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公开(公告)号：KR1020160076027A
公开(公告)日：2016-06-30
申请号：KR1020140185179
申请日：2014-12-22
Applicant: 전자부품연구원
CPC classification number: C09J7/26 , B29C44/20 , B29C44/5681 , B29K2075/00 , B29K2505/00 , B29K2995/0005 , C09J4/00 , C09J5/02 , C09J7/25 , C09J7/40
Abstract: 본발명은폴리이소시아네이트, 폴리에테르폴리올, 발포제, 촉매및 전도성분말로이루어진폴리우레탄발포필름층; 및아크릴레이트공중합체를포함하는접착제층을포함하며, 상기전도성분말은, 평균입자크기가 1㎛이하이며, 탄소나노튜브(CNT), 은(Ag), 알루미늄(Aluminium), 구리(Cu), 금(Au), 백금(Pt), 아연(Zn), 티타늄(Ti), 팔라듐(Pd) 분말로이루어진군에서선택되어지는하나이상의혼합분말인접착발포필름에관한발명으로전기전도성, 박형, 방수및 내충격성의성능이모두우수하게형성되도록하는효과가있다.
Abstract translation: 本发明涉及一种薄，防水，耐冲击的粘合泡沫膜及其制备方法，其中粘合剂泡沫膜包括：聚氨酯泡沫膜层，包括多异氰酸酯，聚醚多元醇，发泡剂，催化剂和导电粉末 ; 以及包含丙烯酸酯共聚物的粘合剂层，其中所述导电粉末的平均粒径为1μm以下，为选自由碳纳米管（CNT），银（Ag），铝（ 铝），铜（Cu），金（Au），铂（Pt），锌（Zn），钛（Ti）和钯（Pd）粉末。 本发明的粘合性泡沫膜具有包括导电性，耐冲击性，薄度和耐水性在内的整体优异性能。
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公开(公告)号：KR1020150044000A
公开(公告)日：2015-04-23
申请号：KR1020140138315
申请日：2014-10-14
Applicant: 전자부품연구원
Abstract: 본발명은고열전도성필름및 그제조방법에관한것으로서, 본발명에따른고열전도성필름은알루미나(AIO), 산화마그네슘(MgO) 및질화알루미늄(AIN) 중적어도하나의구형의소재로형성된세라믹제1차필러, 그리고상기세라믹제1차필러와혼합될경우상기세라믹제1차필러의사이공간에채워지는구상화된질화붕소(BN)로형성된제2차필러를포함한다.
Abstract translation: 本发明涉及一种高导热膜，包括由Al_2O_3，MgO和AIN中的至少一种圆形材料制成的第一陶瓷填料; 以及由BN制成的第二填料，其用于填充在混合第一陶瓷填料时形成在第一陶瓷填料空间中的间隙及其制造方法。
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公开(公告)号：KR1020140118228A
公开(公告)日：2014-10-08
申请号：KR1020130033768
申请日：2013-03-28
Applicant: 전자부품연구원
IPC: C07D407/14 , C08G59/22 , C08L69/00
Abstract: A liquid crystalline epoxy compound with flexible linkage and a method for manufacturing the same are disclosed. The liquid crystalline epoxy compound, according to an embodiment of the present invention, has a structure represented by chemical formula 1 or chemical formula 2. In the chemical formula 1, m is an integer of 2
Abstract translation: 公开了具有柔性连接的液晶环氧化合物及其制造方法。 根据本发明的实施方案的液晶环氧化合物具有由化学式1或化学式2表示的结构。在化学式1中，m是2 <= m <= 10的整数，n是1 在化学式2中，m为2 <= m <= 10的整数，n为1或2。
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公开(公告)号：KR101420023B1
公开(公告)日：2014-07-17
申请号：KR1020120154450
申请日：2012-12-27
Applicant: 전자부품연구원
IPC: H01L41/02
Abstract: 본 발명은 열전 나노컴포지트에 관한 것으로, 보다 상세하게는 본 발명의 일 실시예에 따른 열전 나노컴포지트는, 폴리머 매트릭스 내에 나노구조체들이 분산되어 있는 형태를 가질 수 있다.
나아가, 상기 나노구조체들 상호 간 접촉에 의해 나노체인이 형성되어 있고, 상기 폴리머 매트릭스 내에 분산되어 있는 상기 나노 체인의 평균 길이(L)는, 100nm 이상 50㎛ 이하일 수 있다.
본 발명에 의하면, 간단한 공정에 의해 높은 열전 특성(thermoelectric effect) 및 전기전도도를 나타내는 열전 나노컴포지트를 형성할 수 있다.-
公开(公告)号：KR101388778B1
公开(公告)日：2014-04-23
申请号：KR1020120154451
申请日：2012-12-27
Applicant: 전자부품연구원
Abstract: The present invention relates to a method for manufacturing a thermoelectric nanocomposite film and, more specifically, to a method for manufacturing a thermoelectric nanocomposite film which comprises the steps of: applying thermoelectric nanocomposite solution on a substrate; and drying the applied thermoelectric nanocomposite solution, wherein nanostructures included in the dried thermoelectric nanocomposite are oriented in a specific direction. According to the present invention, the thermoelectric nanocomposite film having high thermoelectric effect and electrical conductivity can be formed.
Abstract translation: 本发明涉及一种制造热电纳米复合膜的方法，更具体地说，涉及一种制造热电纳米复合膜的方法，该方法包括以下步骤：将热电纳米复合材料溶液涂覆在基板上; 并干燥所施加的热电纳米复合物溶液，其中包括在干燥的热电纳米复合材料中的纳米结构在特定方向上取向。 根据本发明，可以形成具有高热电效应和导电性的热电纳米复合膜。
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Patent Agency Ranking
公开(公告)号：KR101322328B1
公开(公告)日：2013-10-28
申请号：KR1020110047891
申请日：2011-05-20
Applicant: 전자부품연구원
Abstract: 본 발명은 배향성을 갖는 열전도성 쉬트의 제조 장치 및 방법에 관한 것으로서, 본 발명에 따른 열전도성 쉬트의 제조 장치는 용매, 레진 및 절연성과 고열전도성 특성을 지닌 분말을 포함하여 컴포지트를 형성하는 전처리 개질부, 형성된 컴포지트를 캐리어 필름(Carrierfilm)이나 치구를 통하여 쉬트 형태로 성형하는 성형부, 그리고 쉬트 형태로 성형된 컴포지트에 배향성을 부여하기 위해 전기장 혹은 자기장을 인가하는 구조제어부를 포함하는 것을 특징으로 한다.
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公开(公告)号：KR101233668B1
公开(公告)日：2013-02-15
申请号：KR1020100133355
申请日：2010-12-23
Applicant: 전자부품연구원
Abstract: 반도체 패키지 기판용 수지조성물이 개시된다. 본 발명의 일 실시예에 따른 반도체 패키지 기판용 수지조성물은 하기 화학식 1로 표시되는 반복단위를 가지는 노볼락형 시아네이트 수지; 및 하기 화학식 2로 표시되는 반복단위를 가지는 플루오렌 골격의 에폭시 수지를 포함한다.
[화학식 1]
[화학식 2]-
公开(公告)号：KR1020120129556A
公开(公告)日：2012-11-28
申请号：KR1020110047891
申请日：2011-05-20
Applicant: 전자부품연구원
CPC classification number: B29C71/0072 , B29C71/0081 , B29D7/01 , B29K2995/0013 , B29L2007/00
Abstract: PURPOSE: An apparatus and a method for manufacturing heat conductive sheets with orientation property are provided to manufacture a high-radiant insulation sheet by applying conductive property to composite. CONSTITUTION: An apparatus for manufacturing heat conductive sheets with orientation property comprises a pre-treating and reforming unit(110), a molding unit(120), and a structure control unit(130). The pre-treating and reforming unit forms composite by using powder having heat insulation and high thermal conductive characteristics. The molding unit forms the composite into sheet shape. The structure control unit supplies electric field or magnetic field. [Reference numerals] (110) Pre-treating and reforming unit; (120) Molding unit; (130) Structure control unit; (140) Product unit; (AA) Base material; (BB) Raw material
Abstract translation: 目的：提供一种制造具有取向性的导热片的装置和方法，以通过将复合材料的导电性赋予高辐射绝缘片。 构成：用于制造具有取向性的导热片的装置包括预处理和重整单元（110），模制单元（120）和结构控制单元（130）。 预处理和重整单元通过使用具有隔热和高导热特性的粉末形成复合材料。 成型单元将复合材料形成为片状。 结构控制单元提供电场或磁场。 （附图标记）（110）预处理和重整单元; （120）成型单元; （130）结构控制单元; （140）产品单位; （AA）基材; （BB）原料
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公开(公告)号：KR101205837B1
公开(公告)日：2012-11-28
申请号：KR1020110046597
申请日：2011-05-18
Applicant: 전자부품연구원
Abstract: PURPOSE: An interlayer connection structure forming method of a multilayer non-sintering ceramic substrate is provided to manufacture a package module or an electronic component of multi structure using a non-sintering substrate by securing forming technology of an interlayer connection via, a via material, and a protective layer film material for interlayer connection. CONSTITUTION: A hardness substrate is prepared(S100). A first dielectric layer is formed by using an ink-jet printing method on the hardness substrate(S110). A first conductive via paste performs filling, drying, and hardening so that one or more vias are formed on the first dielectric layer(S120). A first conductive wire is formed by using conductive ink(S130). A second dielectric layer is formed by using an ink-jet printing method(S140). The first conductive via paste performs the filling, the drying, and the hardening so that one or more vias are formed on the second dielectric layer(S150). A second conductive wire is formed by using the conductive ink on the second dielectric layer. A protective layer bonding film is adhered to a top unit of a plurality of dielectric layers on the hardness substrate(S160). [Reference numerals] (AA) Start; (BB) Finish; (S100) A hardness substrate is prepared; (S110) A first dielectric layer is formed; (S120) A via is formed on the first dielectric layer; (S130) A conductive wire is formed on a first dielectric; (S140) A second dielectric layer is formed on the first dielectric layer; (S150) The via is formed on the second dielectric layer; (S160) A bonding film is attached to the top of the dielectric layers; (S170) The via is formed by filling, hardening, and drying via paste after forming the via on the bonding film; (S180) An electrode is formed on the bonding film with an inkjet print method
Abstract translation: 目的：提供一种多层非烧结陶瓷基板的层间连接结构形成方法，通过确保层间连接通孔的形成技术，通孔材料，制造使用非烧结基板的封装模块或多结构的电子部件， 以及用于层间连接的保护层膜材料。 构成：制备硬度基材（S100）。 通过在硬度基板上使用喷墨印刷法形成第一介电层（S110）。 第一导电通孔糊进行填充，干燥和硬化，使得在第一介电层上形成一个或多个通孔（S120）。 通过使用导电油墨形成第一导线（S130）。 通过使用喷墨打印方法形成第二介电层（S140）。 第一导电通孔糊进行填充，干燥和硬化，使得在第二介电层上形成一个或多个通孔（S150）。 通过在第二电介质层上使用导电油墨形成第二导线。 将保护层接合膜粘附到硬质基板上的多个电介质层的顶部单元（S160）。 （附图标记）（AA）开始; （BB）完成; （S100）制备硬度基板; （S110）形成第一电介质层; （S120）在第一电介质层上形成通孔; （S130）在第一电介质上形成导线; （S140）在第一电介质层上形成第二电介质层; （S150）通孔形成在第二电介质层上; （S160）在电介质层的顶部附着接合膜; （S170）通过在接合膜上形成通孔后，通过糊料进行填充，硬化和干燥而形成通孔; （S180）利用喷墨印刷法在接合膜上形成电极
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公开(公告)号：KR1020120021017A
公开(公告)日：2012-03-08
申请号：KR1020100085029
申请日：2010-08-31
Applicant: 전자부품연구원
IPC: C08G63/685 , C08G63/185 , C08L67/00 , C08J5/18
Abstract: PURPOSE: A polyester resin for semiconductor package substrate is provided to have low anisotropy, high solubility to polar organic solvent, and excellent thermal resistance. CONSTITUTION: A polyester resin comprises 20-50 mol% of -O-Ar1-CO- structure, 40-25 mol% of -OC-Ar2-CO-structure, and 40-25 mol% of -HN-Ar3-NH- structure. Ar1 is 2,6-naphthalene or 4,4'-biphenylene, Ar2 is in chemical formula 1, and Ar3 is one of chemical formula 1-3. A film for semiconductor package substrate is obtained by spreading the polyester resin on a supporting substrate.
Abstract translation: 目的：提供一种半导体封装基板用聚酯树脂，其各向异性低，对极性有机溶剂的溶解性高，耐热性优异。 构成：聚酯树脂包含20-50mol％的-O-Ar1-CO-结构，40-25mol％的-OC-Ar2-CO-结构和40-25mol％的-HN-Ar3-NH- 结构体。 Ar 1是2,6-萘或4,4'-亚联苯，Ar 2在化学式1中，Ar 3是化学式1-3之一。 通过将聚酯树脂铺展在支撑基材上，获得半导体封装基板用薄膜。
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