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公开(公告)号：JPS6312915A
公开(公告)日：1988-01-20
申请号：JP15706386
申请日：1986-07-03
Applicant: YAMAHA CORP
Inventor： IIJIMA KENZABURO , HAYASHI YOSHINORI
Abstract: PURPOSE:To reduce the distortion of a detection signal of a sensor which detects position information on a recording medium by supplying the outputs of two variable gain amplifiers to a displacement detecting circuit. CONSTITUTION:When the amplification factors of variable gain amplifiers 40 and 41 are denoted as A, the detection signals sintheta and costheta outputted by magnetic sensors 14 and 15 are amplified by the amplifiers 40 and 41 to obtain Asintheta and Acostheta. Those outputs are squared by square-law circuits 42 and 43 and summed up by an adder 44 to obtain A (sin theta+cos theta). Here, sin theta+ cos theta=1, so the output of the adder 44 is A . This is supplied to a 1st input terminal 45a of a subtracter 45 and subtracted from a reference voltage VREF supplied to a 2nd input terminal 45b. This subtraction result is inputted as a control signal VAGC to the amplifiers 40 and 41, whose gains are so controlled that a preset reference value is obtained, thereby holding the output levels of the amplifiers 40 and 41 constant at all times.
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公开(公告)号：JPS62281520A
公开(公告)日：1987-12-07
申请号：JP12426286
申请日：1986-05-29
Applicant: YAMAHA CORP
Inventor： IIJIMA KENZABURO , HAYASHI YOSHINORI
Abstract: PURPOSE:To attain miniaturization and low cost and to simplify the adjustment of a gap by using magneto-resistance elements to constitute an origin detection element reading position information recorded on a magnetic recording medium, a displacement detecting element, and an electrode detecting a gap between the electrode and the magnetic recording medium, and providing these elements and the electrode on one and same base. CONSTITUTION:The origin detection element 5, the displacement detection elements 6a, 6b, 6c, 6d, gap detection electrodes 7, 8, 9, a monitor element and terminals T1-T17 are provided onto an upper face 4a of an insulating board 4. They are formed by MR elements made of a Ni-Fe alloy. The origin detection element 5 detects an origin mark 2b recorded magnetically on the magnetic recording medium 2. The displacement detection elements 6a-6d read marks 2a, 2a-recorded magnetically on the magnetic recording medium 2 at each prescribed interval to detect the displacement of the medium 2. The electrodes 7, 8, 9 act like gap sensors detecting the gap between the magnetic recording medium 2 and the electrodes 3, 4, 5 respectively based on the static capacitance between these electrodes and the medium 2 to automatically adust the gap.
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公开(公告)号：JP2004117367A
公开(公告)日：2004-04-15
申请号：JP2003352951
申请日：2003-10-10
Applicant: Yamaha Corp , ヤマハ株式会社
Inventor： SATO HIDEKI , SUZUKI TOSHINAO , KANEKO AKIRA , IIJIMA KENZABURO , MOCHIZUKI OSAMU
Abstract: PROBLEM TO BE SOLVED: To improve the detection accuracy of an external magnetic field by improving the temperature characteristics of a magnetic sensor using a magnetic tunneling effect element.
SOLUTION: The magnetic sensor has magnetic tunneling effect elements 51, 52. The magnetization orientation of each fixed magnetization layer of these magnetic tunneling effect elements is set to be the same orientation (the orientation shown by the arrow) for each element. The magnetic sensor comprises a half-bridge circuit which retrieves the voltage across the element 52 as an output voltage V
out by serially connecting the element 51 and the elements 52 and by serially connecting a direct constant voltage source 53 to the element 51 and the element 52.
COPYRIGHT: (C)2004,JPO-
公开(公告)号：JP2004045926A
公开(公告)日：2004-02-12
申请号：JP2002205297
申请日：2002-07-15
Applicant: Yamaha Corp , ヤマハ株式会社
Inventor： IIJIMA KENZABURO , NAKAJIMA TOSHIHIRO
Abstract: PROBLEM TO BE SOLVED: To provide an optical connector which can reduce coupling loss between optical fibers and a manufacturing method therefor. SOLUTION: The optical connector 10 is equipped with an optical fiber holder 12 having a holding hole for holding respective optical fibers in an optical fiber group F, a fixed plate 14 having a fixed hole group M for positioning the respective optical fibers on one end surface of the holder, a fixed plate 16 having a fixed hole group for positioning the respective optical fibers on the other end surface of the holder 12, and guide pins which are fitted in pin fitting holes of the fixed plates 14 and 16 to position the fixed plates at the holder 12 as guide pins 18a and 18b which are held slidably by two pin holding holes of the holder 12. Either of the guide pins 18a and 18b is made a specified length longer than the total thickness of the holder 12 and fixed plates 14 and 16. The guide pins 18a and 18b are fitted in pin insertion holes of an optical connector 20 to connect the optical connectors 10 and 20. COPYRIGHT: (C)2004,JPO
Abstract translation: 要解决的问题：提供一种可以减少光纤之间的耦合损耗的光连接器及其制造方法。 解决方案：光连接器10配备有具有用于保持光纤组F中的各个光纤的保持孔的光纤保持器12，具有用于将各个光纤定位的固定孔组M的固定板14 保持器的一个端面，具有固定孔组的固定板16，用于将保持器12的另一个端面上的各个光纤定位，以及安装在固定板14和16的销安装孔中的导向销， 将固定板定位在保持器12上，作为导向销18a和18b，该引导销18a和18b由保持器12的两个销保持孔可滑动地保持。导向销18a和18b之一被制成比保持器12的总厚度长的指定长度 以及固定板14和16.引导销18a和18b装配在光连接器20的销插入孔中，以连接光连接器10和20.版权所有（C）2004，JPO
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公开(公告)号：JP2004006946A
公开(公告)日：2004-01-08
申请号：JP2003208567
申请日：2003-08-25
Applicant: YAMAHA CORP
Inventor： SUZUKI KATSUNORI , IIJIMA KENZABURO , HOSHI TOSHIHARU
IPC: H01L23/373 , H01L23/36
Abstract: PROBLEM TO BE SOLVED: To derive a successful heat sink in which a coefficient of thermal expansion resembles a device, etc., and a heat dissipation is good. SOLUTION: A method for manufacturing the heat sink 10 includes a formulation formation step of primarily forming which is used as formulation for forming by mixing and kneading W (Mo) powder, Cu powder, and a binder by ratio whose content of W(Mo) increases more than Cu; a primary forming step of fabricating base metal shaped body 10a which filled up shaping die with this formulation for primary forming and was equipped with pierced hole of desired shape; a formulation formation step for second forming which is fulled and is used as formulation for forming by mixing and kneading W(Mo) powder, Cu powder, and binder by ratio whose content of Cu increases more than W(Mo); a second forming step of filling up with formulation 13 for the second forming in pierced hole 12 of base metal shaped body 10a, and is made into one piece shaped body; a firing eliminate debinder treatment step of heating this one piece shaped body and was contained in one piece shaped body; and a sintering step of sintering a binder evicted one piece shaped body to make compound sintering member. COPYRIGHT: (C)2004,JPO
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Patent Agency Ranking
公开(公告)号：JP2003213360A
公开(公告)日：2003-07-30
申请号：JP2002014552
申请日：2002-01-23
Applicant: YAMAHA CORP
Inventor： SUZUKI YOSHIFUMI , IIJIMA KENZABURO
Abstract: PROBLEM TO BE SOLVED: To provide a high thermoconductive alloy having a thermal expansion coefficient close to that of glass and a heat sink having increased heat dissipation amount, and to provide methods for manufacturing them. SOLUTION: The high thermoconductive alloy 1 of ≥250 W/mK thermal conductivity is composed of a tungsten-copper alloy prepared by dispersing tungsten particles of 0.2 to 2 μm particle size in a copper matrix and sintering. The heat sink is prepared by forming the alloy 1 into desired shape. The high thermoconductive alloy 1 and the heat sink constituted of the alloy 1 can be obtained from tungsten/copper composite capsules as a raw material, in which tungsten powder is adhered to the surface of copper powder by coating and copper content is regulated to ≥30 wt.% and applying heating at a temperature in the vicinity of the melting point of copper in a hydrogen atmosphere for sintering by a metal injection molding method. COPYRIGHT: (C)2003,JPO
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公开(公告)号：JPH11128409A
公开(公告)日：1999-05-18
申请号：JP29407097
申请日：1997-10-27
Applicant: YAMAHA CORP
Inventor： KAMIMURA NAOKI , IIJIMA KENZABURO , HOSHI TOSHIHARU
IPC: A63B53/04 , A63B102/32
Abstract: PROBLEM TO BE SOLVED: To increase inertial moment, extremely lower the center of gravity, provide a great freedom in adjusting the center of gravity and reduce a manufacturing cost. SOLUTION: The hitting portion 2 and the hozel portion 3 of a head 1 are molded with a powder metal injection molding means. The center 1A of the hitting portion 2 as a sweet area of the head 1 is formed of a low specific gravity metal material and the toe 1B and the heel 1C located across the center 1A are formed with a high specific gravity metal.
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公开(公告)号：JPH1199228A
公开(公告)日：1999-04-13
申请号：JP26391897
申请日：1997-09-29
Applicant: YAMAHA CORP
Inventor： ABE EIJI , IIJIMA KENZABURO , HOSHI TOSHIHARU
IPC: A63B53/04 , A63B102/32
Abstract: PROBLEM TO BE SOLVED: To simply and easily prepare a complicated head shape by making a head into a plurality of divided bodies and bonding them and dispensing with an abrading process after bonding. SOLUTION: A head is divided into a plurality of parts and green divided bodies 21, 22 and 23 are respectively molded by a powder metal injection molding means. These green divided bodies 21, 22 and 23 are mutually assembled and bonded by an interfacial bonding means to mold a head green body 20. Heat treatment is applied onto this head green body 20 to sinter it.
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公开(公告)号：JPH10178046A
公开(公告)日：1998-06-30
申请号：JP29774496
申请日：1996-10-21
Applicant: YAMAHA CORP
Inventor： IIJIMA KENZABURO , MIURA MICHIO
IPC: H01L21/60 , H01L23/31 , H01L23/485 , H05K3/34
Abstract: PROBLEM TO BE SOLVED: To reduce connection area between the lead-out electrode of a semiconductor chip and the wiring layer of a mounting board. SOLUTION: Under a state where the Ni layer 14c of a lead-out electrode 14 provided on a semiconductor chip 10 is brought into contact with a solder layer 22c on a wiring layer 22 formed on a mounting board 20, the solder layer 22c is irradiated with laser light L from the rear side of the board 20 in order to connect the lead-out electrode 14 with the wiring layer 22. Since the diameter of the laser light L can be reduced to 1-25μm, connection area can be reduced and thereby the size of the lead-out electrode and the chip can e reduced. The solder layer 22c may be omitted. An insulation film 24 may be provided with no contact hole and laser bonding may be performed by breaking the coating.
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公开(公告)号：JP2529951B2
公开(公告)日：1996-09-04
申请号：JP24706286
申请日：1986-10-17
Applicant: YAMAHA CORP
Inventor： NONAKA TERUMOTO , IIJIMA KENZABURO , YOKOI KATSUYUKI , HAYASHI YOSHINORI
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