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    IMPROVED PROBE CARD FOR TESTING INTEGRATED CIRCUITS
    311.
    发明公开
    IMPROVED PROBE CARD FOR TESTING INTEGRATED CIRCUITS 审中-公开

    公开(公告)号：EP3339868A1

    公开(公告)日：2018-06-27

    申请号：EP18151529.7

    申请日：2008-12-19

    Applicant: STMicroelectronics Srl

    Inventor： PAGANI, Alberto

    IPC: G01R1/073

    CPC classification number: G01R31/2889 ,  B62M25/04 ,  G01R1/0491 ,  G01R1/06727 ,  G01R1/07342

    Abstract: A probe card adapted for testing at least one integrated circuit integrated on corresponding at least one die of a semiconductor material wafer, the probe card including a board adapted for the coupling to a tester apparatus, and a plurality of probes coupled to the said board, wherein the probe card comprises a plurality of replaceable elementary units, each one comprising at least one of said probes for contacting externally-accessible terminals of an integrated circuit under test, the plurality of replaceable elementary units being arranged so as to correspond to an arrangement of at least one die on the semiconductor material wafer containing integrated circuits to be tested.

    DEVICE FOR MONITORING AT LEAST A PHYSICAL CHARACTERISTIC OF A BUILDING MATERIAL
    312.
    发明授权
    DEVICE FOR MONITORING AT LEAST A PHYSICAL CHARACTERISTIC OF A BUILDING MATERIAL 有权
    至少监测建筑材料物理特性的装置

    公开(公告)号：EP2469886B1

    公开(公告)日：2017-11-22

    申请号：EP11194627.3

    申请日：2011-12-20

    Applicant: STMicroelectronics Srl

    Inventor： Girlando, Giovanni ,  Finocchiaro, Alessandro

    IPC: H04Q9/00 ,  G01D21/02 ,  G01N33/38

    CPC classification number: H04Q9/00 ,  G01N33/38 ,  G08C2201/10 ,  H04Q2209/40 ,  H04Q2209/88 ,  Y10T29/49002

    Abstract: A monitoring device is for at least one physical characteristic of a building material. the monitoring device is buried inside a block of the building material and has a sensor to sense a physical characteristic thereof. The monitoring device includes a secondary inductor and a circuit coupled thereto, the circuit to generate an internal supply voltage for the sensor to transmit a signal representative of the physical characteristic. A wireless power supplier for the sensor is configured to generate a variable electromagnetic field, and has a dielectric layer and a resonant L-C circuit buried therein. The resonant L-C circuit has a primary inductor to be magnetically coupled to the secondary inductor of the sensor, with the wireless power supplier further having two current terminals being coupleable to an external reading circuit for the signal. The sensor is adjacent to the dielectric layer so as to magnetically couple the primary inductor and the secondary inductor.

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