Abstract:
A method for carrying out nucleic acid amplification, includes providing a reaction chamber (31), accommodating an array (36) of nucleic acid probes (37) at respective locations, for hybridizing to respective target nucleic acids; and introducing a solution (50) into the reaction chamber (31), wherein the solution (50) contains primers, capable of binding to target nucleic acids, nucleotides, nucleic acid extending enzymes and a sample including nucleic acids. The a structure of the nucleic acid probes (37) and of the primers so that a hybridization temperature (T H ) of the probes (37) is higher than an annealing temperature (T A ) of the primers, whereby hybridization and annealing take place in respective separate temperature ranges (R H , R A ).
Abstract:
A semiconductor device includes at least one first component (5) (for example, a first integrated circuit), having a front face provided with electrical connection pads. The first component is embedded in a support layer (2) is a position such that the front face of the first component is not covered and lies parallel to a first face of the support layer. An intermediate layer (8) is formed on the front face of the first component and on the first face of the support layer. An electrical connection network (9) within the intermediate layer selectively connects to the electrical connection pads of the first component. The device further includes at least one second component (11) (for example, a second integrate circuit, having one face placed above the intermediate layer and provided with electrical connection pads selectively connected to the electrical connection network. Electrical connection vias (17) pass through the support layer and selectively connect the electrical connection network to an external electrical connection formed on a second face of the support layer.
Abstract:
A probe card (105') adapted for testing at least one integrated circuit integrated on corresponding at least one die (145) of a semiconductor material wafer, the probe card including a board (125') adapted for the coupling to a tester apparatus, and a plurality of probes (225) coupled to the said board, wherein the probe card comprises a plurality of replaceable elementary units (135'), each one comprising at least one of said probes for contacting externally-accessible terminals of an integrated circuit under test (145), the plurality of replaceable elementary units being arranged so as to correspond to an arrangement of at least one die on the semiconductor material wafer containing integrated circuits to be tested.
Abstract:
PDs that can be supplied through the LAN line are discriminated from PDs that cannot be so supplied in function of the resistance of the supply line and of the voltage drop Vdrop caused by nonlinear elements in series therewith. The values of these two parameters are estimated by applying two distinct voltages to the supply terminals of the LAN line and sensing the relative steady-state currents absorbed by the power supply line and by processing voltage and current values for estimating the resistance (Rdet) of the line and the voltage drop (Vdrop) caused by nonlinear elements connected in series therewith.
Abstract:
The present invention- relates to the use of a nitroaniline derivative of Formula I for the production of nitric oxide and for the preparation of a medicament for the treatment of a disease wherein the administration of nitric oxide is beneficial. The present invention furthermore relates to a method for the production of NO irradiating a nitroaniline derivative of Formula I, a kit comprising a nitroaniline derivative of Formula I and a carrier and to a system comprising a source of radiations and a container associated to a nitroaniline derivative of Formula I. In Formula I, R and R I are each independently hydrogen or a C 1 -C 3 alkyl group; R II is hydrogen or an alkyl group.
Abstract:
A wireless communication network, such as a IEEE 802.11 WLAN, includes an access point (AP) and a plurality of stations (STAl, STA2). The Access Point (AP) sends towards the stations (STAl, STA2) periodic information arranged in time frames or beacon intervals. The stations (STAl, STA2) in the network are configured to communicate: - in a first mode, called Infrastructure Mode (IM), through the access point (AP), and - in a second mode, called Direct Link Mode (DLM), directly with each other. The time frames are partitioned into: - a first time interval (IM_SI) wherein the stations (STAl, STA2) communicate in the first mode over a first channel; - a second time interval (DLM_SI) wherein the stations (STAl, STA2) communicate in the second mode over a second channel/ and - a third time interval (MIXED_SI) wherein the stations (STAl, STA2) communicate in either of the first (IM) or the second (DLM) mode.
Abstract:
A control device of a plurality of switching converters (Convl.ConvN) is disclosed; each converter comprises at least one power switch and is associated with a control circuit (Mod1 ...ModN) of the at least one power switch. The control device comprises means (100) suitable for comparing a signal (CTRL) representative of the load of the plurality of converters (ConvL.ConvN) with a plurality of reference signals (Vref1 ...Vref(N-l)) and suitable for enabling or disabling at least one of said plurality of control circuits (Mod1...ModN) in response to said comparison.
Abstract:
Described herein is a power device (10) having a first current-conduction terminal (A) , a second current-conduction terminal (K) , a control terminal (G) receiving, in use, a control voltage (VGATE) of the power device (10), and a thyristor device (12) and a first insulated-gate switch device (14) connected in series between the first and the second conduction terminals; the first insulated-gate switch device (14) has a gate terminal connected to the control terminal (G), and the thyristor device (12) has a base terminal (16) . The power device (10) is further provided with: a second insulated-gate switch device (18), connected between the first current-conduction terminal (A) and the base terminal (16) of the thyristor device (12) , and having a respective gate terminal connected to the control terminal (G) ; and a Zener diode (19) , connected between the base terminal (16) of the thyristor device (12) and the second current-conduction terminal (K) so as to enable extraction of current from the base terminal (16) in a given operating condition.
Abstract:
Process for manufacturing a semiconductor power device, wherein a trench (8) is formed in a semiconductor body (2) having a first conductivity type; the trench is annealed for shaping purpose (8a) ; and the trench (8a) is filled with semiconductor material via epitaxial growth so as to obtain a first column (9) having a second conductivity type. The epitaxial growth is performed by supplying a gas containing silicon and a gas containing dopant ions of the second conductivity type in presence of a halogenide gas and occurs with uniform distribution of the dopant ions. The flow of the gas containing dopant ions is varied according to a linear ramp during the epitaxial growth; in particular, in the case of selective growth of the semiconductor material in the presence of a hard mask, the flow decreases; in the case of non-selective growth, in the absence of hard mask, the flow increases .
Abstract:
The present invention relates to a method for designing a complex circuit architecture (1) including a plurality of circuit portions interconnected one to the other in said architecture, each circuit portions including a VLSI number of on-board transistors of both NMOS and PMOS type and wherein a circuit architecture core (2) is associated to at least a couple of body bias generators (3), one for said NMOS and one for said PMOS transistors; characterized by the following steps: - providing said circuit architecture core by a library of basic transistor cells having N and P MOS substrates separated from their corresponding source terminals; - monitoring the active current (Ion) in said transistors; - comparing the monitored current with a predetermined current value corresponding to standard or typical working conditions of said transistors according to the result of the comparison phase providing a reverse bias for those cells of the circuit architecture core to be compensated because of a possible excess of current leakage.