Abstract:
PROBLEM TO BE SOLVED: To provide a GaN system and an SiC system semiconductor device which suppresses the variation in the initial characteristics and the energization degradation. SOLUTION: An etching gas used for plasma etching enters the surface of a semiconductor crystal 12 in the ionized state from the opening of a mask material 13 so as to etch the semiconductor crystal 12 to the extent of only a predetermined depth. Nitrogen gas mixed in the etching gas is given high energy so as to be activated. It reacts with the atom of the semiconductor crystal 12 of an etching side and a wall surface so that nitrogen termination fixation of the bond is carried out. The composition of a surface layer where the nitrogen termination fixation is carried out, for example, becomes Ga x N y when the semiconductor crystal 12 is a GaN system crystal, and when it is an SiC system crystal, it becomes Si x N y so that an ultra thin nitride film is formed, and chemical stabilization is attained. On such a crystal face where nitrogen termination fixation is carried out, the corrosion (oxidization) by moisture or oxygen does not advance even in the case of energization to a device, so that the variation in the initial characteristics of a semiconductor device and energization degradation is controlled, and as a result reliability is improved. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To planarize a step formed accompanied by the growth of an InP layer. SOLUTION: Wet etching is applied to the grown InP layer using an etchant containing at least a hydrochloric acid and an acetic acid. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a dry etching method by which the occurrence of damages when dry etching is executed to a GaN system semiconductor layer can be suppressed. SOLUTION: At least two-stage etching processing is adopted when dry etching is executed to an etching layer 12 (a layer as an etching target) provided in contact with a GaN system semiconductor crystal layer 11, that is, the first process, in which at first the etching layer 12 is subjected to high-speed (high-energy) etching in its depthwise direction by using a fluorine system gas of SF 6 or NF 3 singulary or a mixed gas of the fluorine system gas and a chlorine system gas of any one of SiCl 4 , BCl 3 or Cl 2 , and the second process in which the remaining depth directional region is subjected to low-speed (low-energy) etching. Therefore, damages to the GaN system semiconductor crystal layer 11 can be reduced. It is also possible to contribute to the realization of a GaN system semiconductor device without fluctuations of initial characteristics and degradation in conductivity. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a radio module capable of preventing radio interference such as crosstalk, even if a transmitter and transmission antenna and a receiver and receiving antenna are used in the same case. SOLUTION: The radio module 10 is used which is provided with a transmitter 14a and a receiver 14b; a plane antenna substrate 12 for mounting the transmitter 14a and the receiver 14b, having an antenna surface on the surface and having a first antenna 13a to be connected to any one of the transmitter 14a and the receiver 14b; and a second antenna 13b connected to the other of the transmitter 14a and the receiver 14b, and directed to the same direction as that of the first antenna surface and provided with a height different from that of the first antenna surface 13a. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To realize high breakdown voltage of a semiconductor device having an offset region, and suppress deterioration of device property resulting from hot electron implantation. SOLUTION: A channel region 103, the offset region 104, a drain region 105 and a source region 106 are formed on a surface region of an epitaxial layer 102. The offset region 104 is equipped with three regions different in impurity concentration. The first offset region 104a extending from a gate end and the third offset region 104c extending from a drain end have uniform donor concentration distribution, respectively. At a part between the above regions, the second offset region 104b is arranged whose impurity concentration changes gently. Gradual concentration distribution is made in which a discontinuous part of spatial variation of impurity concentration in the offset region 104 is eliminated, and rapid variation of Fermi level in the offset region 104 is not generated by the above method, so that flexure of energy band is restrained. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a transmitter capable of performing high-accuracy and high-stability radio communication. SOLUTION: A transmitter 10 mixes a first signal wave of an information signal and a second signal wave of a non-modulated wave with a carrier signal and transmits the first signal wave and the second signal wave at radio frequencies. A receiver 20 mixes radio frequencies of the first signal wave and the second signal wave. At the end of the receiver 20, Δf component including frequency deviation and phase noises are canceled, and such unstable components at the end of the transmitter 10 are removed, so that information is extracted. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract in simplified Chinese:一种光学半导体模块,包含:一发光组件;一光接收组件在其一顶面与一侧面上具有一光接收面,且该光接收面有一防反射膜形成于其上;及一安装单元具有该发光组件和该光接收组件以一位置关系安装其上,而使由该发光组件发出的光会至少光学性连接于该光接收组件之侧面的光接收面上。
Abstract:
PROBLEM TO BE SOLVED: To improve ESD susceptibility related with a method for manufacturing a light emitting element. SOLUTION: The method for manufacturing a light emitting element has a process to form an MQW active layer 24 including a process to form a well layer 21 composed of a nitride semiconductor layer, a process to form a barrier layer 23 using a carrier gas containing hydrogen of the ratio of 2% or more to nitride and a total flow rate of carrier gas on the well layer 21. Since the barrier layer 23 in the MQW active layer 24 is made to grow using the carrier gas containing hydrogen of the ratio of 2% or more to the nitride and the total flow rate of carrier gas, it is possible to improve the ESD susceptibility. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an optical semiconductor device for improving cooling efficiency of an optical semiconductor element. SOLUTION: The optical semiconductor device includes an optical semiconductor element 14, a stem 50 having a through-hole 52, a wiring block 30 having an insulator 36 inserted into the through-hole 52 to have a non-contact part 54 at a part of the internal surface of the through-hole and a wire 34 for transmitting an input signal or an output signal to the optical semiconductor element 14 supported with the insulator, and a heat sink 62 fixed to the stem 50 for radiating heat generated by the optical semiconductor element 10 to the stem 50. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method of controlling a semiconductor laser in which desired optical characteristics can be obtained even if the heater has deteriorated. SOLUTION: The method controls a semiconductor laser (10) having a wavelength-selection portion (11) whose refractive index is controllable with a heater (14). The method includes: a starting sequence having a first step for adjusting the heat value of the heater until it reaches a given value; and a wavelength control sequence having a second step for correcting the wavelength of the semiconductor laser according to the detection result of the oscillation wavelength of the semiconductor laser after the starting sequence. COPYRIGHT: (C)2009,JPO&INPIT