Abstract:
A level sensor of an exposure apparatus is disclosed. The level sensor comprises: a light source irradiating the surface of a wafer with light; a projecting unit having a first slit which the light from the light source passes through and is single, not a periodic grid; and a detecting unit having a second slit which light reflected from the surface of the wafer passes through and is single, not a periodic grid; and a detector detecting the reflected light passing through the second slit of the detecting unit.
Abstract:
PURPOSE: A method for monitoring semiconductor equipment is provided to reduce measurement errors by using a Moire interferometer for directly measuring a bare substrate or wafer chuck. CONSTITUTION: A free pattern beam is reflected from an object device to form a pattern beam (S11). The pattern beam passes through a first grating. A Moire interference pattern is formed (S12). The Moire interference pattern is analyzed. The height map of the object device is produced (S13). [Reference numerals] (AA) Start; (BB) End; (S10) Source beam passes through a first grating and foms a free pattern beam; (S11) Free pattern beam is reflected from an object device to form a pattern beam; (S12) Pattern beam passes through a first grating. A Moire interference pattern is formed; (S13) Moire interference pattern is analyzed. The height map of the object device is produced
Abstract:
PURPOSE: An overlay measurement method is provided to precisely measure the overlay between upper and lower patterns from a virtual image before performing a patterning process with respect to an upper film, thereby repairing the upper film without discarding a semiconductor substrate. CONSTITUTION: First information with respect to a first structure is acquired(ST130). A second auxiliary structure is arranged on the first structure(ST140). The first structure and second auxiliary structure are arranged(ST150). Second information with respect to the second auxiliary structure is acquired(ST160). Virtual information is acquired by synthesizing the first information and second information(ST170). A virtual overlay between the first structure and second structure is measured from the virtual information(ST180).
Abstract:
PURPOSE: An integrated piping module is provided to reduce the number of components for the configuration of pipes connecting a fuel processor and a fuel cell, and to minimize heat loss in a fuel cell system. CONSTITUTION: An integrated piping module comprises: a sealed first tank(210); an outer pipe(250) which is passes through the first tank and discharges the gas flowing in from the outside into the first tank by an intermediate unit(253) with an opened hold shape; and an inner pipe(260) which is formed inside the pipes between a meddle portion and an outlet(252) of the outer pipe and discharges the gas inside the first tank to the fuel cell.
Abstract:
PURPOSE: A method for measuring the focus change of a photolithography device and a method for manufacturing a semiconductor device are provided to improve productivity by rapidly measuring the focus change on a wafer region. CONSTITUTION: A photo mask and a wafer are inputted to a photolithography device(S10). Light for measurement is irradiated to the wafer. The image of an optical pattern is transferred on the photoresist layer by using an ultraviolet ray(S20). The photoresist layer is baked(S30). The photoresist layer is inspected(S40). The inspection result of the photoresist layer is analyzed(S50).
Abstract:
A fuel cell apparatus employing the same is provided to allow a fuel processor and a stack to be smoothly operated. A fuel cell apparatus comprises: a reformer(120) performing a reformation reaction of fuel source; a burner(130) heating up the reformer; a CO removal unit(172) removing CO generated by reforming gas from the reformer; a stack(200) wherein a generation reaction is processed using the reforming gas; a first burner fuel supply line(301) supplying the fuel source as an operation fuel for the burner; and a second burner fuel supply line(302) supplying the reforming gas from the CO removal unit as the operation fuel for the burner.