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    INTEGRATING SEMICONDUCTOR WAFER DATA
    6.
    发明申请
    INTEGRATING SEMICONDUCTOR WAFER DATA 审中-公开
    集成半导体波形数据

    公开(公告)号：WO2006017155A3

    公开(公告)日：2006-08-31

    申请号：PCT/US2005024209

    申请日：2005-07-08

    Applicant: ADE CORP

    Inventor： KECK JAY ,  KALLUS DAVID M

    IPC: G01M99/00 ,  G06F19/00

    CPC classification number: G06F17/30554 ,  G01N21/9501 ,  G05B19/41875 ,  G05B2219/2602 ,  G06Q10/06 ,  G06Q50/04 ,  H01L21/67005 ,  H01L21/67253 ,  Y02P90/18 ,  Y02P90/22 ,  Y02P90/30

    Abstract: A system for integrating semiconductor wafer data for use in silicon manufacturing and device fabrication processes, the system including: a data acquisition system (00) capable of acquiring scan data from differing types of semiconductor wafer scanning tools such as wafer dimensional tools (10), wafer inspection tools (12), and wafer nanotopography tools (14), a buffer system (02) for providing temporary storage for scan data transmitted and for providing fault tolerance; a server system (04) for providing storage for the scan data transmitted from the buffer system (02) and for converting the scan data into a format used by and stored in a database (08) management system; and an analysis system (06), the analysis system (06) and the server system (04) providing wafer data management, process monitoring, wafer data analysis, and data automation.

    Abstract translation: 一种用于集成用于硅制造和器件制造工艺的半导体晶片数据的系统，所述系统包括：能够从不同类型的半导体晶片扫描工具（例如晶片尺寸工具（10））获取扫描数据的数据采集系统（00） 晶片检查工具（12）和晶片纳米成像工具（14），缓冲系统（02），用于为发送的扫描数据提供临时存储并提供容错; 服务器系统（04），用于提供从缓冲系统（02）发送的扫描数据的存储，并将扫描数据转换成数据库（08）管理系统使用和存储的格式; 分析系统（06），分析系统（06）和服务器系统（04），提供晶片数据管理，过程监控，晶片数据分析和数据自动化。

    METHOD AND SYSTEM FOR CLASSIFIYING DEFECTS OCCURRING AT A SURFACE OF A SUBSTRATE USING GRAPHICAL REPRESENTATION OF MULTI-CHANNEL DATA
    7.
    发明申请
    METHOD AND SYSTEM FOR CLASSIFIYING DEFECTS OCCURRING AT A SURFACE OF A SUBSTRATE USING GRAPHICAL REPRESENTATION OF MULTI-CHANNEL DATA 审中-公开
    使用多通道数据的图形表示对基板表面进行分类缺陷的方法和系统

    公开(公告)号：WO2004111618A3

    公开(公告)日：2005-05-06

    申请号：PCT/US2004018323

    申请日：2004-06-09

    Applicant: ADE CORP ,  TIEMEYER TIMOTHY R ,  AKUTSU JAMES S ,  SALTER ROBERT J ,  ZENG YU

    Inventor： TIEMEYER TIMOTHY R ,  AKUTSU JAMES S ,  SALTER ROBERT J ,  ZENG YU

    IPC: G01N21/95 ,  G06K9/62 ,  G06T7/00 ,  G06T11/20

    CPC classification number: G06T7/0004 ,  G01N21/9501 ,  G06K9/62 ,  G06K9/6253 ,  G06T7/0002 ,  G06T11/206 ,  G06T2207/30148

    Abstract: A population of data points each having three or more parameters associated therewith, such as multi-channel defect data from an optical scanner, are plotted in three dimensions, and grouping of data points are identified. Boundary surfaces are defined in the three-dimensional space for delineating groupings of data points. The different groupings correspond to different data classifications or types. Classification algorithms based on the boundary surfaces are defined. When applied to defect classification, the algorithms can be exported to an optical scanner for runtime classification of defects. An algorithm for identifying a particular grouping of data points can be defined as a Boolean combination of grouping rules from two or more different n-dimensional representations, where n can be either 2 or 3 for each representation.

    Abstract translation: 每个具有与其相关联的三个或多个参数的数据点的数据点（诸如来自光学扫描仪的多通道缺陷数据）被绘制在三维中，并且识别数据点的分组。 边界面在三维空间中定义，用于描绘数据点的分组。 不同的分组对应于不同的数据分类或类型。 定义基于边界面的分类算法。 当应用于缺陷分类时，算法可以导出到光学扫描仪中以进行缺陷的运行时分类。 用于识别数据点的特定分组的算法可以被定义为来自两个或更多个不同n维表示的分组规则的布尔组合，其中对于每个表示，n可以是2或3。

    RING CHUCK TO HOLD 200 AND 300 MM WAFER
    8.
    发明申请
    RING CHUCK TO HOLD 200 AND 300 MM WAFER 审中-公开
    戒指保持200和300毫米波形

    公开(公告)号：WO0217354A9

    公开(公告)日：2003-08-28

    申请号：PCT/US0126084

    申请日：2001-08-21

    Applicant: ADE CORP

    Inventor： GAAL CHRISTOPHER ,  SINHA JAYDEEP

    IPC: H01L21/66 ,  H01L21/208 ,  H01L21/683 ,  G01N21/01

    CPC classification number: H01L21/6838

    Abstract: A ring chuck (70) that holds a wafer (8) with a vacuum uses a vacuum trough (80) that contacts the entire outer edge of the wafer (8). The chuck (70) has a base (72) having a top surface (96) equal to or slightly smaller than a wafer (8) to be tested with vacuum channels in the base (72). The base (72) provides the mechanism to connect the chuck to a measurement instrument and a vacuum source. An annulus (74) of non-contaminant material that has a plurality of concentric rings (76) extending upward from its outer edge is fixed to the base top surface (96) with the trough (80) between the concentric rings (76) connected to the vacuum channels (82). The vacuum trough (80) holds the wafer (8) securely to the chuck and minimizes vibrations when the wafer (8) is rotated. When the plurality of concentric rings (76) are contained within the wafer (8) exclusion band, the print through onto the tested are is minimized.

    Abstract translation: 用真空保持晶片（8）的环形卡盘（70）使用与晶片（8）的整个外边缘接触的真空槽（80）。 卡盘（70）具有基座（72），其具有等于或略小于要在基座（72）中的真空通道进行测试的晶片（8）的顶表面（96）。 基座（72）提供将卡盘连接到测量仪器和真空源的机构。 具有从其外边缘向上延伸的多个同心环（76）的非污染物质的环（74）被固定到基座顶表面（96）上，在同心环（76）连接的槽（80） 到真空通道（82）。 真空槽（80）将晶片（8）牢固地保持在卡盘上并使晶片（8）旋转时的振动最小化。 当多个同心环（76）被包含在晶片（8）排除带内时，打印到被测试的部分被最小化。

    SHAPE ACCURACY IMPROVEMENT USING A NOVEL CALIBRATION APPROACH
    9.
    发明申请
    SHAPE ACCURACY IMPROVEMENT USING A NOVEL CALIBRATION APPROACH 审中-公开
    使用新的校准方法形状精度改进

    公开(公告)号：WO0211183B1

    公开(公告)日：2002-07-11

    申请号：PCT/US0123998

    申请日：2001-07-31

    Applicant: ADE CORP

    Inventor： DROHAN WILLIAM ,  GOLDFARB WILLIAM ,  HARVEY PETER ,  SINHA JAYDEEP

    IPC: G01B21/20 ,  G01B11/30 ,  H01L21/00 ,  H01L21/66 ,  G06F11/00 ,  G06F19/00

    CPC classification number: H01L21/67253 ,  G01B11/306 ,  H01L22/20 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Determining the systematic error of an instrument that measures features of a semiconductor wafer which a symmetric corrector is calculated by taking the average over all measurement signatures at each load angle. The symmetric corrector is successively rotated to the same angle as a front shape measurement and subtracted, yielding a calibrated wafer data set (80). A wafer mean is computed by averaging these calibrated wafer shape measurements (82). When the wafer mean is substracted from the individual front side corrected shape measurements, a set of shape residual maps for each load angle results (84). The average of the aligned residuals is the asymmmetric error (86). The systematic error is the sum of the symmetric and asymmetric errors (90).

    Abstract translation: 确定测量半导体晶片的特征的仪器的系统误差，通过在每个负载角度对所有测量特征进行平均，计算对称校正器。 将对称校正器依次旋转到与正面形状测量相同的角度并减去，得到校准的晶片数据组（80）。 通过平均这些校准的晶片形状测量值（82）来计算晶片平均值。 当晶片平均值从单个前侧校正形状测量值减去时，每个负载角度的一组形状残差图形成（84）。 对齐残差的平均值是非对称误差（86）。 系统误差是对称和非对称误差的总和（90）。

    RING CHUCK TO HOLD 200 AND 300 MM WAFER
    10.
    发明申请
    RING CHUCK TO HOLD 200 AND 300 MM WAFER 审中-公开
    戒指保持200和300毫米波形

    公开(公告)号：WO0217354A3

    公开(公告)日：2002-06-06

    申请号：PCT/US0126084

    申请日：2001-08-21

    Applicant: ADE CORP

    Inventor： GAAL CHRISTOPHER ,  SINHA JAYDEEP

    IPC: H01L21/66 ,  H01L21/208 ,  H01L21/683 ,  G01N21/01

    CPC classification number: H01L21/6838

    Abstract: A ring chuck (70) that holds a wafer (8) with a vacuum uses a vacuum trough (80) that contacts the entire outer edge of the wafer (8). The chuck (70) has a base (72) having a top surface (96) equal to or slightly smaller than a wafer (8) to be tested with vacuum channels in the base (72). The base (72) provides the mechanism to connect the chuck to a measurement instrument and a vacuum source. An annulus (74) of non-contaminant material that has a plurality of concentric rings (76) extending upward from its outer edge is fixed to the base top surface (96) with the trough (80) between the concentric rings (76) connected to the vacuum channels (82). The vacuum trough (80) holds the wafer (8) securely to the chuck and minimizes vibrations when the wafer (8) is rotated. When the plurality of concentric rings (76) are contained within the wafer (8) exclusion band, the print through onto the tested are is minimized.

    Abstract translation: 用真空保持晶片（8）的环形卡盘（70）使用与晶片（8）的整个外边缘接触的真空槽（80）。 卡盘（70）具有基座（72），其具有等于或略小于要在基座（72）中的真空通道进行测试的晶片（8）的顶表面（96）。 基座（72）提供将卡盘连接到测量仪器和真空源的机构。 具有从其外边缘向上延伸的多个同心环（76）的非污染物质的环形区域（74）被固定到基座顶面（96），同心环（76）连接的槽（80） 到真空通道（82）。 真空槽（80）将晶片（8）牢固地保持在卡盘上并使晶片（8）旋转时的振动最小化。 当多个同心环（76）被包含在晶片（8）排除带内时，打印到被测试的部分被最小化。

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