FLASHLIGHT
    1.
    发明专利

    公开(公告)号:CA118275S

    公开(公告)日:2007-10-31

    申请号:CA118275

    申请日:2006-11-14

    Applicant: CHUN CHENG LIN

    Abstract: The design consists of the features of shape, ornament, pattern and configuration of a FLASHLIGHT shown in the drawings.

    COMBINED HOLDER WITH CADDIES FOR BARBECUE ACCESSORIES

    公开(公告)号:CA118274S

    公开(公告)日:2008-08-06

    申请号:CA118274

    申请日:2006-11-14

    Applicant: CHUN CHENG LIN

    Abstract: The design consists of the features of shape, ornament, pattern and configuration of a COMBINED HOLDER WITH CADDIES FOR BARBECUE ACCESSORIES shown in the drawings.

    Electrical connector assembly
    4.
    发明授权

    公开(公告)号:US12149024B2

    公开(公告)日:2024-11-19

    申请号:US17853861

    申请日:2022-06-29

    Abstract: An electrical connector assembly including a first connector and a second connector to be mated with each other is provided. The first connector includes a first body, and at least one first terminal and multiple second terminals disposed therein. The second terminals are symmetrically arranged at opposite sides of the first terminal. The second connector includes a second body, at least one third terminal movably disposed in the second body, multiple fourth terminals disposed in the second body and symmetrically arranged at opposite sides of the third terminal, and a driving module electrically connected to at least one of the fourth terminals and structurally connected to the third terminal. In the mating process of the first and second connector, the second terminals and the fourth terminals are electrically connected firstly, to trigger the driving module to move the third terminal to be structurally and electrically connected to the first terminal.

    Apparatus and Methods for Molded Underfills in Flip Chip Packaging
    8.
    发明申请
    Apparatus and Methods for Molded Underfills in Flip Chip Packaging 有权
    倒装芯片包装中模制底层填料的设备和方法

    公开(公告)号:US20130115735A1

    公开(公告)日:2013-05-09

    申请号:US13289719

    申请日:2011-11-04

    Abstract: Methods and apparatus for a forming molded underfills. A method is disclosed including loading a flip chip substrate into a selected one of the upper mold chase and lower mold chase of a mold press at a first temperature; positioning a molded underfill material in the at least one of the upper and lower mold chases while maintaining the first temperature which is lower than a melting temperature of the molded underfill material; forming a sealed mold cavity and creating a vacuum in the mold cavity; raising the temperature of the molded underfill material to a second temperature greater than the melting point to cause the molded underfill material to flow over the flip chip substrate forming an underfill layer and forming an overmolded layer; and cooling the flip chip substrate to a third temperature substantially lower than the melting temperature of the molded underfill material. An apparatus is disclosed.

    Abstract translation: 用于成型模制底部填料的方法和装置。 公开了一种方法,其包括在第一温度下将倒装芯片衬底加载到模压机的上模追逐和下模追逐中的所选择的一个中; 将模制的底部填充材料定位在上模具和下模具中的至少一个中,同时保持低于模制的底部填充材料的熔融温度的第一温度; 形成密封的模腔并在模腔中产生真空; 将模制的底部填充材料的温度提高到大于熔点的第二温度,以使模制的底部填充材料在形成底部填充层的倒装芯片衬底上流动并形成包覆成型层; 并将所述倒装芯片基板冷却至基本上低于所述模制底部填充材料的熔融温度的第三温度。 公开了一种装置。

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