THERMALLY CONDUCTIVE RESIN SHEET
    311.
    发明公开

    公开(公告)号:US20240141222A1

    公开(公告)日:2024-05-02

    申请号:US18280824

    申请日:2021-03-10

    Abstract: The heat-conducting resin sheet according to an aspect of the present invention comprises a thermally conductive plate-shaped particle, a thermally conductive spherical particle, and a resin, wherein the heat-conducting resin sheet has a thermal conductivity of 5 W/m·K or more and a 30% compressive strength B of 1500 kPa or less as measured at a compression rate of 1.0 mm/min. Furthermore, a volume ratio of the thermally conductive plate-shaped particle to the thermally conductive spherical particle (volume of thermally conductive plate-shaped particle/volume of thermally conductive spherical particle) is 30/70 to 90/10, and the total volume of the thermally conductive plate-shaped particle and the thermally conductive spherical particle is 30 to 90% by volume. According to the present invention, there can be provided a heat-conducting resin sheet that is excellent in the thermal conductivity and flexibility and can suppress the increase in the stress even when compressed quickly.

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