Abstract:
본 발명은 (A) 융점이 200℃ 이상 350℃ 이하인 방향족 폴리아미드 수지 (B) 방향족 폴리에스테르 수지 및 (C) 백색안료를 포함하는 폴리아미드계 수지 조성물에 관한 것으로, 방향족 폴리에스테르 수지(B)를 사용하여 반사율 및 내변색성을 개선시킨 폴리아미드계 수지 조성물에 관한 것이다.
Abstract:
Polyamide resin in the present invention is a polymer of dicarboxylic acid and diamine, and the dicarboxylic acid includes branched aliphatic dicarboxylic acid. The polyamide resin has excellent heat resistance and processability and is capable of reducing gas generation rate in a molding process.
Abstract:
The present invention relates to a polyamide resin that is obtained by copolymerizing: (A) a dicarboxylic acid component including (a1) an aromatic dicarboxylic acid component; and (B) a diamine component including (b1) 75 to 85 mol% of an aliphatic diamine component and (b2) 15 to 25 mol% of toluene diamine. The polyamide resin according to the present invention has a repeating structure of a dicarboxylic acid part derived from the dicarboxylic acid component (A) and a diamine part derived from the diamine component (B). The polyamide resin has excellent processability, heat-resistance, and dimensional stability.
Abstract:
PURPOSE: A polyamide resin is provided to have excellent refractivity, excellent moldability, and melt processability. CONSTITUTION: A polyamide resin is formed by polymerization of an aromatic dicarboxylic acid, aliphatic linear diamine, and alicyclic diamine. The amount of the alicyclic diamine is 15-35 mol% with regard to 100 mol% of the sum of the aromatic dicarboxylic acid and aliphatic linear diamine. The glass transition temperature of the polyamide resin is 140 °C or more. The polyamide resin is a semi-crystalline-shaped resin. The glass transition temperature of the polyamide resin is 150 °C or more. The ratio of the melting temperature of the polyamide resin with regard to the glass transition temperature is 1.9-2.3.
Abstract:
PURPOSE: A modified polyamide-based resin is provided to have excellent heat resistance, moldability, and whiteness, and to have low moisture absorption rate. CONSTITUTION: A modified polyamide-based resin includes a repeating unit derived from a dicarboxylic acid represented by chemical formula 1; and a repeating unit derived from an aliphatic saturated diamine represented by chemical formula 2. The repeating unit derived from the aliphatic saturated diamine has a carbon number different from a repeating unit derived from C2-6 aliphatic saturated diamine and a repeating unit derived from the C2-6 aliphatic saturated diamine, and includes C6-12 aliphatic saturated diamine.
Abstract:
PURPOSE: A polyamide resin is provided to enhance physical properties including heat resistance, mechanical strength, and brightness, thereby being suitable for a plastic joint among auto parts. CONSTITUTION: A polyamide resin is a polymer of dicarboxylic acid and an aliphatic diamine. The aliphatic diamine comprises one or more of aliphatic diamine monomers which is selected from an aliphatic diamine having 4,6,8, and 10 carbon numbers and one or more of aliphatic diamine monomers selected from aliphatic diamine having 12, 14, 16 and 18 carbon numbers. The aliphatic diamine monomers are included 0.1-70 mol% among whole aliphatic diamine components. A ratio of total moles of aliphatic diamine monomer(a1) and aliphatic diamine monomer(a2) to total moles of diamine monomers is 0.90-1.30.