公开(公告)号：US20250115756A1

公开(公告)日：2025-04-10

申请号：US18498059

申请日：2023-10-31

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Hung-Yi Chang ,  Chia-Lin Liu ,  Ren-Yu Liao

IPC: C08L63/00 ,  B32B5/02 ,  B32B15/14 ,  B32B15/20 ,  C08J5/24

Abstract: The disclosure provides a resin composition, a substrate, and a copper clad laminate, wherein the resin composition includes a naphthalene ring epoxy resin, a bismaleimide resin, a crosslinking agent, polysiloxane, an accelerator, and a filler.

公开(公告)号：US20240174849A1

公开(公告)日：2024-05-30

申请号：US18071629

申请日：2022-11-30

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Wei-Ru Huang ,  Hung-Yi Chang ,  Chia-Lin Liu

IPC: C08L47/00 ,  C08J5/24

CPC classification number: C08L47/00 ,  C08J5/244 ,  C08J2347/00 ,  C08J2471/12

Abstract: A resin composition is provided, which includes a novel low-dielectric resin, a cross-linking agent, a polyphenylene ether resin, a halogen-free flame retardant, a spherical silica, and a siloxane coupling agent. The novel low-dielectric resin has a styrene proportion of 10% to 40%, a divinylbenzene proportion of 10% to 40%, and an ethylene proportion of 10% to 20%, which may effectively reduce the dissipation factor of the resin composition, and achieve the electrical specification of low dielectric.

公开(公告)号：US20240174779A1

公开(公告)日：2024-05-30

申请号：US18149155

申请日：2023-01-03

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Wei-Ru Huang ,  Hung-Yi Chang ,  Chia-Lin Liu ,  HungFan Lee

IPC: C08F212/08 ,  C08F210/02 ,  C08F212/36 ,  C08F236/06 ,  C08G65/48 ,  C08K3/36 ,  C08K5/49 ,  C08K5/5425 ,  C08K9/08

CPC classification number: C08F212/08 ,  C08F210/02 ,  C08F212/36 ,  C08F236/06 ,  C08G65/485 ,  C08K3/36 ,  C08K5/49 ,  C08K5/5425 ,  C08K9/08 ,  C08G2650/04 ,  C08K2201/003

Abstract: A resin composition is provided. The resin composition includes a resin mixture, a flame retardant, a spherical silica and a siloxane coupling agent. The resin mixture includes a first resin polymerized by a monomer mixture including styrene, divinylbenzene and ethylene, a second resin including a polyphenylene ether resin modified by bismaleimide, and a SBS resin. The resin composition of the present disclosure can have a high glass transition temperature, a low dielectric constant and a low dissipation factor.

公开(公告)号：US20240158632A1

公开(公告)日：2024-05-16

申请号：US18074526

申请日：2022-12-05

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Wei-Ru Huang ,  Hung-Yi Chang ,  Chia-Lin Liu

IPC: C08L71/12

CPC classification number: C08L71/123 ,  C08L2205/03

Abstract: A resin composition is provided, which includes a novel low dielectric resin, a SBS resin, a cross-linking agent, a PPE resin, a halogen-free flame retardant, a spherical silica, and a siloxane coupling agent. The novel low dielectric resin is a maleimide resin. With the formula, the resin composition may improve resin fluidity and glass transition temperature (Tg) while maintaining low dielectric, thereby enhancing the overall processability.

公开(公告)号：US20240101485A1

公开(公告)日：2024-03-28

申请号：US17987801

申请日：2022-11-15

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Hung-Yi Chang ,  Chia-Lin Liu

IPC: C04B35/628 ,  C08K5/5415

CPC classification number: C04B35/62849 ,  C04B35/62852 ,  C08K5/5415

Abstract: A powder composition includes a first powder, a second powder, and a modified functional group. A particle size range of the first powder is between 1 micron and 100 microns. The second powder and the modified functional group are modified on the first powder. A particle size range of the second powder is between 10 nanometers and 1 micron. A manufacturing method of a powder composition is also provided.

公开(公告)号：US10781297B2

公开(公告)日：2020-09-22

申请号：US15834259

申请日：2017-12-07

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Ying-Te Huang ,  Hao-Sheng Chen ,  Hung-Yi Chang ,  Chia-Lin Liu

IPC: C08K5/5333 ,  H05K1/09 ,  C08K3/36 ,  C08J5/24 ,  B32B15/14 ,  B32B17/04 ,  B32B15/20 ,  C08L71/12 ,  C08K3/22 ,  C08K5/20 ,  C08K5/3492 ,  C08K5/52 ,  C08K3/26 ,  C08K5/523 ,  C08K5/02

Abstract: A thermosetting resin composition contains a primary resin formed from mixing a styrene-type polyphenylene ether resin thermally modified with styrene with an acrylic-type polyphenylene ether resin thermally modified with acrylic at a weight ratio ranging between 0.5 and 1.5, consequently having excellent heat resistance, flowability, and filling ability; and when cured, having a dielectric constant smaller than 3.0 and a dielectric dissipation factor smaller less than 0.0020 at the frequency of 1 GHz as well as a glass transition temperature higher than 210° C.; in application, the composition is suitable to impregnate reinforcement to form prepregs with excellent curability.

公开(公告)号：US20250002621A1

公开(公告)日：2025-01-02

申请号：US18448962

申请日：2023-08-13

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Wei-Ru Huang ,  Hung-Yi Chang ,  Chia-Lin Liu

IPC: C08F212/08 ,  C08F210/02 ,  C08F212/36 ,  C08G65/48 ,  C08K3/36 ,  C08K5/01 ,  C08K5/3415 ,  C08L53/02

Abstract: A resin composition includes a resin mixture. The resin mixture includes a first resin polymerized by a monomer mixture including styrene, divinylbenzene and ethylene; a second resin including polyphenylene ether resin modified by bismaleimide; a third resin block polymerized by a monomer mixture including styrene and butadiene; and an acenaphthylene.

公开(公告)号：US20240228779A1

公开(公告)日：2024-07-11

申请号：US18170529

申请日：2023-02-17

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Wei-Ru Huang ,  Hung-Yi Chang ,  Chia-Lin Liu

IPC: C08L79/04 ,  C08L71/12 ,  C08L79/08

CPC classification number: C08L79/04 ,  C08L71/12 ,  C08L79/08 ,  C08L2201/02 ,  C08L2205/025 ,  C08L2205/035

Abstract: A resin composition includes CE resin, BMI resin, and a modified polyphenylene ether resin has a following general formula:






wherein R represents a chemical group of a bisphenol compound located between two hydroxyphenyl functional groups thereof, and n is an integer ranging from 3 to 25.

公开(公告)号：US20240150568A1

公开(公告)日：2024-05-09

申请号：US18184696

申请日：2023-03-16

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Hung-Yi Chang ,  Chia-Lin Liu ,  Wei-Ru Huang

IPC: C08L27/18

CPC classification number: C08L27/18 ,  C08L2201/08 ,  C08L2205/025

Abstract: The invention provides a high thermal conductivity fluororesin composition and products thereof. The high thermal conductivity fluororesin composition includes a polytetrafluoroethylene resin, a fluorine-containing copolymer, spherical inorganic fillers and impregnation aids.

公开(公告)号：US20240124689A1

公开(公告)日：2024-04-18

申请号：US17985914

申请日：2022-11-14

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Hung-Yi Chang ,  Chia-Lin Liu

IPC: C08L9/06

CPC classification number: C08L9/06 ,  C08L2205/025 ,  C08L2205/03

Abstract: A resin composition includes resin and inorganic filler. The resin includes liquid rubber resin, polyphenylene ether resin, and a crosslinking agent. Compared to a total of 100 parts by mass of the resin, the usage amount of the inorganic filler is at least greater than or equal to 40 parts by mass.