Abstract:
A field-emission cold cathode having emitters 9 formed on silicon substrate 1, and a gate electrode film 7 formed on insulation film 6 and having openings over the emitters, further includes trenches 3 formed in silicon substrate 1, a plurality of emitters formed on regions surrounded by trenches 3, and n-type regions 5 formed on the silicon substrate directly below the emitters. Breakdowns caused by field concentrations brought about by the spread of current directly below the emitters can thus be prevented, and thus the emitter pitch within regions surrounded by trenches can be determined at will. When high voltage is impressed due to a discharge, the resistance connected to the emitters prevents the flow of large currents to the emitters and the occurrence of short-circuit damage.
Abstract:
A field emitter array device includes a ceramic substrate member having a multiplicity of through conductive vias therein. An insulative material layer is located on the ceramic substrate member. An addressable array of gate and emitter line elements is located on the insulative material and is conductively coupled to the through substrate conductive vias. A backside connector is located on the ceramic substrate member and conductively coupled to the vias for connection of the ceramic substrate member with an array driver device for the addressable array of emitter and gate line elements. A field emitter array of field emitter elements on the insulative material layer of the ceramic substrate member which are operatively coupled with the addressable array of gate and emitter line elements.
Abstract:
A cold cathode field emission device is described. A key feature of its design is that groups of microtips share a single conductive disk with a reliable ballast resistor being interposed between each of these conductive disks and the cathode conductor. Additionally, a resistor, rather than a conductor, is used to connect the gate conductive disk to the gate electrode. The latter is arranged so as not to overlap with the cathode electrode. The cathode and gate conductive disks ensure that the ballast resistance associated with each microtip is essentially the same.
Abstract:
Electron field emission devices (cold cathodes), vacuum microelectronic devices and field emission displays which incorporate cold cathodes and methods of making and using same. More specifically, cold cathode devices comprising electron emitting structures grown directly onto a substrate material. The invention also relates to patterned precursor substrates for use in fabricating field emission devices and methods of making same and also to catalytically growing other electronic structures, such as films, cones, cylinders, pyramids or the like, directly onto substrates.
Abstract:
The present invention provides field emitter arrays (FEAs) having incorporated with metal oxide semiconductor field effect transistors (MOSFETs) and method for fabricating the same which realizes a simultaneous fabrication of two kinds of devices, namely, the FEA and MOSFETs, by using common processing steps among the processes of fabricating the Si-FEA or the metal FEA and the MOSFETs, wherein the method comprises steps of forming field emission tips and active regions for MOSFETs by oxidizing selected portions of the silicon nitride layer, forming a gate insulating oxide layers for the FEA and field oxide layers for MOSFETs simultaneously by the LOCOS method and connecting gate electrodes(row line) and cathode electrodes(column line) of the FEA to MOSFETs.
Abstract:
A method for fabricating a field emission display (FED) with improved junction leakage characteristics is provided. The method includes the formation of a light blocking element between a cathodoluminescent display screen of the FED and semiconductor junctions formed on a baseplate of the FED. The light blocking element protects the junctions from light formed at the display screen and light generated in the environment striking the junctions. Electrical characteristics of the junctions thus remain constant and junction leakage is improved. The light blocking element may be formed as an opaque light absorbing or light reflecting layer. In addition, the light blocking element may be patterned to protect predetermined areas of the baseplate and may provide other circuit functions such as an interconnect layer.
Abstract:
A charge dissipation field emission device (200, 300, 400) includes a supporting substrate (210, 310, 410), a cathode (215, 315, 415) formed thereon, a dielectric layer (240, 340, 440) formed on the cathode (215, 315, 415) and having emitter wells (260, 360, 460) and a charge dissipation well (252, 352, 452, 453) exposing a charge-collecting surface (248, 348, 448, 449), for bleeding off gaseous positive charge generated during the operation of the charge dissipation field emission device (200, 300, 400), an electron emitter (270, 370, 470) formed in each of the emitter wells (260, 360, 460), and an anode (280, 380, 480) spaced from the dielectric layer (240, 340, 440) for collecting electrons emitted by the electron emitters (270, 370, 470).
Abstract:
A field emission type display device capable of preventing a variation in luminance of the display device due to a variation in ambient temperature. A resistive layer is formed on cathode electrodes arranged in a display region and conical emitters are arranged on the resistive layer. The resistive layer is made of a semiconductor material, resulting in being varied in resistance depending on a temperature. A monitor resistive pattern made of the same material as the resistive layer is arranged so as to measure the resistance variation in the form of a voltage variation through an OP amplifier 11, which is then fed to the control circuit. The control circuit controls a gate voltage depending on the resistance to prevent a variation in luminance of the display device.
Abstract:
A gated electron-emitter is fabricated according to the process in which charged particles are directed towards a track-susceptible layer (48) to form charged-particle tracks (50B.sub.1) through the track-susceptible layer. Apertures (52.sub.1) are formed through the track-susceptible layer by etching along the charged-particle tracks. A gate layer (46) is etched through the apertures to form gate openings (54.sub.1) through the gate layer. An insulating layer (24) is etched through the gate openings to form dielectric open spaces (56.sub.1, 94.sub.1, 106.sub.1, or 114.sub.1) through the insulating layer down to a resistive layer (22B) of an underlying conductive region (22). Electron-emissive elements (30B, 30/88D.sub.1, 98/102.sub.1, or 118.sub.1) are formed in the dielectric open spaces over the resistive layer.
Abstract:
A cold cathode structure, useful for field emission displays, is disclosed. A thin resistive silicon film is disposed on a glass substrate; conductive emitter tips are disposed on top thereof. An alloy of amorphous silicon and amorphous carbon is used for the emitter tips. The proportion of the carbon in the alloy increases, gradually or abruptly, from the base to the top of the emitter tips. The carbon gradient is implemented during the process step, in which an n-type silicon layer is formed from which the emitter tips are made in subsequent masking and etching steps. The amount of carbon makes the emitter tips harder and gives lower work function at greater stability. Moreover, the carbon gradient allows for additional sharpening of the emitter tips.