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    Method for producing thin, free-standing layers of solid state materials with structured surfaces
    22.
    发明授权
    Method for producing thin, free-standing layers of solid state materials with structured surfaces 有权
    用于生产具有结构化表面的薄的，独立的固态材料层的方法

    公开(公告)号：US08877077B2

    公开(公告)日：2014-11-04

    申请号：US13141821

    申请日：2009-12-18

    Applicant: Lukas Lichtensteiger

    Inventor： Lukas Lichtensteiger

    IPC: B44C1/22

    CPC classification number: B28D1/221 ,  B81C1/00634 ,  B81C2201/038 ,  H01L21/304 ,  H01L21/76251 ,  Y10T225/10

    Abstract: A method of printing comprises the steps of: providing a solid state material having an exposed surface; applying an auxiliary layer to the exposed surface to form a composite structure, the auxiliary layer having a stress pattern; subjecting the composite structure to conditions facilitating fracture of the solid state material along a plane at a depth therein; and removing the auxiliary layer and, therewith, a layer of the solid state material terminating at the fracture depth, wherein an exposed surface of the removed layer of solid state material has a surface topology corresponding to the stress pattern.

    Abstract translation: 印刷方法包括以下步骤：提供具有暴露表面的固态材料; 将辅助层施加到暴露的表面以形成复合结构，所述辅助层具有应力图案; 使复合结构受到促进固态材料沿着其深度处的平面断裂的条件; 并且除去辅助层，并且随后移除终止于断裂深度处的固态材料层，其中所述去除的固态材料层的暴露表面具有对应于应力图案的表面拓扑。

    MAGNETIC MICROPARTICLE AND METHOD FOR MANUFACTURING SUCH A MICROPARTICLE
    24.
    发明申请
    MAGNETIC MICROPARTICLE AND METHOD FOR MANUFACTURING SUCH A MICROPARTICLE 有权
    磁性微波和制造这种微波的方法

    公开(公告)号：US20110200434A1

    公开(公告)日：2011-08-18

    申请号：US13060662

    申请日：2010-09-17

    Applicant: Bernard Dieny ,  Hélène Joisten ,  Philippe Sabon

    Inventor： Bernard Dieny ,  Hélène Joisten ,  Philippe Sabon

    IPC: F03G7/00 ,  B29C41/02

    CPC classification number: B81C1/0019 ,  A61B1/00156 ,  B81B2201/038 ,  B81B2201/06 ,  B81C2201/038

    Abstract: A microparticle includes an oblong flexible tail able to propel the microparticle in a solution along a trajectory using beats transverse to the trajectory, the tail including at least one magnetic element such that the magnetic element causes beats of the tail under the action of an external alternating magnetic field non-collinear with the trajectory and a head mechanically connected to a proximal end of the tail. The microparticle includes at least one layer of material formed from one piece and including the tail and the head, the dimensions and/or shape of the head being selected such that the beats of the proximal end of the tail are limited with respect to the beats of the distal end of the tail and such that the head does not perform a complete revolution around an axis parallel to the trajectory under the effect of the external alternating magnetic field.

    Abstract translation: 微粒包括长方形柔性尾部，其能够使用横向于轨迹的搏动沿着轨迹将微粒推进到溶液中，尾部包括至少一个磁性元件，使得磁性元件在外部交替作用下引起尾巴的打击 与轨迹非共线的磁场和机械连接到尾端近端的磁头。 微粒包括至少一层材料，其由一个部件形成并包括尾部和头部，头部的尺寸和/或形状被选择为使得尾部的近端的节拍相对于节拍被限制 并且使得头部在外部交变磁场的作用下不围绕平行于轨迹的轴线执行完整的旋转。

    Method of forming component interface in semiconductor or MEMS manufacture
    25.
    发明申请
    Method of forming component interface in semiconductor or MEMS manufacture 审中-公开
    在半导体或MEMS制造中形成元件界面的方法

    公开(公告)号：US20060115960A1

    公开(公告)日：2006-06-01

    申请号：US11287428

    申请日：2005-11-28

    Applicant: Wen-Chang Dong

    Inventor： Wen-Chang Dong

    IPC: H01L21/30 ,  H01L21/46

    CPC classification number: B81C1/0088 ,  B81C2201/038 ,  H01L2224/16225 ,  H01L2224/48227

    Abstract: A method of forming component interface in semiconductor or MEMS manufacture is by way of a bad adhesion material or manufacture, or an easy etching and removable material, to form an easily removed component interface in the middle between a manufactured substrate and a layer of semiconductor circuit or MEMS component formed on the manufactured substrate as a basis, therefore, after semiconductor or MEMS manufacture is completed, the component interface is so easily destroyed by an external force that the layer of semiconductor circuit or MEMS component is easily separated from the manufactured substrate.

    Abstract translation: 在半导体或MEMS制造中形成部件界面的方法是通过不良的粘附材料或制造方法，或易于蚀刻和可移除的材料，以在制造的基板和半导体电路层之间的中间形成容易去除的部件界面 或MEMS部件形成在制造的基板上作为基础，因此，在半导体或MEMS制造完成之后，部件界面被外力容易地破坏，使得半导体电路层或MEMS部件容易与制造的基板分离。

    Flexible MEMS thin film without manufactured substrate and process for producing the same
    26.
    发明申请
    Flexible MEMS thin film without manufactured substrate and process for producing the same 失效
    柔性MEMS薄膜无制造底材及其制造方法

    公开(公告)号：US20060115959A1

    公开(公告)日：2006-06-01

    申请号：US11287427

    申请日：2005-11-28

    Applicant: Wen-Chang Dong

    Inventor： Wen-Chang Dong

    IPC: H01L21/30

    CPC classification number: B81C1/0088 ,  B81C2201/038 ,  H01L2224/16225 ,  H01L2224/48227

    Abstract: A process for producing flexible MEMS thin film without a manufactured substrate applied in a MEMS manufacture specially includes a method of forming a component interface in the middle between a manufactured substrate and a MEMS thin film formed on the manufactured substrate as a basis, which component interface is so easily destroyed by an external force that the MEMS thin film produced by the mentioned process is easily separated from the manufactured substrate, and the separated MEMS thin film due to out of limitation from the manufactured substrate may be further processed in later working process to obtain a MEMS thin film with special structural features has flexibility and particularly has electrical circuits, micro structure, or MEMS components integrated and manufactured into inside or on its both sides.

    Abstract translation: 用于生产柔性MEMS薄膜的方法，其中没有制造衬底应用于MEMS制造中，特别地包括在所制造的衬底和形成在所制造的衬底上的MEMS薄膜之间的中间形成部件界面的方法， 通过外力容易地破坏由所述工艺制造的MEMS薄膜容易与制造的基板分离，并且由制造的基板不受限制地分离的MEMS薄膜可以在后续工作过程中被进一步处理 获得具有特殊结构特征的MEMS薄膜具有柔性，并且特别地具有集成并制造在其内部或两侧的电路，微结构或MEMS部件。

    Method of manufacturing rigid floating microstructure elements and a device equipped with such elements
    27.
    发明授权
    Method of manufacturing rigid floating microstructure elements and a device equipped with such elements 失效
    制造刚性浮动微结构元件的方法和装备有这些元件的装置

    公开(公告)号：US5930594A

    公开(公告)日：1999-07-27

    申请号：US676631

    申请日：1996-07-10

    Applicant: Michel Vilain

    Inventor： Michel Vilain

    IPC: G01J5/20 ,  B81B3/00 ,  F15C5/00 ,  H01L21/302 ,  H01L21/3065 ,  H01L49/00 ,  H01L21/00

    CPC classification number: B81C1/00658 ,  B81B3/007 ,  F15C5/00 ,  G01J5/20 ,  B81B2203/0118 ,  B81C2201/0109 ,  B81C2201/038

    Abstract: A method of manufacturing elements of floating rigid microstructures and a device equipped with such elements.This method of manufacturing at least one element of a microstructure (104, 116) in a substrate including a stacking of a support layer (100), a layer (102) of sacrificial material and a structure layer (104) comprises the following steps:a) etching in the substrate a relief structure (108) with lateral sides (110a, 110b)b) formation of a so-called rigidity lining (116) on the lateral sides (110a, 110b),c) removal of the sacrificial material from the relief structure (108) in order to release the floating microstructure.

    Abstract translation: 一种制造浮动刚性微结构元件的方法和装备有这些元件的装置。 制造包括支撑层（100），牺牲材料层（102）和结构层（104）的堆叠的衬底中的微结构（104,116）的至少一个元件的这种方法包括以下步骤： a）在衬底中蚀刻具有侧面（110a，110b）的凸版结构（108）b）在侧面（110a，110b）上形成所谓的刚性衬层（116），c）去除牺牲材料 从浮雕结构（108）释放浮动微结构。

    Customized lithographic particles
    29.
    发明授权
    Customized lithographic particles 有权
    定制平版印刷

    公开(公告)号：US08617798B2

    公开(公告)日：2013-12-31

    申请号：US12377773

    申请日：2007-08-17

    Applicant: Thomas G. Mason ,  Carlos J. Hernandez

    Inventor： Thomas G. Mason ,  Carlos J. Hernandez

    IPC: G03F7/20

    CPC classification number: G03F7/40 ,  B81C99/008 ,  B81C2201/038

    Abstract: A method of producing particles includes providing a substrate structure that comprises a solid substrate; forming a target structure on said substrate structure, said target structure comprising a radiation-reactive material; forming a spatially patterned beam of radiation using a patterned mask; exposing at least a portion of the target structure to the spatially patterned beam of radiation to which the radiation-reactive material reacts while leaving other portions of the target structure unexposed to the radiation; removing substantially all of one of the exposed or the unexposed patterned portions of the target structure to provide a plurality of non-contiguous structures that include at least a portion of the radiation-reactive material; and separating the plurality of non-contiguous structures comprising the radiation-reactive material from the substrate structure into a fluid material. Each non-contiguous structure of the radiation-reactive material provides at least a portion of a separate particle after the separation.

    Abstract translation: 制造颗粒的方法包括提供包括固体基质的基底结构; 在所述衬底结构上形成目标结构，所述靶结构包括辐射反应性材料; 使用图案化掩模形成空间上图案化的辐射束; 将目标结构的至少一部分暴露于辐射反应性材料反应的空间图案化的辐射束，同时使目标结构的其它部分未暴露于辐射; 去除目标结构的暴露的或未曝光的图案化部分中的一个基本上全部，以提供包括至少一部分辐射反应性材料的多个非连续结构; 以及将包括所述辐射反应性材料的所述多个非连续结构与所述基底结构分离成流体材料。 辐射反应性材料的每个非连续结构在分离之后提供至少一部分单独的颗粒。

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