Abstract:
Portable, field-deployable laser synthesizer devices designed for multi-dimensional spectrometry and time-resolved and/or hyperspectral imaging include a coherent light source which simultaneously produces a very broad, energetic, discrete spectrum spanning through or within the ultraviolet, visible, and near infrared wavelengths. The light output is spectrally resolved and each wavelength is delayed with respect to each other. A probe enables light delivery to a target. For multidimensional spectroscopy applications, the probe can collect the resulting emission and deliver this radiation to a time gated spectrometer for temporal and spectral analysis.
Abstract:
A macroscopic fluorescence illumination assembly is provided for use with an imaging apparatus with a light-tight imaging compartment. The imaging apparatus includes an interior wall defining a view port extending into the imaging compartment to enable viewing of a specimen contained therein. The illumination assembly includes a specimen support surface facing toward the view port of the imaging apparatus. The support surface defines a window portion that enables the passage of light there through. The window portion is selectively sized and dimensioned such that the specimen, when supported atop the support surface, can be positioned and seated over the window portion in a manner forming a light-tight seal substantially there between.
Abstract:
A fiber optic darkfield ring light with many angled fiber optic light lines with direct illumination in a very small package. The fiber optic darkfield ring light includes a base with multiple light heads and multiple light covers attached thereto, a main cover, an optional cord grip, and an optional hood. It incorporates multiple fiber optic line arrays positioned at low angle and used in conjunction with a strobe light source.
Abstract:
The present invention is directed to solving the problems associated with the detection of surface defects on metal bars as well as the problems associated with applying metal flat inspection systems to metal bars for non-destructive surface defects detection. A specially designed imaging system, which is comprised of a computing unit, line lights and high data rate line scan cameras, is developed for the aforementioned purpose. The target application is the metal bars (1) that have a circumference/cross-section-area ratio equal to or smaller than 4.25 when the cross section area is unity for the given shape, (2) whose cross-sections are round, oval, or in the shape of a polygon, and (3) are manufactured by mechanically cross-section reduction processes. The said metal can be steel, stainless steel, aluminum, copper, bronze, titanium, nickel, and so forth, and/or their alloys. The said metal bars can be at the temperature when they are being manufactured. A removable cassette includes various mirrors. A protection tube isolates the moving metal bar from the line light assembly and image acquisition camera. A contaminant reduction mechanism applies a vacuum to remove airborne contaminants.
Abstract:
The present invention is directed to solving the problems associated with the detection of surface defects on metal bars as well as the problems associated with applying metal flat inspection systems to metal bars for non-destructive surface defects detection. A specially designed imaging system, which is comprised of a computing unit, line lights and high data rate line scan cameras, is developed for the aforementioned purpose. The target application is the metal bars (1) that have a circumference/cross-section-area ratio equal to or smaller than 4.25 when the cross section area is unity for the given shape, (2) whose cross-sections are round, oval, or in the shape of a polygon, and (3) are manufactured by mechanically cross-section reduction processes. The said metal can be steel, stainless steel, aluminum, copper, bronze, titanium, nickel, and so forth, and/or their alloys. The said metal bars can be at the temperature when they are being manufactured.
Abstract:
Fast on-line electro-optical detection of wafer defects by illuminating with a short light pulse from a repetitively pulsed laser, a section of the wafer while it is moved across the field of view of an imaging system, and imaging the moving wafer onto a focal plane assembly, optically forming a continuous surface of photo-detectors at the focal plane of the optical imaging system. The continuously moving wafer is illuminated by a laser pulse of duration significantly shorter than the pixel dwell time, such that there is effectively no image smear during the wafer motion. The laser pulse has sufficient energy and brightness to impart the necessary illumination to each sequentially inspected field of view required for creating an image of the inspected wafer die. A novel fiber optical illumination delivery system, which is effective in reducing the effects of source coherence is described. Other novel aspects of the system include a system for compensating for variations in the pulse energy of a Q-switched laser output, methods for autofocussing of the wafer imaging system, and novel methods for removal of repetitive features of the image by means of Fourier plane filtering, to enable easier detection of wafer defects.
Abstract:
Fast on-line electro-optical detection of wafer defects by illuminating with a short light pulse from a repetitively pulsed laser, a section of the wafer while it is moved across the field of view of an imaging system, and imaging the moving wafer onto a focal plane assembly, optically forming a continuous surface of photo-detectors at the focal plane of the optical imaging system. The continuously moving wafer is illuminated by a laser pulse of duration significantly shorter than the pixel dwell time, such that there is effectively no image smear during the wafer motion. The laser pulse has sufficient energy and brightness to impart the necessary illumination to each sequentially inspected field of view required for creating an image of the inspected wafer die. A novel fiber optical illumination delivery system, which is effective in reducing the effects of source coherence is described. Other novel aspects of the system include a system for compensating for variations in the pulse energy of a Q-switched laser output, methods for autofocussing of the wafer imaging system, and novel methods for removal of repetitive features of the image by means of Fourier plane filtering, to enable easier detection of wafer defects.
Abstract:
A dual illumination system is disclosed for use with an imaging apparatus. The imaging apparatus defines a light-tight imaging compartment with an interior wall having a view port extending into the imaging compartment. This view port enables data acquisition of a biological specimen contained in the imaging compartment. The dual illumination system includes a first illumination assembly configured to direct structured light onto a first side of the specimen to enable structured light and surface topography measurements thereof. A second illumination assembly then directs light at the specimen wherein diffused fluorescent light emanates from a surface thereof for receipt through the view port to acquire fluorescence data of the specimen. The combination of structured light imaging and fluorescence imaging enables 3D diffuse tomographic reconstructions of fluorescent probe location and concentration.
Abstract:
A macroscopic fluorescence illumination assembly is provided for use with an imaging apparatus with a light-tight imaging compartment. The imaging apparatus includes an interior wall defining a view port extending into the imaging compartment to enable viewing of a specimen contained therein. The illumination assembly includes a specimen support surface sized and dimensioned for receipt in the imaging compartment, and oriented to face toward the view port of the imaging apparatus. The support surface is substantially opaque and defines a window portion that enables the passage of light there through. The window portion is selectively sized and dimensioned such that the specimen, when supported atop the support surface, can be positioned and seated over the window portion in a manner forming a light-tight seal substantially there between. The illumination assembly further includes an excitation light source, and a bundle of fiber optic strands having proximal ends thereof in optical communication with the light source. The distal ends of the strands terminate proximate the window portion of the support surface. The distal ends each emit a respective beam of light originating from the light source which are then collectively directed toward the window portion and into a bottom side of the specimen wherein the diffused light passes there through and exits a topside thereof for receipt through the view port to view the fluorescence of the specimen.
Abstract:
Fast on-line electro-optical detection of wafer defects by illuminating with a short light pulse from a repetitively pulsed laser, a section of the wafer while it is moved across the field of view of an imaging system, and imaging the moving wafer onto a focal plane assembly, optically forming a continuous surface of photo-detectors at the focal plane of the optical imaging system. The continuously moving wafer is illuminated by a laser pulse of duration significantly shorter than the pixel dwell time, such that there is effectively no image smear during the wafer motion. The laser pulse has sufficient energy and brightness to impart the necessary illumination to each sequentially inspected field of view required for creating an image of the inspected wafer die. A novel fiber optical illumination delivery system, which is effective in reducing the effects of source coherence is described. Other novel aspects of the system include a system for compensating for variations in the pulse energy of a Q-switched laser output, methods for autofocussing of the wafer imaging system, and novel methods for removal of repetitive features of the image by means of Fourier plane filtering, to enable easier detection of wafer defects.