公开(公告)号：EP4457855A1

公开(公告)日：2024-11-06

申请号：EP22856913.3

申请日：2022-12-27

Applicant: Medtronic, Inc. ,  Samtec, Inc.

Inventor： QIU, Caian ,  RUBEN, David A. ,  PATEL, Neha M. ,  KINZIE, Patrick W. ,  HAMMANN, Tom ,  BOHN, Chris

IPC: H01L21/48 ,  H01L23/498

公开(公告)号：EP3911986A1

公开(公告)日：2021-11-24

申请号：EP20741611.6

申请日：2020-01-17

Applicant: Samtec Inc.

Inventor： PUFFER, Matthew Brian ,  LEE, Raymond ,  BETTMAN, R., Brad ,  LOY, Edwin ,  SEVILLE-JONES, Dyan ,  MARTIN, Arlon ,  GIRLANDO, Stephen Michael ,  BANDFIELD, Christopher Alan

IPC: G02B6/42

公开(公告)号：EP3803908A1

公开(公告)日：2021-04-14

申请号：EP19807679.6

申请日：2019-05-24

Applicant: Samtec Inc.

Inventor： CHUGANEY, Shashi ,  SASAKI, Yasuo ,  MCMORROW, Scott ,  CAMPOS, Carol ,  DIEGEL, Cindy, Lee ,  MOSS, James, Alexander ,  NOYOLA, Francisco

IPC: H01B7/02 ,  H01B9/02

公开(公告)号：EP2580814A2

公开(公告)日：2013-04-17

申请号：EP12791414.1

申请日：2012-06-29

Applicant: Samtec, Inc.

Inventor： ZBINDEN, Eric ,  MUSSER, Randall ,  VERDIELL, Jean-Marc André ,  MONGOLD, John ,  VICICH, Brian ,  GUETIG, Keith

IPC: H01R12/71 ,  H01R24/54

CPC classification number: G02B6/4284 ,  G02B6/4232 ,  G02B6/4246 ,  G02B6/4249 ,  G02B6/4261 ,  G02B6/4269 ,  G02B6/4278 ,  G02B6/4279 ,  G02B6/428 ,  G02B6/4292 ,  G02B6/4293 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01R12/716 ,  H01R13/639 ,  H04B1/3833 ,  H04B10/2504 ,  H04B10/27 ,  H04B10/40 ,  H04B10/801 ,  H04B10/803 ,  H05K7/20418 ,  H01L2924/00014

Abstract: An interconnect system including a host circuit board; an IC package connected to the host circuit board and including a first connector, an IC circuit board, and an IC die; and a transceiver arranged to mate with the first connector so that at least some electrical signals transmitted to and from the IC die are transmitted only on or through the IC circuit board.

公开(公告)号：WO2022192485A1

公开(公告)日：2022-09-15

申请号：PCT/US2022/019670

申请日：2022-03-10

Applicant: SAMTEC, INC.

Inventor： HAMMANN, Thomas, Jacob ,  OWENS, Adam ,  BOHN, Christopher ,  HAGAN, Nathan ,  ROBERTSON, Nathan ,  WRSHKA, Peter

IPC: H01L23/48 ,  H01L23/15 ,  H01L23/00

Abstract: Electrically conductive pastes are disclosed that are configured to fill a hole in a substrate. The paste can be cured in the hole so as to define an electrically conductive metallized via. Fills that perform at high temperatures are also disclosed.

公开(公告)号：WO2022081682A1

公开(公告)日：2022-04-21

申请号：PCT/US2021/054745

申请日：2021-10-13

Applicant: SAMTEC, INC.

Inventor： ZBINDEN, Eric

IPC: G02B6/42

Abstract: A vertical interconnect module and mating receptacle are described. The vertical interconnect module may be a transceiver, transmitter, or receiver that is part of an optical communication system. The vertical interconnect module has a low profile and small footprint. The interconnection system is capable of transferring information at high data rates.

公开(公告)号：WO2022035654A1

公开(公告)日：2022-02-17

申请号：PCT/US2021/044481

申请日：2021-08-04

Applicant: SAMTEC, INC.

Inventor： MIZUMURA, Akinori

IPC: H01R13/6586 ,  H01R13/627

Abstract: A cable connector includes a cable including a center conductor, a first housing, and an overmold attached to the cable and the first housing. The cable connector can include a second housing and the overmold can be attached to the second housing. Alternatively, a cable connector system includes a cable connector including a first latch, and a board connector including a second latch and a shield, wherein the shield is staked to a substrate, and a body of the cable connector includes an outer wall that extends over the shield when the cable connector is mated to the board connector.

公开(公告)号：WO2021207479A1

公开(公告)日：2021-10-14

申请号：PCT/US2021/026360

申请日：2021-04-08

Applicant: SAMTEC, INC.

Inventor： BUCK, Jonathan, E.

IPC: H01R13/6581 ,  H01R13/646

Abstract: A high-speed electrical RF, single-ended, or differential/twin axial electrical connector, capable of at least 67GHz of operable bandwidth. The electrical connector can include at least one signal conductor that is supported by a connector housing that, in turn, is received by an electrical shield. Two such electrical connectors are configured to mate with each other, such that a third electrical shield at least partially surrounds and contacts each of the first and second electrical shields, thereby placing the electrical shields in electrical communication with each other.

公开(公告)号：WO2019226987A1

公开(公告)日：2019-11-28

申请号：PCT/US2019/033915

申请日：2019-05-24

Applicant: SAMTEC, INC.

Inventor： CHUGANEY, Shashi ,  SASAKI, Yasuo ,  MCMORROW, Scott ,  NOYOLA, Francisco ,  DIEGEL, Cindy, Lee ,  MOSS, James, Alexander

IPC: H01B7/02 ,  H01B9/00 ,  H01B1/02

Abstract: Electrical cables and optical waveguides are disclosed as including an electrically insulative foam. The electrically insulative foam can coat at least one electrical conductor of the electrical cable. The electrically insulative foam can coat the optical fiber of the waveguide. The electrically insulative foam can also define a waveguide.

公开(公告)号：WO2018226805A1

公开(公告)日：2018-12-13

申请号：PCT/US2018/036223

申请日：2018-06-06

Applicant: SAMTEC, INC.

Inventor： GUETIG, Keith R. ,  HALL III, Thomas A. ,  COLLINGWOOD, Andrew R. ,  NIGHTINGALE, John L. ,  ZBINDEN, Eric J.

IPC: H01R13/6582 ,  H01R12/50 ,  H05K7/20

Abstract: A cage assembly includes a cage including a top wall and a bottom wall and an electrical receptacle positioned between the top wall and the bottom wall such that the electrical receptacle floats within the cage in opposite directions between the top wall and the bottom wall.