公开(公告)号：US20090324619A1

公开(公告)日：2009-12-31

申请号：US12491521

申请日：2009-06-25

Applicant: Jaulang Hwang ,  Chun-Cheng Lin ,  Hsiao-Ling Chiang ,  Fan-Dan Jan ,  Chiao-En Chen ,  Chia-Tse Shu

Inventor： Jaulang Hwang ,  Chun-Cheng Lin ,  Hsiao-Ling Chiang ,  Fan-Dan Jan ,  Chiao-En Chen ,  Chia-Tse Shu

IPC: A61K39/00 ,  C07K16/00 ,  C07H21/00 ,  A61P37/04

CPC classification number: C07K14/21 ,  A61K39/00 ,  A61K39/0011 ,  C07K14/28 ,  C07K14/33 ,  C07K16/3076 ,  C07K16/3084 ,  C07K2319/30 ,  C07K2319/55 ,  Y02A50/472

Abstract: A protein carrier containing an antigen presenting cell binding domain and a cysteine-rich domain. Also described herein is an immunoconjugate containing the protein carrier with an antigen conjugated to multiple cysteine residues in the cysteine-rich domain, and an immune composition containing the immunoconjugate and an adjuvant, as well as their uses in eliciting immune responses.

Abstract translation: 含有抗原呈递细胞结合结构域和富含半胱氨酸的结构域的蛋白质载体。 本文还描述了含有具有与富含半胱氨酸的结构域中的多个半胱氨酸残基缀合的抗原的蛋白质载体的免疫缀合物，以及含有免疫缀合物和佐剂的免疫组合物，以及它们在引发免疫应答中的用途。

公开(公告)号：US20080117621A1

公开(公告)日：2008-05-22

申请号：US11599985

申请日：2006-11-16

Applicant: Chun-Cheng Lin

Inventor： Chun-Cheng Lin

IPC: F21V33/00

CPC classification number: F21V33/008 ,  A47J37/0786 ,  F21V17/007 ,  F21V21/32 ,  F21V21/34 ,  F21V21/40

Abstract: A lighting device for a barbecue stove includes a handle assembly, and a lamp assembly retractably mounted on the handle assembly. The handle assembly includes two spaced fixing seats, and an elongate hollow handle. The lamp assembly includes a guide track, a slide, a receiving seat, a lighting seat, and a flexible pipe. Thus, the lamp assembly is retracted into and stored in the handle assembly when not in use, so that the lamp assembly does not occupy any space, thereby facilitating a user storing the lamp assembly.

Abstract translation: 一种用于烧烤炉的照明装置包括手柄组件和可收回地安装在手柄组件上的灯组件。 手柄组件包括两个间隔开的固定座和细长的中空手柄。 灯组件包括导轨，滑块，接收座，照明座和柔性管。 因此，灯组件在不使用时缩回到手柄组件中并存储在手柄组件中，使得灯组件不占据任何空间，从而便于用户存放灯组件。

公开(公告)号：US20060053846A1

公开(公告)日：2006-03-16

申请号：US10937299

申请日：2004-09-10

Applicant: Lan-Shi Huang ,  Chun-Cheng Lin

Inventor： Lan-Shi Huang ,  Chun-Cheng Lin

IPC: E05B59/00 ,  E05B63/14

CPC classification number: E05B15/02 ,  E05B65/1086 ,  Y10T70/5226

Abstract: A lock assembly includes a fixing plate fixed to an inner side of a door. An inside rose liner is fixed to the fixing plate. A shaft is rotatably mounted in an axial hole of the fixing plate and coupled with a tail piece of an auxiliary lock body. An inside handle includes an inside spindle rotatably mounted in another axial hole of the fixing plate. A control mechanism includes a sliding plate slidably mounted in the inside rose liner, a driving wheel mounted on the inside spindle to turn therewith, and a driven wheel mounted on the shaft to turn therewith. Each of the driving wheel and the driven wheel includes at least one pressing section on an outer periphery thereof for pressing against an associated pressing portion of the sliding plate. The auxiliary lock is simultaneously unlatched when the inside handle is turned.

Abstract translation: 锁组件包括固定在门的内侧的固定板。 里面的玫瑰衬垫固定在固定板上。 轴可旋转地安装在固定板的轴向孔中，并与辅助锁体的尾部件相连。 内手柄包括可旋转地安装在固定板的另一个轴向孔中的内主轴。 控制机构包括可滑动地安装在内部玫瑰衬垫中的滑动板，安装在内侧主轴上以转动的驱动轮以及安装在轴上以与其一起转动的从动轮。 驱动轮和从动轮中的每一个包括在其外周上的至少一个按压部分，用于压靠滑动板的相关联的按压部分。 当内部手柄转动时，辅助锁同时解锁。

公开(公告)号：US5830871A

公开(公告)日：1998-11-03

申请号：US744744

申请日：1996-10-28

Applicant: Chi-Huey Wong ,  Francisco Moris-Varas ,  Chun-Cheng Lin

Inventor： Chi-Huey Wong ,  Francisco Moris-Varas ,  Chun-Cheng Lin

IPC: C07H7/02 ,  C07H15/00 ,  A61K31/70 ,  C12P19/02

CPC classification number: C07H7/02 ,  C07H15/00

Abstract: Inhibitors of E-, P- and L-selectin binding are synthesized by an aldol addition reaction between a glycoside aldehyde precursor and dihydroxyacetone phosphate or a derivative thereof. The addition reaction is catalyzed by aldolase. The inhibitors exhibit an activity comparable to sialyl Lewis X with respect to the E-selectin binding assay and high activities in the P- and L-selectin binding assays. The inhibitors are employable for blocking neutrophil inflamatory conditions.

Abstract translation: 通过醛糖醛前体和磷酸二羟丙酮或其衍生物之间的醛醇醛加成反应合成E-，P-和L-选择蛋白结合的抑制剂。 加成反应由醛缩酶催化。 相对于E-选择蛋白结合测定，抑制剂表现出与唾液酸基路易斯X相当的活性，并且P-和L-选择蛋白结合测定中的高活性。 抑制剂可用于阻断嗜中性粒细胞炎症状况。

公开(公告)号：US09412717B2

公开(公告)日：2016-08-09

申请号：US13289719

申请日：2011-11-04

Applicant: Meng-Tse Chen ,  Hsiu-Jen Lin ,  Chun-Cheng Lin ,  Wen-Hsiung Lu ,  Ming-Da Cheng ,  Chung-Shi Liu

Inventor： Meng-Tse Chen ,  Hsiu-Jen Lin ,  Chun-Cheng Lin ,  Wen-Hsiung Lu ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC: H01L21/00 ,  H01L23/00 ,  B29C43/18 ,  H01L21/56 ,  B29C33/68

CPC classification number: H01L24/97 ,  B29C33/68 ,  B29C43/18 ,  H01L21/563 ,  H01L21/566 ,  H01L2224/16225 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/00

Abstract: Methods and apparatus for a forming molded underfills. A method is disclosed including loading a flip chip substrate into a selected one of the upper mold chase and lower mold chase of a mold press at a first temperature; positioning a molded underfill material in the at least one of the upper and lower mold chases while maintaining the first temperature which is lower than a melting temperature of the molded underfill material; forming a sealed mold cavity and creating a vacuum in the mold cavity; raising the temperature of the molded underfill material to a second temperature greater than the melting point to cause the molded underfill material to flow over the flip chip substrate forming an underfill layer and forming an overmolded layer; and cooling the flip chip substrate to a third temperature substantially lower than the melting temperature of the molded underfill material. An apparatus is disclosed.

Abstract translation: 用于成型模制底部填料的方法和装置。 公开了一种方法，其包括在第一温度下将倒装芯片衬底加载到模压机的上模追逐和下模追逐中的所选择的一个中; 将模制的底部填充材料定位在上模具和下模具中的至少一个中，同时保持低于模制的底部填充材料的熔融温度的第一温度; 形成密封的模腔并在模腔中产生真空; 将模制的底部填充材料的温度提高到大于熔点的第二温度，以使模制的底部填充材料在形成底部填充层的倒装芯片衬底上流动并形成包覆成型层; 并将所述倒装芯片基板冷却至基本上低于所述模制底部填充材料的熔融温度的第三温度。 公开了一种装置。

公开(公告)号：US09233307B2

公开(公告)日：2016-01-12

申请号：US13588166

申请日：2012-08-17

Applicant: Hsing-Yuan Shen ,  Chun-Cheng Lin

Inventor： Hsing-Yuan Shen ,  Chun-Cheng Lin

IPC: G06F9/44 ,  G06F13/10 ,  G06F13/12 ,  A63F13/22 ,  G06F3/038

CPC classification number: A63F13/22 ,  G06F3/038

Abstract: A fully automatic simulation system for an input device permits storage in advance of executable applications and associated simulation setting flies into a database, and then combination of the detection, automatic data searching and matching, transmission and conversion, enabling rapid and convenient operation by the users, whenever they operate various applications or whether they adopt a keyboard, mouse or joystick as the simulation controller.

Abstract translation: 用于输入设备的全自动仿真系统允许在可执行应用程序之前进行存储，并将相关的仿真设置进入数据库，然后组合检测，自动数据搜索和匹配，传输和转换，使用户能够快速方便地进行操作 ，每当他们操作各种应用程序，或者他们是否采用键盘，鼠标或操纵杆作为模拟控制器。

公开(公告)号：US08895497B2

公开(公告)日：2014-11-25

申请号：US12960805

申请日：2010-12-06

Applicant: Chun-Cheng Lin ,  Wun-Shaing Wayne Chang ,  Biing-Jiun Uang ,  Jang-Yang Chang ,  Jo-Chun Chen ,  Hsing-Pang Hsieh

Inventor： Chun-Cheng Lin ,  Wun-Shaing Wayne Chang ,  Biing-Jiun Uang ,  Jang-Yang Chang ,  Jo-Chun Chen ,  Hsing-Pang Hsieh

IPC: C07D295/215 ,  C07D307/68

CPC classification number: C07C261/04 ,  C07C237/22 ,  C07C2601/02 ,  C07C2601/04 ,  C07C2601/14 ,  C07C2601/18 ,  C07C2603/18 ,  C07D209/42 ,  C07D217/26 ,  C07D241/24 ,  C07D249/18 ,  C07D295/215 ,  C07D307/68 ,  C07D309/32 ,  C07D319/18 ,  C07D333/24

Abstract: Cathepsin S inhibitors having formula (I), (II), (III) or (IV) as shown in the specification. These inhibitors can be used to treat cancer and autoimmune/inflammatory diseases.

Abstract translation: 具有式（I），（II），（III）或（IV）的组织蛋白酶S抑制剂，如说明书所示。 这些抑制剂可用于治疗癌症和自身免疫/炎性疾病。

公开(公告)号：US08884431B2

公开(公告)日：2014-11-11

申请号：US13228768

申请日：2011-09-09

Applicant: Chih-Wei Lin ,  Ming-Da Cheng ,  Wen-Hsiung Lu ,  Hsiu-Jen Lin ,  Bor-Ping Jang ,  Chung-Shi Liu ,  Mirng-Ji Lii ,  Chen-Hua Yu ,  Meng-Tse Chen ,  Chun-Cheng Lin ,  Yu-Peng Tsai ,  Kuei-Wei Huang ,  Wei-Hung Lin

Inventor： Chih-Wei Lin ,  Ming-Da Cheng ,  Wen-Hsiung Lu ,  Hsiu-Jen Lin ,  Bor-Ping Jang ,  Chung-Shi Liu ,  Mirng-Ji Lii ,  Chen-Hua Yu ,  Meng-Tse Chen ,  Chun-Cheng Lin ,  Yu-Peng Tsai ,  Kuei-Wei Huang ,  Wei-Hung Lin

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L21/683 ,  H01L23/498 ,  H01L21/56 ,  H01L25/065 ,  H01L23/538 ,  H01L25/00 ,  H01L23/00 ,  H01L23/31 ,  H01L25/10 ,  H01L25/03 ,  H01L21/768

CPC classification number: H01L25/0657 ,  H01L21/52 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/03 ,  H01L24/05 ,  H01L24/09 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/92 ,  H01L24/97 ,  H01L25/03 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/50 ,  H01L2221/68331 ,  H01L2221/68345 ,  H01L2221/68377 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/06515 ,  H01L2224/09181 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/73259 ,  H01L2224/81005 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/9202 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15322 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/03 ,  H01L2924/014 ,  H01L2924/00

Abstract: Packaging methods and structures for semiconductor devices are disclosed. In one embodiment, a packaged semiconductor device includes a redistribution layer (RDL) having a first surface and a second surface opposite the first surface. At least one integrated circuit is coupled to the first surface of the RDL, and a plurality of metal bumps is coupled to the second surface of the RDL. A molding compound is disposed over the at least one integrated circuit and the first surface of the RDL.

Abstract translation: 公开了用于半导体器件的封装方法和结构。 在一个实施例中，封装的半导体器件包括具有第一表面和与第一表面相对的第二表面的再分配层（RDL）。 至少一个集成电路耦合到RDL的第一表面，并且多个金属凸块耦合到RDL的第二表面。 模制化合物设置在RDL的至少一个集成电路和第一表面上。

公开(公告)号：US08755180B2

公开(公告)日：2014-06-17

申请号：US13431235

申请日：2012-03-27

Applicant: Shu-Hua Yeh ,  Chi-Fu Chen ,  Fang-Hsiang Tseng ,  Chun-Cheng Lin

Inventor： Shu-Hua Yeh ,  Chi-Fu Chen ,  Fang-Hsiang Tseng ,  Chun-Cheng Lin

IPC: G06F1/16

CPC classification number: G06F1/1679 ,  G06F1/1618 ,  G06F1/1675

Abstract: A foldable electric device comprises a first member, a second member and a pivot portion. The pivot portion is used to pivot the first member and the second member. The first member comprises a first cushion pad and a first magnetic component. The first cushion pad is retractably disposed on a surface of the first member. The first magnetic component is installed in the first member, and synchronously moves with the first cushion pad. The second member comprises a second magnetic component. When the first member and the second member are covered together, with the magnetic effect between the first magnetic component and the second magnetic component, the first cushion pad is linked by the first magnetic unit to protrude from or retract into the first member.

Abstract translation: 可折叠电气装置包括第一构件，第二构件和枢转部分。 枢转部分用于枢转第一构件和第二构件。 第一构件包括第一缓冲垫和第一磁性部件。 第一缓冲垫可收缩地设置在第一构件的表面上。 第一磁性部件安装在第一部件中，与第一缓冲垫同步移动。 第二构件包括第二磁性部件。 当第一构件和第二构件被覆盖在一起时，利用第一磁性构件和第二磁性构件之间的磁效应，第一缓冲垫通过第一磁性单元连接以从第一构件和第二构件突出或缩回到第一构件中。

公开(公告)号：US20130260535A1

公开(公告)日：2013-10-03

申请号：US13476340

申请日：2012-05-21

Applicant: Meng-Tse CHEN ,  Hui-Min HUANG ,  Chun-Cheng LIN ,  Chih-Chun CHIU ,  Ming-Da CHENG ,  Chung-Shi LIU

Inventor： Meng-Tse CHEN ,  Hui-Min HUANG ,  Chun-Cheng LIN ,  Chih-Chun CHIU ,  Ming-Da CHENG ,  Chung-Shi LIU

IPC: H01L21/78 ,  B29C53/16

CPC classification number: B29C53/18 ,  H01L21/561 ,  H01L21/565 ,  H01L21/566 ,  H01L23/295 ,  H01L23/3128 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/75 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/13147 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75315 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2924/00

Abstract: Embodiments of mechanisms for flattening a packaged structure are provided. The mechanisms involve a flattening apparatus and the utilization of protection layer(s) between the packaged structure and the surface(s) of the flattening apparatus. The protection layer(s) is made of a soft and non-sticking material to allow protecting exposed fragile elements of the packaged structure and easy separation after processing. The embodiments of flattening process involve flattening the warped packaged structure by pressure under elevated processing temperature. Processing under elevated temperature allows the package structure to be flattened within a reasonable processing time.

Abstract translation: 提供了用于使封装结构平坦化的机构的实施例。 这些机构涉及压平装置以及在封装结构和平坦化装置的表面之间利用保护层。 保护层由柔软和不粘的材料制成，以保护封装结构的暴露的易碎元件并且在加工之后易于分离。 扁平化过程的实施例涉及在升高的加工温度下通过压力使翘曲的包装结构变平。 在高温下进行处理可使包装结构在合理的处理时间内变平。