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    VERTICAL INTERCONNECT SYSTEM FOR HIGH-SPEED DATA TRANSMISSION
    1.
    发明申请
    VERTICAL INTERCONNECT SYSTEM FOR HIGH-SPEED DATA TRANSMISSION 审中-公开

    公开(公告)号：WO2022081682A1

    公开(公告)日：2022-04-21

    申请号：PCT/US2021/054745

    申请日：2021-10-13

    Applicant: SAMTEC, INC.

    Inventor： ZBINDEN, Eric

    IPC: G02B6/42

    Abstract: A vertical interconnect module and mating receptacle are described. The vertical interconnect module may be a transceiver, transmitter, or receiver that is part of an optical communication system. The vertical interconnect module has a low profile and small footprint. The interconnection system is capable of transferring information at high data rates.

    OPTICAL TRANSCEIVER WITH VERSATILE POSITIONING
    4.
    发明申请
    OPTICAL TRANSCEIVER WITH VERSATILE POSITIONING 审中-公开

    公开(公告)号：WO2019060817A2

    公开(公告)日：2019-03-28

    申请号：PCT/US2018/052402

    申请日：2018-09-24

    Applicant: SAMTEC INC.

    Inventor： ZBINDEN, Eric

    IPC: G02B6/122

    Abstract: An optical transceiver can include a transmitter and a receiver. The optical transceiver is configured to mate with an electrical connector in first and second orientations that are opposite each other. In certain examples, a thermally conductive surface of the transceiver is configured to be placed in thermal communication with a heat dissipation member in one or both of the first and second orientations. Further examples of optical transceivers can be mounted to a base and placed in electrical communication with an electrical connector. A lid provides a compressive force that simultaneously makes electrical contact between the transceiver and a host printed circuit board (PCB) and provides a low impedance heat transfer path to dissipate heat generated during transceiver operation.

    DATA COMMUNICATION SYSTEM
    6.
    发明申请
    DATA COMMUNICATION SYSTEM 审中-公开

    公开(公告)号：WO2019099447A3

    公开(公告)日：2019-05-23

    申请号：PCT/US2018/060923

    申请日：2018-11-14

    Applicant: SAMTEC INC.

    Inventor： ZBINDEN, Eric ,  SHAH, Jignesh, H.

    IPC: G02B6/38

    Abstract: A data communication system can include a low-profile electrical connector that is sized to be mounted onto a PCB in a gap between the PCB and a heat sink that overhangs from an IC that is mounted to the PCB. The data communication system further includes an electrical cable that extends from the electrical connector to an optical transceiver. A cable management laminate can route the electrical cables along a predetermined path. The data communication system can be disposed in a system tray that is configured to force air over the heat sink. The airflow over the heat sink can be adjustable.

    DATA COMMUNICATION SYSTEM
    7.
    发明申请
    DATA COMMUNICATION SYSTEM 审中-公开

    公开(公告)号：WO2019099447A2

    公开(公告)日：2019-05-23

    申请号：PCT/US2018/060923

    申请日：2018-11-14

    Applicant: SAMTEC INC.

    Inventor： ZBINDEN, Eric ,  SHAH, Jignesh, H.

    Abstract: A data communication system can include a low-profile electrical connector that is sized to be mounted onto a PCB in a gap between the PCB and a heat sink that overhangs from an IC that is mounted to the PCB. The data communication system further includes an electrical cable that extends from the electrical connector to an optical transceiver. A cable management laminate can route the electrical cables along a predetermined path. The data communication system can be disposed in a system tray that is configured to force air over the heat sink. The airflow over the heat sink can be adjustable.

    CONNECTOR ASSEMBLY
    8.
    发明申请
    CONNECTOR ASSEMBLY 审中-公开
    连接器总成

    公开(公告)号：WO2015200553A1

    公开(公告)日：2015-12-30

    申请号：PCT/US2015/037539

    申请日：2015-06-24

    Applicant: SAMTEC, INC.

    Inventor： ZBINDEN, Eric ,  MONGOLD, John Allen

    IPC: H01R12/79 ,  H01R13/629 ,  H01R13/639

    CPC classification number: G02B6/4249 ,  G02B6/3879 ,  G02B6/3897 ,  G02B6/4269 ,  G02B6/4292

    Abstract: A system includes a substrate including a first row of first receptacles, a cradle including an opening and a spring member, connectors located within the opening, and cables connected to the connectors. The cradle is configured to connect each of the connectors simultaneously or nearly simultaneously to a corresponding first, and the spring member pushes on the connectors with a force greater than an insertion force of the first receptacle.

    Abstract translation: 一种系统包括：基板，包括第一排第一插座，支架，包括开口和弹簧构件，位于开口内的连接器以及连接到连接器的电缆。 支架被构造成将每个连接器同时或几乎同时地连接到相应的第一个，并且弹簧构件以大于第一容器的插入力的力推动连接器。

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