公开(公告)号：EP2515259A2

公开(公告)日：2012-10-24

申请号：EP11172115.5

申请日：2011-06-30

Applicant: Walton Advanced Engineering Inc.

Inventor： Yu, Hong-Chi ,  Chang, Mao-Ting

IPC: G06K19/07

CPC classification number: G06K19/07732

Abstract: The present invention is to provide a thin carrier device with a support pad's length positioned at a USB port's height for a supporting segment securely supported and a USB metal contact electrically connected to a female connector of the USB port effectively without problems such as invalid electrical connection or poor contact between a USB metal contact and a female connector of a computer's USB port affected by the integrated circuit module's thinned thickness. Relying on the lowered thickness of the integrated circuit module, the present invention is able to integrate other thin products with their shapes including, without limitation, card, paper card or business card for the purpose of a thinning tendency.

Abstract translation: 本发明提供一种薄载体装置，其具有位于USB端口高度处的支撑垫长度，用于支撑部分被牢固地支撑，并且USB金属触点有效地电连接到USB端口的阴连接器，而没有诸如无效电连接的问题 或USB集成电路模块的薄型厚度影响的计算机USB端口的USB金属触点和母连接器之间的接触不良。 依靠集成电路模块的厚度降低，本发明能够集成其形状的其他薄产品，包括但不限于卡片，纸卡或名片，以减少趋势。

公开(公告)号：EP2362719A1

公开(公告)日：2011-08-31

申请号：EP10159936.3

申请日：2010-04-14

Applicant: Walton Advanced Engineering Inc.

Inventor： Yu, Hong-Chi

IPC: H05K1/14 ,  H01L23/34 ,  H01L23/00

CPC classification number: H01R12/716 ,  H01L23/367 ,  H01L23/48 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/18 ,  H01L2224/16 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01R12/73 ,  H05K1/0203 ,  H05K1/117 ,  H05K3/32 ,  H05K3/368 ,  H05K2201/0311 ,  H05K2201/10159 ,  H05K2201/1031 ,  Y02P70/611

Abstract: A high-density integrated circuit module structure comprises at least a substrate (20) and a heat sink (30) wherein the substrates form a reversely-staggered contacting stack structure being formed with substrates electrically contacting heat sinks, and heat conductors (31) on the heat sink having at least one non-flat structure (311), allowing product's functions to be extended within an electronic product's restricted height, a better vibration resistance capability and heat dissipation effect, and simplified assembling procedure with no steps involving junctions between solder balls and a carrier, resulting in improved functions, increased capacity, and reduced manufacturing costs.

Abstract translation: 高密度集成电路模块结构至少包括衬底（20）和散热器（30），其中衬底形成反向交错的接触叠层结构，该结构形成有电接触散热器的衬底，以及热导体 散热器具有至少一个非平坦结构（311），允许产品的功能在电子产品的限制高度内延伸，更好的抗振性能和散热效果，以及简化的组装过程，不涉及焊球之间的接合 和运营商，从而改善功能，增加容量并降低制造成本。

公开(公告)号：EP2259312A1

公开(公告)日：2010-12-08

申请号：EP09164685.1

申请日：2009-07-06

Applicant: Walton Advanced Engineering Inc.

Inventor： Yu, Hong-Chi

IPC: H01L25/065 ,  H01L25/10 ,  H01L23/31 ,  H05K1/14 ,  H05K3/36

CPC classification number: H05K1/144 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/34 ,  H01L23/48 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01R13/2442 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/097 ,  H05K2201/10189 ,  H05K2201/10424 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An inversely alternate stacked structure of integrated circuit (IC) modules includes at least one IC module (10), and at least a spring strip set (20). The IC module contains a substrate (11), at least an IC chip and a molding body, in which the substrate has an inner surface (111) and an outer surface (112), at least an external contact pad (113) is provided on one end of the outer surface, and at least a switch contact pad (114) is provided on the other end of the outer surface, the external contact pad and the switch contact pad are disposed in an inversely symmetrical manner. The spring strip set (20) has at least a non-flat structure (21). The external contact pad (113) of an IC module is electrically connected with the switch contact pad (114) of another IC module via the electrical contact of the non-flat structure (21) so that the IC modules are integrated to form an inversely alternate stacked structure.

Abstract translation: 集成电路（IC）模块的反交替层叠结构包括至少一个IC模块（10）和至少一个弹簧条组（20）。 IC模块包含至少一个IC芯片和成型体的基片（11），其中基片具有内表面（111）和外表面（112），至少提供一个外部接触垫（113） 在外表面的一端上，并且在外表面的另一端上设置至少一个开关接触垫（114），外部接触垫和开关接触垫以相反对称的方式设置。 弹簧带组20至少具有非平面结构21。 IC模块的外部接触焊盘（113）经由非平面结构（21）的电接触与另一个IC模块的开关接触焊盘（114）电连接，使得IC模块被集成以形成反向 交替堆叠结构。

公开(公告)号：EP3671502A1

公开(公告)日：2020-06-24

申请号：EP19200313.5

申请日：2019-09-29

Applicant: Walton Advanced Engineering Inc.

Inventor： Yu, Hong-Chi ,  Chang, Mao-Ting

IPC: G06F21/32 ,  G06F21/78 ,  G06F21/34

Abstract: The present disclosure relates to a data retention method which ensures security of classified information in design. The data retention method comprises steps as follows: a data plug of a dedicated storage module is inserted into a data socket of an encryption module and a locking element of a lock fastener module is fixed at a locking hole on the dedicated storage module; the encryption module and the dedicated storage module are electrically connected to each other through the data socket; an external component of the encryption module is electrically connected to an external device such that classified information (saved or to be saved) is encrypted or decrypted between the external device and a storage element of the dedicated storage module by an encryption component of the encryption module during data exchanges.

公开(公告)号：EP2693372A3

公开(公告)日：2015-10-14

申请号：EP13160581.8

申请日：2013-03-22

Applicant: Walton Advanced Engineering Inc.

Inventor： Yu, Hong-Chi ,  Chang, Mao-Ting

IPC: G06K19/077

Abstract: The present invention relates to a composite card-type structure (1) comprising an integrated circuit module (10) and a carrier (20). The carrier's height (20H) exactly matches a card reader's (4) height (4H). The composite connector's metal contacts are securely and electrically connected to the reader when the carrier with the integrated circuit module mounted is inserted into the reader. A support pad (212) which is removed out of the carrier and toward the carrier's lower surface has its length (212L) exactly matching the height (31H) of a USB port (31) in a computer (3) in order to reliably sustain a supporting segment and make the composite connector's metal contacts electrically connected to the USB port when a driven structure is shifted to a default direction under effect of a user's force.

公开(公告)号：EP2693372A2

公开(公告)日：2014-02-05

申请号：EP13160581.8

申请日：2013-03-22

Applicant: Walton Advanced Engineering Inc.

Inventor： Yu, Hong-Chi ,  Chang, Mao-Ting

IPC: G06K19/077

Abstract: The present invention relates to a composite card-type structure (1) comprising an integrated circuit module (10) and a carrier (20). The carrier's height (20H) exactly matches a card reader's (4) height (4H). The composite connector's metal contacts are securely and electrically connected to the reader when the carrier with the integrated circuit module mounted is inserted into the reader. A support pad (212) which is removed out of the carrier and toward the carrier's lower surface has its length (212L) exactly matching the height (31H) of a USB port (31) in a computer (3) in order to reliably sustain a supporting segment and make the composite connector's metal contacts electrically connected to the USB port when a driven structure is shifted to a default direction under effect of a user's force.

Abstract translation: 本发明涉及包括集成电路模块（10）和载体（20）的复合卡式结构（1）。 承运人的高度（20H）与读卡器（4）的高度（4H）完全匹配。 当将安装有集成电路模块的载体插入阅读器时，复合连接器的金属触点牢固地电连接到读取器。 从托架移出并朝向托架的下表面移除的支撑垫（212）的长度（212L）与计算机（3）中的USB端口（31）的高度（31H）精确匹配，以便可靠地维持 当驱动结构在用户力的作用下移动到默认方向时，使得复合连接器的金属触点电连接到USB端口。

公开(公告)号：EP2511854A1

公开(公告)日：2012-10-17

申请号：EP11170884.8

申请日：2011-06-22

Applicant: Walton Advanced Engineering Inc.

Inventor： Yu, Hong-Chi ,  Chang, Mao-Ting

IPC: G06K19/07 ,  G06K19/077

CPC classification number: G06K19/07 ,  G06K19/077

Abstract: The present invention is to provide a thin data storage device with a support pad's length positioned at a USB port's height in a way for a supporting segment securely supported and a USB metal contact effectively and electrically connected to a female connector of the USB port without problems such as invalid electrical connection or poor contact between a USB metal contact and a female connector of a computer's USB port affected by the integrated circuit module's thinned thickness. Relying on the lowered thickness of the integrated circuit module, the present invention is effective in extensive applications to other products.

Abstract translation: 本发明是提供一种薄型数据存储装置，其具有位于USB端口的高度的支撑垫的长度，用于支撑段被牢固地支撑，并且USB金属接触件有效地并且电连接到USB端口的母连接器，而没有问题 例如无效的电气连接或USB集成电路模块的薄型厚度影响的计算机USB端口的USB金属触点和母连接器之间的接触不良。 依靠集成电路模块的厚度降低，本发明在其他产品的广泛应用中是有效的。

公开(公告)号：EP2453721A2

公开(公告)日：2012-05-16

申请号：EP11150715.8

申请日：2011-01-12

Applicant: Walton Advanced Engineering Inc.

Inventor： Yu, Hong-Chi ,  Chang, Mao-Ting

IPC: H05K1/02 ,  G06K19/04

CPC classification number: H01R12/721 ,  G06K19/07732 ,  H05K1/117 ,  H05K3/0058 ,  H05K2201/10159

Abstract: The present invention is to provide a storage device comprising at least an integrated circuit module and a carrier plate folded to be at least two folding sections in which the height of the integrated circuit module plus the heights of folding sections is not more than the height unit of a Universal Serial Bus (USB) male connector to embody the height of the integrated circuit module in the present invention effectively reduced and the present invention extensively employed, conveniently used, and properly accommodated with the folding section and the integrated circuit module oppositely stacked.

Abstract translation: 本发明提供一种存储装置，其至少包括集成电路模块和承载板，所述载体板折叠成至少两个折叠部分，其中集成电路模块的高度加上折叠部分的高度不大于高度单位 通过本发明的集成电路模块的高度实现了通用串行总线（USB）公连接器的有效减少，并且本发明被广泛地应用，并且被折叠部分和集成电路模块相对堆叠地适当地适用。

公开(公告)号：EP2426624A1

公开(公告)日：2012-03-07

申请号：EP10194925.3

申请日：2010-12-14

Applicant: Walton Advanced Engineering Inc.

Inventor： Yu, Hong-Chi ,  Chang, Mao-Ting

IPC: G06K19/07

CPC classification number: G06K19/07

Abstract: A USB device structure comprises a first package component and a second package component at least wherein the second package component is installed on the first package component; in addition, the first package component comprises an electronic device at least which is attached on a substrate; the second package component comprises an electronic device at least which is attached on a substrate; the first package component is electrically connected to the second package component for promoted product yield rate, customer's early delivery date, and reduced manufacturing and material costs.

Abstract translation: USB设备结构包括第一包装部件和第二包装部件，至少其中第二包装部件安装在第一包装部件上; 此外，第一封装部件包括至少附着在基板上的电子器件; 所述第二包装部件至少包括附着在基板上的电子装置; 第一包装部件电连接到第二包装部件，用于促进产品收率率，客户早期交货日期以及减少的制造和材料成本。

公开(公告)号：EP2407905A1

公开(公告)日：2012-01-18

申请号：EP10194863.6

申请日：2010-12-14

Applicant: Walton Advanced Engineering Inc.

Inventor： Yu, Hong-Chi ,  Chang, Mao-Ting

IPC: G06F21/00

CPC classification number: G06F21/79 ,  G06F21/74 ,  G06F21/87 ,  G06F2221/2105 ,  H04L2209/127

Abstract: An encryption flash disk comprises a memory module, an encryption system, and a switch device wherein the memory module has a substrate accommodating an inner surface provided with a memory chip as well as a control device at least and a plurality of metal contacts; the encryption system is installed in the memory chip electrically connected to the control device and comprises a public zone and a private zone at least and a public program wherein the public program has a password configure module used to configure, input, and clear a password; the switch device is electrically connected to the memory module's control device. Accordingly, the encryption flash disk is capable of keeping digital data secret and safe.

Abstract translation: 加密闪存盘包括存储器模块，加密系统和开关装置，其中存储器模块具有容纳具有存储芯片的内表面的基板以及至少和多个金属触点的控制装置; 加密系统安装在电连接到控制设备的存储器芯片中，并且至少包括公共区域和私有区域以及公共程序，其中公共程序具有用于配置，输入和清除密码的密码配置模块; 开关装置电连接到存储器模块的控制装置。 因此，加密闪存盘能够保持数字数据的秘密和安全。