公开(公告)号：US08420427B2

公开(公告)日：2013-04-16

申请号：US11492671

申请日：2006-07-25

Applicant: Shawn Jay Cunningham ,  Dana Richard DeReus ,  Subham Sett ,  John Gilbert

Inventor： Shawn Jay Cunningham ,  Dana Richard DeReus ,  Subham Sett ,  John Gilbert

IPC: H01L21/00

CPC classification number: B81B3/0024 ,  B81B3/0051 ,  B81B2201/014 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/0015 ,  B81C2201/0107 ,  B81C2201/0108 ,  B81C2201/0109 ,  H01H1/04 ,  H01H1/504 ,  H01H59/0009 ,  H01H61/04 ,  H01H2001/0042 ,  H01H2001/0063 ,  H01H2001/0089 ,  H01H2059/0072 ,  H01H2061/006 ,  H01L23/3735 ,  H01L23/522 ,  H01L27/1203 ,  H01L2924/0002 ,  H01L2924/09701 ,  H02N1/006 ,  H02N10/00 ,  Y10T29/49222 ,  H01L2924/00

Abstract: Methods for Implementation of a Switching Function in a Microscale Device and for Fabrication of a Microscale Switch. According to one embodiment, a method is provided for implementing a switching function in a microscale device. The method can include providing a stationary electrode and a stationary contact formed on a substrate. Further, a movable microcomponent suspended above the substrate can be provided. A voltage can be applied between the between a movable electrode of the microcomponent and the stationary electrode to electrostatically couple the movable electrode with the stationary electrode, whereby the movable component is deflected toward the substrate and a movable contact moves into contact with the stationary contact to permit an electrical signal to pass through the movable and stationary contacts. A current can be applied through the first electrothermal component to produce heating for generating force for moving the microcomponent.

Abstract translation: 用于实现微尺度装置中的切换功能以及用于制造微型开关的方法。 根据一个实施例，提供了一种用于在微型设备中实现切换功能的方法。 该方法可以包括提供固定电极和形成在基板上的固定触点。 此外，可以提供悬浮在基板上方的可移动微型部件。 可以在微型组件的可动电极和固定电极之间施加电压，以使可动电极与固定电极静电耦合，由此可动部件朝向基板偏转，并且可动触点移动到与固定触点接触 允许电信号通过可移动和固定触点。 可以通过第一电热部件施加电流以产生用于产生用于移动微型部件的力的加热。

公开(公告)号：US08405170B2

公开(公告)日：2013-03-26

申请号：US12797649

申请日：2010-06-10

Applicant: Paul A. Kohl ,  Farrokh Ayazi ,  Paul J. Joseph

Inventor： Paul A. Kohl ,  Farrokh Ayazi ,  Paul J. Joseph

IPC: H01L29/84

CPC classification number: B81C1/00333 ,  B81C2201/0108 ,  B81C2203/0136 ,  B81C2203/0154 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Embodiments of the present disclosure provide systems and methods for producing micro electro-mechanical device packages. Briefly described, in architecture, one embodiment of the system, among others, includes a micro electro-mechanical device formed on a substrate layer; and a thermally decomposable sacrificial structure protecting at least a portion of the micro electro-mechanical device, where the sacrificial structure is formed on the substrate layer and surrounds a gas cavity enclosing an active surface of the micro electro-mechanical device. Other systems and methods are also provided.

公开(公告)号：US07977137B1

公开(公告)日：2011-07-12

申请号：US12152130

申请日：2008-05-08

Applicant: John L. Ebel ,  Rebecca Cortez ,  Kevin D. Leedy ,  Richard E. Strawser ,  Donald E. Strawser, legal representative

Inventor： John L. Ebel ,  Rebecca Cortez ,  Kevin D. Leedy ,  Richard E. Strawser

IPC: H01L21/00

CPC classification number: H01H59/0009 ,  B81B7/0064 ,  B81B2201/014 ,  B81B2201/018 ,  B81B2207/096 ,  B81C2201/0108 ,  B81C2203/0136 ,  B81C2203/0154 ,  H01H2059/0045

Abstract: A process for making a latching zip-mode actuated mono wafer MEMS switch especially suited to capacitance coupled signal switching of microwave radio frequency signals is disclosed. The single wafer fabrication process used for the switch employs sacrificial layers and liquid removal of these layers in order to also provide needed permanent physical protection for an ultra fragile switch moving arm member. Latched operation of the achieved MEMS switch without use of conventional holding electrodes or magnetic fields is also achieved. Fabrication of a single MEMS switch is disclosed however large or small arrays may be achieved. A liquid removal based fabrication process is disclosed.

Abstract translation: 公开了一种用于制造特别适用于微波射频信号的电容耦合信号切换的闭锁拉链模式致动单晶片MEMS开关的方法。 用于开关的单个晶片制造工艺采用牺牲层和这些层的液体移除，以便为超脆弱的开关移动臂构件提供所需的永久物理保护。 还实现了不使用常规保持电极或磁场的实现的MEMS开关的锁定操作。 公开了单个MEMS开关的制造，但是可以实现大的或小的阵列。 公开了一种基于液体去除的制造方法。

公开(公告)号：US20100203294A1

公开(公告)日：2010-08-12

申请号：US12766982

申请日：2010-04-26

Applicant: Paul A. Kohl ,  Sue Ann Bidstrup Allen ,  Xiaoqun Wu ,  Clifford Lee Henderson

Inventor： Paul A. Kohl ,  Sue Ann Bidstrup Allen ,  Xiaoqun Wu ,  Clifford Lee Henderson

IPC: B32B3/10

CPC classification number: G03F7/004 ,  B81B2201/058 ,  B81B2203/0338 ,  B81B2203/0384 ,  B81C1/00103 ,  B81C2201/0108 ,  C08J3/28 ,  C08K5/0041 ,  G03F7/40 ,  Y10T428/24479

Abstract: Polymers, methods of use thereof, and methods of decomposition thereof, are provided. One exemplary polymer, among others, includes, a photodefinable polymer having a sacrificial polymer and a photoinitiator.

Abstract translation: 提供聚合物，其使用方法及其分解方法。 一个示例性聚合物，其中包括具有牺牲聚合物和光引发剂的光可定义聚合物。

公开(公告)号：US07686907B1

公开(公告)日：2010-03-30

申请号：US11346398

申请日：2006-02-01

Applicant: Adam T. Woolley ,  Ryan T. Kelly ,  Melissa Draper Fisk

Inventor： Adam T. Woolley ,  Ryan T. Kelly ,  Melissa Draper Fisk

IPC: B32B17/00 ,  B32B17/10 ,  B32B37/00 ,  G02C7/00 ,  B29C65/00 ,  B29C53/82 ,  G01N21/00 ,  G01N31/22 ,  G01N33/00 ,  G01N15/06 ,  B01L11/00 ,  C03C15/00 ,  C03C25/68 ,  C03C27/00 ,  B32B38/04 ,  C02F1/40 ,  C02F11/00 ,  C25B9/00 ,  C25B11/00 ,  C25B13/00 ,  G01N27/00

CPC classification number: B32B38/06 ,  B01L3/502707 ,  B01L2200/0689 ,  B01L2300/0816 ,  B01L2300/0887 ,  B29C65/4895 ,  B29C65/76 ,  B29C66/0224 ,  B29C66/0246 ,  B29C66/026 ,  B29C66/032 ,  B29C66/1122 ,  B29C66/3242 ,  B29C66/53461 ,  B29C66/71 ,  B29C66/73117 ,  B29K2021/00 ,  B29K2033/12 ,  B29K2067/00 ,  B29K2067/043 ,  B29K2069/00 ,  B29K2083/00 ,  B29L2031/756 ,  B32B37/0023 ,  B32B2309/027 ,  B32B2323/16 ,  B32B2333/12 ,  B32B2367/00 ,  B32B2369/00 ,  B81B2201/058 ,  B81C1/00071 ,  B81C2201/0108 ,  B81C2203/038 ,  G01N21/05 ,  G01N27/44791 ,  G01N2021/0346 ,  G01N2021/6439 ,  B29K2067/003

Abstract: A microchip with capillaries and method for making same is described. A sacrificial material fills microchannels formed in a polymeric substrate, the filled microchannels are covered by a top cover to form filed capillaries, and the sacrificial material is removed to form the microcapillaries. The sacrificial material fills the microchannels as a liquid whereupon it becomes solid in the microchannels, and is liquefied after the top cover is applied and affixed to remove the sacrificial material. The top cover may be solvent sealed on the substrate and of the same or different material as the substrate. The top cover may also be an in situ applied semipermeable membrane.

Abstract translation: 描述了具有毛细管的微芯片及其制造方法。 牺牲材料填充形成在聚合物基材中的微通道，填充的微通道被顶盖覆盖以形成毛细管毛细管，并且去除牺牲材料以形成微毛细管。 牺牲材料作为液体填充微通道，随后在微通道中变成固体，并且在施加顶盖并固定以去除牺牲材料之后液化。 顶盖可以在基材上和与基材相同或不同的材料上进行溶剂密封。 顶盖也可以是原位应用的半透膜。

公开(公告)号：US20090304928A1

公开(公告)日：2009-12-10

申请号：US12478298

申请日：2009-06-04

Applicant: Taisuke Isano ,  Kosuke Asano ,  Yasushi Kaneda

Inventor： Taisuke Isano ,  Kosuke Asano ,  Yasushi Kaneda

IPC: B05D5/00

CPC classification number: B05D5/00 ,  B81C1/00126 ,  B81C2201/0108 ,  B81C2203/038

Abstract: A method for manufacturing a three-dimensional structure includes forming a first structure having a relief pattern on a substrate, forming a sacrifice layer on the first structure such that the sacrifice layer can be filled in a concave part of the first structure and the sacrifice layer can cover a surface of a convex part of the first structure on a side opposite to the substrate, forming a second structure having a relief pattern on the sacrifice layer, and a fourth step of removing the sacrifice layer from between the first structure and the second structure, and thereby bringing the second structure into contact with the surface of the first structure.

Abstract translation: 一种制造三维结构的方法包括在基板上形成具有浮雕图案的第一结构，在第一结构上形成牺牲层，使得牺牲层可以填充在第一结构的凹部中，牺牲层 可以在与基板相对的一侧覆盖第一结构的凸部的表面，在牺牲层上形成具有浮雕图案的第二结构，以及从第一结构和第二结构之间移除牺牲层的第四步骤 结构，从而使第二结构与第一结构的表面接触。

公开(公告)号：US20090280644A1

公开(公告)日：2009-11-12

申请号：US12434007

申请日：2009-05-01

Applicant: Aziz ZENASNI

Inventor： Aziz ZENASNI

IPC: H01L21/768

CPC classification number: B81C1/00047 ,  B81C2201/0108 ,  B81C2201/0128 ,  H01L21/7682

Abstract: The invention relates to a process for producing at least one air gap in a microstructure, which comprises:1) the supply of a microstructure comprising at least one gap filled with a sacrificial material that decomposes starting from a temperature θ1, this gap being delimited over at least one part of its surface by a non-porous membrane, composed of a material that forms a matrix and of a pore-forming agent that decomposes at a temperature θ2

公开(公告)号：US07531457B2

公开(公告)日：2009-05-12

申请号：US11561902

申请日：2006-11-21

Applicant: Yu-Fu Kang ,  Chen-Hsiung Yang

Inventor： Yu-Fu Kang ,  Chen-Hsiung Yang

IPC: H01L21/20

CPC classification number: B81C1/0015 ,  B81C2201/0108 ,  B81C2201/0132

Abstract: A method of fabricating a suspended structure. First, a substrate including a photoresist layer hardened by heat is provided. Subsequently, the hardened photoresist layer is etched so as to turn the photoresist layer into a predetermined edge profile. Thereafter, a structure layer is formed on parts of the substrate and parts of the photoresist layer. Next, a dry etching process is performed so as to remove the photoresist layer, and to turn the structure layer into a suspended structure.

Abstract translation: 一种制造悬挂结构的方法。 首先，提供包含通过热硬化的光致抗蚀剂层的基板。 随后，蚀刻硬化的光致抗蚀剂层，以使光致抗蚀剂层变成预定的边缘轮廓。 此后，在基板的一部分和光致抗蚀剂层的一部分上形成结构层。 接下来，进行干蚀刻处理以去除光致抗蚀剂层，并将结构层转变成悬浮结构。

公开(公告)号：US20070293023A1

公开(公告)日：2007-12-20

申请号：US11561902

申请日：2006-11-21

Applicant: Yu-Fu Kang ,  Chen-Hsiung Yang

Inventor： Yu-Fu Kang ,  Chen-Hsiung Yang

IPC: H01L21/20

CPC classification number: B81C1/0015 ,  B81C2201/0108 ,  B81C2201/0132

Abstract: A method of fabricating a suspended structure. First, a substrate including a photoresist layer hardened by heat is provided. Subsequently, the hardened photoresist layer is etched so as to turn the photoresist layer into a predetermined edge profile. Thereafter, a structure layer is formed on parts of the substrate and parts of the photoresist layer. Next, a dry etching process is performed so as to remove the photoresist layer, and to turn the structure layer into a suspended structure.

Abstract translation: 一种制造悬挂结构的方法。 首先，提供包含通过热硬化的光致抗蚀剂层的基板。 随后，蚀刻硬化的光致抗蚀剂层，以使光致抗蚀剂层变成预定的边缘轮廓。 此后，在基板的一部分和光致抗蚀剂层的一部分上形成结构层。 接下来，进行干蚀刻处理以去除光致抗蚀剂层，并将结构层转变成悬浮结构。

公开(公告)号：US07298015B2

公开(公告)日：2007-11-20

申请号：US10523267

申请日：2003-07-31

Applicant: Tohru Ishizuya

Inventor： Tohru Ishizuya

IPC: H01L29/82

CPC classification number: B81B3/0072 ,  B81C2201/0108 ,  G02B6/3518 ,  G02B6/3546 ,  G02B6/3572 ,  G02B6/3584 ,  G02B6/3596 ,  Y10S438/926

Abstract: A three-dimensional structure element having a plurality of three-dimensional structural bodies and capable of being uniformly formed without producing a dispersion in shape of the three-dimensional structural bodies, comprising a substrate (11) and the three-dimensional structural bodies (1) disposed in a predetermined effective area (20) on the substrate (11), the three-dimensional structural bodies (1) further comprising space parts formed in the clearances thereof from the substrate (11) by removing sacrificing layers, the substrate (11) further comprising a dummy area (21) having dummy structural bodies (33) so as to surround the effective area (20), the dummy structural body (33) further comprising space parts formed in the clearances thereof from the substrate (11) by removing the sacrificing layers, whereby since the dummy area (21) is heated merely to approx. the same temperature as the effective area (20) in an ashing process for removing the sacrificing layers to prevent a temperature distribution from occurring in the effective area (20).

Abstract translation: 一种具有多个三维结构体并能够均匀形成而不产生三维结构体形状分散的三维结构元件，包括基底（11）和三维结构体（1） ），所述三维结构体（1）还包括通过去除牺牲层从所述基板（11）形成在其间隙中的空间部分，所述基板（11）被布置在所述基板（11）上的预定有效区域（20） ）还包括具有虚拟结构体（33）以围绕所述有效区域（20）的虚拟区域（21），所述虚拟结构体（33）还包括通过所述基板（11）从所述基板（11）的间隙形成的空间部分， 去除牺牲层，由此由于虚拟区域（21）被加热到约 在用于去除牺牲层的灰化过程中与有效区域（20）相同的温度以防止在有效区域（20）中发生温度分布。