Abstract:
PURPOSE: To output a calibrated measurement signal showing a characteristic by providing a signal conversion/conditioning circuit for conditioning a tranducer output by combination of parameters involved in both to be converted to an intermediate signal having a voltage amplitude related to the characteristic of an object. CONSTITUTION: A measurement circuit 14 has an object 12, and a transducer 20 such as a capacity type probe, and further has a signal conversion/ conditioning circuit 22. A front end circuit 22a of the circuit 22 converts a capacitance shown by a transducer output signal 27 to an intermediate signal having a voltage amplitude related to the distance between the tranducer 20 and the object 12. A signal conditioning circuit 22b processes a signal 29 to output a calibrated measurement value signal 32, which is displayed for a user by a display/post-processing circuit 16. The tranducer 20 has parameters (a), (b), and the circuit 22a has parameters (c), (d), and is controlled according to the fluctuation by adjustable constitutive parts 30a, 30b which the circuit 22 has. Thus, the need of controlling the whole system each sub-system can be eliminated.
Abstract:
PURPOSE: To coincide the center point of an element with a reference point by providing a means for aligning the element in a first motion direction along a predetermined straight line when the misalignment of the element is along the straight line and moving the element on an element holder in a linear direction as the function of misalignment. CONSTITUTION: A wafer 22 is disposed so as to generate misalignment along a predetermined linear direction, and the first motion direction of a holder 20, a second motion direction around an axis and a third motion direction in a vertical direction are created by a linear manipulator having the holder 20 on two articulated leg arms 14 and 16 and a means for bending the legs of the arms. Then, if the misalignment of the wafer 22 is along a straight line, the wafer is aligned with the first motion direction along a predetermined straight line, and the wafer 22 gripped by the holder 20 is moved in a linear direction as the function of the misalignment.
Abstract:
An electronics system and method for processing the output of a dimension sensing capacitive gauge or probe having a measured capacitance between electrodes. Control of the capacitive gauge''s output through control of its excitation allows a parameter of the excitations output to be used as an indication directly proportional to a dimension, typically electrode separation, which varies inversely with the capacitance between the electrodes. An output from a second similar gauge is used to deflect a meter for a direct indication of the dimension. Alternatively a second excitation for the second gauge is provided with its output used to control the first excitation whereby the frequency ratio of the two excitations provides a direction indication of the dimension and is easily digitized. Environmentally induced changes in either gauge are balanced by proximity of the gauges and the excitation amplitude is regulated.
Abstract:
An impedance comparing circuit for supplying excitation to equal or unequal reference and sensing impedances with a ground referenced output signal indicative of the difference between impedances. A diode matrix excites the reference and sensing impedances from an oscillator through first and second DC blocking impedances respectively during one polarity of current and in the reverse relationship during the opposite polarity of current. Low impedance values in the first and second impedances provide near equality in the voltage across the reference and sensing impedances and minimize the effect of capacitance between them. Tuning or increased diode matrix impedances will augment the sensitivity at a sacrifice in the elimination of the effect of capacitance between the reference and sensing impedances.
Abstract:
PROBLEM TO BE SOLVED: To provide a system that is improved to avoid the impairment or the contamination of a wafer when it is handled, processed, or measured. SOLUTION: Vertical type wafer processed equipment is prepared, and only the edge of a wafer is brought into contact with it. If a wafer is handled vertically, air flows such that it vertically crosses it, and thus, contamination by minute particles partially decreases. The distortion of the wafer may be caused by its gravity when it is handled horizontally, but this can be decreased by handling the wafer vertically. If contact with the wafer is limited to its edge, potentially harmful influences by the contact such as contamination or a damage are conveniently decreased. Further, if the wafer is handled at its edge part, both sides of the wafer can be made to serve as an effective range for measurement. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a non-contact capacitive displacement sensor capable of measuring the position of a non-planar object. SOLUTION: A probe 300 is shaped to have a radius of curvature r P substantially matching the shape of the cylindrical surface of a target 308, to measure a uniform space r P -r T between the sensor at the probe tip and the shaped target 308. Since the space between the sensor and the target 308 is uniform, an accurate measured value r P -r T of the uniform space is determined introducing a well-known equation showing the general relationship between the capacity and space of a parallel plate capacitor. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a system and method of inspecting semiconductor wafers capable of determining the height of a defect on a wafer surface whether or not the scattering power associated with the defect exceeds the dynamic range of the system. SOLUTION: In the wafer defect inspection system, when the defect on the wafer surface is detected, the three-dimensional shape of the defect is regarded as a Gaussian shape. A plurality of cross-sectional areas of the Gaussian shape are defined, a respective value of each cross-sectional area is determined, and a respective value of the natural logarithm of intermediate heights of the Gaussian shape corresponding to the cross-sectional areas is determined. The cross-sectional area values are plotted as a function of the natural logarithm of the intermediate height values to form a substantially linear plot, a natural logarithm of the height value corresponding to a zero area value based on the substantially linear plot is determined, and the inverse natural logarithm of the value is determined to obtain the height of the Gaussian shape. COPYRIGHT: (C)2005,JPO&NCIPI