are of size less than 100 microns, preferably less than 10 micron, more preferably less than 1 micron, and most preferably less than 100 nanometers.
Abstract:
Catalyst powders from nanoscale powders dispersed on coarser carrier powders. The composition of the dispersed fine powders may be oxides, carbides, nitrides, borides, chalcogenides, metals, and alloys. Nano-dispersed submicron powders and nano-dispersed nanopowders are discussed.
Abstract:
Methods for lowering processing and raw material costs are disclosed. Specifically, the use of nanostructured powders is disclosed for faster and lower sintering temperatures whereby electrodes currently employing platinum can be substituted with lower melting point metals and alloys.