中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

76 records (took 0.02 seconds)

    接着組成物シートおよびその製造方法ならびに半導体装置
    24.
    发明申请
    接着組成物シートおよびその製造方法ならびに半導体装置 审中-公开
    胶粘组合物片，其制造方法和半导体器件

    公开(公告)号：WO2016158268A1

    公开(公告)日：2016-10-06

    申请号：PCT/JP2016/057400

    申请日：2016-03-09

    Applicant: 東レ株式会社

    Inventor： 榛葉陽一

    IPC: C09J7/00 ,  C09J5/00 ,  C09J11/04 ,  C09J201/00 ,  H01L21/52 ,  H01L23/36

    CPC classification number: C09J7/00 ,  C09J5/00 ,  C09J7/10 ,  C09J11/04 ,  C09J163/00 ,  C09J201/00 ,  C09J2201/12 ,  C09J2201/36 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  C09J2479/08 ,  H01L21/52 ,  H01L23/36

    Abstract: 　有機化合物および無機粒子を含有する接着組成物シートであって、該接着組成物シートは、少なくとも有機化合物を含有するＡ層と有機化合物および無機粒子を含有するＢ層とが積層された構造を含み、Ａ層の有機化合物の含有率がＢ層の有機化合物の含有率よりも大きく、かつ、前記Ａ層および／またはＢ層が異方性形状の無機粒子を含有する接着組成物シート。本発明は、硬化後の熱伝導性および絶縁性が良好な、接着組成物シートを提供する。

    Abstract translation: 一种粘合剂组合物片，其包含有机化合物和无机颗粒，所述粘合剂组合物片包含通过将包含有机化合物的至少一层A和至少一层包含有机化合物和无机颗粒的层B叠加而得到的结构，所述层A具有 比层B高的有机化合物含量，以及含有各向异性形状的无机颗粒的层A和/或层B。 本发明提供一种粘合剂组合物片材，其在固化后具有令人满意的导热性和绝缘性能。

    HOT-TRANSFER ADHESIVE ELEMENTS APPLIED BY THERMAL TRANSFER PROCESS FOR GLUING AND SEALING OF TEXTILE MATERIALS
    28.
    发明公开
    HOT-TRANSFER ADHESIVE ELEMENTS APPLIED BY THERMAL TRANSFER PROCESS FOR GLUING AND SEALING OF TEXTILE MATERIALS 审中-公开

    公开(公告)号：EP3351607A1

    公开(公告)日：2018-07-25

    申请号：EP18150217.0

    申请日：2018-01-03

    Applicant: Heliotextil-Etiquetas E Passamanarias S.A.

    Inventor： BULHOSA DE AGUIAR PACHECO, JOSÉ MIGUEL

    IPC: C09J7/35

    CPC classification number: C09J7/35 ,  C09J2201/12

    Abstract: The present invention relates to hot-transfer adhesive elements applied by thermal transfer processes for gluing and sealing textile materials, which promote the elimination of seams. The elements used in the present invention are fabricated using screen printing techniques and are fully customizable in shape and appearance, comprising: a film (1) doped with a substance which promotes their release or the release of objects (4) during their application; an adhesive layer (3) and a carrier adhesive (5), and may further contain a paint layer (2) on which the adhesive layer (3) is printed. The process of alignment and application of these elements is facilitated by the inclusion of areas with cold adhesive that act as temporary adhesion means between the substrate carrying the element and the final part, however this adhesive does not remains in the final part after application.

    ADHESIVE COMPOSITION SHEET, PROCESS FOR PRODUCING SAME, AND SEMICONDUCTOR DEVICE
    29.
    发明公开
    ADHESIVE COMPOSITION SHEET, PROCESS FOR PRODUCING SAME, AND SEMICONDUCTOR DEVICE 有权
    粘合剂组合物片材，其制造方法以及半导体装置

    公开(公告)号：EP3275956A1

    公开(公告)日：2018-01-31

    申请号：EP16772152.1

    申请日：2016-03-09

    Applicant: Toray Industries, Inc.

    Inventor： SHINBA, Yoichi

    IPC: C09J7/00 ,  C09J5/00 ,  C09J11/04 ,  C09J201/00 ,  H01L21/52 ,  H01L23/36

    CPC classification number: C09J7/00 ,  C09J5/00 ,  C09J7/10 ,  C09J11/04 ,  C09J163/00 ,  C09J201/00 ,  C09J2201/12 ,  C09J2201/36 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  C09J2479/08 ,  H01L21/52 ,  H01L23/36

    Abstract: Provided is an adhesive composition sheet containing an organic compound and inorganic particles, the adhesive composition sheet including a structure obtained by stacking a layer A that contains at least an organic compound and a layer B that contains an organic compound and inorganic particles, the layer A having a content rate of the organic compound larger than the content rate of the organic compound in the layer B, and the layer A and/or the layer B containing anisotropically shaped inorganic particles. The present invention provides an adhesive composition sheet excellent in thermal conductivity and insulating properties after cured.

    Abstract translation: 本发明提供一种粘合剂组合物片，其含有有机化合物和无机粒子，该粘合剂组合物片包含将至少含有有机化合物的层A和含有有机化合物和无机粒子的层B层叠而成的结构体，A层 所述有机化合物的含有率比所述B层中的所述有机化合物的含有率大，所述A层和/或所述B层含有各向异性形状的无机粒子。 本发明提供固化后的导热性和绝缘性优异的粘合剂组合物片。

Patent Agency Ranking