Abstract:
PURPOSE: A cell structure of an EEPROM device and a fabricating method thereof are provided to erase easily charges of programmed cells by forming windows on both sides of the first floating gate. CONSTITUTION: A cell structure of an EEPROM device includes a stack part and a floating gate transistor part. The stack part includes a semiconductor substrate, a first floating gate, a nitride layer pattern, a control gate, and a window. The first floating gate(107b), the nitride layer pattern(115b) including a nitride layer, and the control gate(117) are formed on the semiconductor substrate(101). The window(129) is formed on both sides of the first floating gate to erase charges of the first floating gate. The floating gate transistor part includes a gate insulating layer, a second floating gate, and a source/drain. The gate insulating layer is formed on the semiconductor substrate. The second floating gate is formed on the gate insulating layer. The source/drain is aligned to the second floating gate.
Abstract:
Provided are an ion measuring device of electrolytes which can provide a constant pH condition to an optode and an ion measuring method of electrolytes. The ion measuring device of electrolytes comprises an optode located on a first substrate and buffer located on a second substrate facing to the first substrate. More specifically, the ion measuring device of electrolytes additionally comprises a spacer between the first and the second substrate.
Abstract:
A cell structure of a non-volatile memory device, which uses a nitride layer as a floating gate spacer, includes a gate stack and a floating gate transistor formed over a semiconductor substrate. The gate stack includes a first portion of a floating gate, a control gate formed over the first portion of the floating gate, and a non-nitride spacer adjacent to sidewalls of the first portion of floating gate. The floating gate transistor includes a second portion of the floating gate, which substantially overlaps a source and/or drain formed in the substrate. The application of ultraviolet rays to the non-nitride spacer of a programmed cell can causes the second portion of the floating gate to discharge, thereby easily erasing the programmed cell.
Abstract:
Provided are a cell structure of an EPROM device and a method for fabricating the same. The cell structure includes a gate stack, which includes a first floating gate, an insulating pattern including a nitride layer, and a control gate that are sequentially stacked on a semiconductor substrate, and includes a window for exposing the top surface or both sidewalls of the first floating gate on both sides of the control gate, so that charges of the first floating gate can be erased by ultraviolet rays. The cell structure further includes a floating gate transistor, which includes a gate insulating layer formed on the semiconductor substrate, a second floating gate that is formed on the gate insulating layer and is connected to the first floating gate in the gate stack, and a source/drain that is formed in the semiconductor substrate so as to be aligned to the second floating gate. In the cell structure, the window is formed on the top surface or both sidewalls of the first floating gate of the gate stack. Thus, ultraviolet rays can penetrate through the window and easily erase charges of the programmed cell.
Abstract:
PURPOSE: A double port semiconductor memory device is provided to reduce an area occupied by an isolation area formed at a boundary between a N-well and a P-well. CONSTITUTION: A semiconductor substrate includes a memory cell divided into a N-well and a P-well. The semiconductor memory device includes the first word line, the second word line, the first bit line and the second bit line. The first CMOS inverter includes the first NMOS transistor(N1), the first PMOS transistor(P1) and an input terminal and an output terminal. The second CMOS inverter includes the second NMOS transistor(N2), the second PMOS transistor(P2) and an input terminal and an output terminal. The third NMOS transistor(N3) has a gate connected to the first word line, and a drain connected to the first bit line and a source connected to the first memory node(N1). The fourth NMOS transistor(N4) has a gate connected to the first word line, a drain connected to the first bit line and a source connected to the second memory node(N2). The fifth NMOS transistor(N5) has a gate connected to the first memory node and a source connected to a ground line. And the sixth NMOS transistor(N6) has a gate connected to the second word line, a source connected to the drain of the fifth NMOS transistor and a drain connected to the second bit line.