RESIN COMPOSITION
    388.
    发明公开
    RESIN COMPOSITION 审中-公开

    公开(公告)号:US20240166866A1

    公开(公告)日:2024-05-23

    申请号:US18182399

    申请日:2023-03-13

    CPC classification number: C08L71/00 C08L2201/08

    Abstract: A resin composition is provided. The resin composition includes a resin and an inorganic filler. The resin includes a bismaleimide resin and a polyphenylene ether resin. The inorganic filler includes a first inorganic filler and a second inorganic filler. An average particle size of the first inorganic filler is 0.3 μm to 0.6 μm. An average particle size of the second inorganic filler is 20 μm to 50 μm.

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