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    MULTILAYER FILM INCLUDING FIRST AND SECOND DIELECTRIC LAYERS
    31.
    发明申请
    MULTILAYER FILM INCLUDING FIRST AND SECOND DIELECTRIC LAYERS 审中-公开

    公开(公告)号：WO2014081917A3

    公开(公告)日：2014-05-30

    申请号：PCT/US2013/071187

    申请日：2013-11-21

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： GHOSH, Dipankar ,  LYONS, Christopher S. ,  GORRELL, Robin E. ,  MAKI, Stephen P.

    IPC: H01G4/33 ,  H01G4/20 ,  H01L49/02 ,  H05K1/16

    Abstract: A multilayer dielectric film including a first dielectric layer made from a material having a first breakdown field strength and a second dielectric layer disposed on the first dielectric layer made from a material having a different breakdown filed strength. A multilayer film including a first electrically conductive layer, the first dielectric layer disposed on the first electrically conductive layer, the second dielectric layer disposed on the first dielectric layer, and a second electrically conductive layer disposed on the second dielectric layer is also disclosed. The first electrically conductive layer can have at least one of an average surface roughness of at least ten nanometers, a thickness of at least ten micrometers, or an average visible light transmission of up to ten percent. The first dielectric layer may be a polymer and typically has a lower dielectric constant than the second dielectric layer, which may be ceramic.

    HIGH FREQUENCY ELECTROMAGNETIC INTERFERENCE (EMI) COMPOSITES
    35.
    发明公开
    HIGH FREQUENCY ELECTROMAGNETIC INTERFERENCE (EMI) COMPOSITES 审中-公开
    高频电磁干扰（EMI）复合材料

    公开(公告)号：EP3308614A1

    公开(公告)日：2018-04-18

    申请号：EP16730140.7

    申请日：2016-06-02

    Applicant: 3M Innovative Properties Company

    Inventor： GHOSH, Dipankar

    IPC: H05K9/00

    Abstract: Electromagnetic interference (EMI) shielding composites and methods of producing the same are described. Carbon nanostructure (CNS) fillers including cross-linked carbon nanotubes (CNTs) and a polymeric encapsulation material are provided, where the carbon nanotubes are encapsulated by the polymeric encapsulation material. The CNS fillers are treated to remove at least a portion of the polymeric encapsulation material. After removing the polymeric encapsulation material, the CNS fillers are mixed with a curable matrix material to obtain EMI shielding composites. In some cases, the removal of the polymeric encapsulation material results in diminished dielectric polarization characteristics for the composites.

    POLYMER COMPOSITES WITH ELECTROMAGNETIC INTERFERENCE MITIGATION PROPERTIES
    36.
    发明公开
    POLYMER COMPOSITES WITH ELECTROMAGNETIC INTERFERENCE MITIGATION PROPERTIES 审中-公开
    POLYMERZUSAMMENSETZUNGEN MIT ELEKTROMAGNETISCHERINTERFERENZABSCHWÄCHUNG

    公开(公告)号：EP2959490A2

    公开(公告)日：2015-12-30

    申请号：EP14709033.6

    申请日：2014-02-18

    Applicant: 3M Innovative Properties Company

    Inventor： GHOSH, Dipankar ,  ROY, Biplab K. ,  SATARKAR, Nitin S.

    IPC: H01B1/24

    CPC classification number: H01B1/22 ,  C08K3/013 ,  C08K3/04 ,  C08K3/041 ,  C08K3/042 ,  C08K3/046 ,  C08K3/22 ,  C08K2003/2248 ,  H01B1/24 ,  C08L27/16

    Abstract: Polymer composites that are suitable for use as electromagnetic interference mitigaters include a lossy polymeric matrix, ceramic particles dispersed within the polymeric matrix, and conductive particles dispersed within the polymeric matrix. The lossy polymeric matrix may be a fluorocarbon-based polymer matrix, or an epoxy-based polymer matrix. The ceramic particles may be metal oxide particles, especially copper oxide (CuO) particles. The conductive particles may be carbon black. Other electromagnetic interference mitigating polymer matrices include a lossy polymeric matrix and copper oxide (CuO) particles dispersed within the polymeric matrix.

    Abstract translation: 适合用作电磁干扰抑制剂的聚合物复合材料包括有损聚合物基质，分散在聚合物基质内的陶瓷颗粒和分散在聚合物基质内的导电颗粒。 有损聚合物基质可以是氟碳基聚合物基质或环氧基聚合物基质。 陶瓷颗粒可以是金属氧化物颗粒，特别是氧化铜（CuO）颗粒。 导电粒子可以是炭黑。 其他电磁干扰减轻聚合物基质包括分散在聚合物基质内的有损聚合物基质和氧化铜（CuO）颗粒。

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