公开(公告)号：US20190230434A1

公开(公告)日：2019-07-25

申请号：US16375735

申请日：2019-04-04

Applicant: Apple Inc.

Inventor： Craig M. Stanley ,  Simon K. Porter ,  John H. Sheerin ,  Glenn K. Trainer ,  Jason C. Della Rosa ,  Ethan L. Huwe ,  Sean T. McIntosh ,  Erik L. Wang ,  Christopher J. Stringer ,  Molly J. Anderson

IPC: H04R1/28 ,  H01H13/02 ,  G06F3/01 ,  G06F3/02 ,  G06F3/041 ,  G06F3/0354 ,  H04R1/02 ,  H04R3/00 ,  H04R7/12 ,  H04R7/18 ,  H04R9/02 ,  H04R9/06 ,  H04R1/40 ,  H05K1/02 ,  H03K17/96 ,  H04R31/00 ,  H04R5/02 ,  H04R1/30 ,  H04R1/26 ,  G06F3/044 ,  F21V33/00 ,  F21V5/00 ,  F21V23/04 ,  F21V3/00 ,  G06F3/16 ,  H04R3/12

Abstract: This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured to reduce the strength of forces generated by a subwoofer of the array speaker.

公开(公告)号：US20190230202A1

公开(公告)日：2019-07-25

申请号：US16374611

申请日：2019-04-03

Applicant: Apple Inc.

Inventor： Erik L. Wang ,  Robert Sean Murphy ,  Tang Yew Tan ,  Jeffrey Eugene Neaves ,  Lawrence E. Davis ,  Sung H. Kim

IPC: H04M1/02 ,  H05K7/14 ,  H05K1/02 ,  H05K5/02

Abstract: Electronic devices are provided with ejectable component assemblies that can be substantially flush with the external surfaces of the housings of the devices, despite variations in their manufacture. The ejectable component assemblies may include connectors coupled to circuit boards of the devices, and trays that can be loaded with removable modules, inserted through openings in the housings of the devices, and into the connectors for functionally aligning the removable modules with the circuit boards. The ejectable component assemblies may also include ejectors coupled to the housings of the devices for ejecting the trays from the connectors and, thus, from the devices themselves.

公开(公告)号：US10248169B2

公开(公告)日：2019-04-02

申请号：US15402465

申请日：2017-01-10

Applicant: Apple Inc.

Inventor： Todd F. Gotham ,  Andrew David Lauder ,  Tang Yew Tan ,  Erik L. Wang ,  Phillip Michael Hobson ,  Richard Hung Minh Dinh ,  Christopher Stringer ,  Richard Howarth ,  John Ternus ,  Rico Zorkendorfer

IPC: G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  G06F1/18 ,  H05K5/02 ,  H04R3/00 ,  H04R1/08

Abstract: Electronic devices are provided with a protective housing having one or more housing components. A housing component can be formed from a single sheet of material to appear as if the housing component had been formed from a hollowed out solid block of material. The sheet of material may be deep drawn, forged, and machined to form the housing component. One or more holes may be formed through a portion of the housing component to provide an I/O interface.

公开(公告)号：US10129625B2

公开(公告)日：2018-11-13

申请号：US15253794

申请日：2016-08-31

Applicant: Apple Inc.

Inventor： Ethan L. Huwe ,  Brad G. Boozer ,  Erik L. Wang ,  Phillip Qian

IPC: H04R1/10

Abstract: Headphone eartips with internal support components and methods for making the same are provided. Different support components may provide specific amounts and types of additional rigidity at specific portions of an exterior surface of an outer eartip body that may be expected to interface with specific portions of an ear canal geometry when an eartip subassembly is positioned within the ear canal, such that the eartip subassembly may conform to the various shapes of the ear canal while maintaining an acoustic seal.

公开(公告)号：US09973838B2

公开(公告)日：2018-05-15

申请号：US15621802

申请日：2017-06-13

Applicant: Apple Inc.

Inventor： Phillip Qian ,  Edward Siahaan ,  Erik L. Wang ,  Esge B. Andersen

IPC: H04R1/00 ,  H04R1/08

CPC classification number: H04R1/086

Abstract: An acoustic device such as a microphone or speaker is positioned with and coupled to a housing to connect an acoustic port of the acoustic device with an external opening of the housing. A reservoir is connected to the external opening via a bleed channel. The bleed channel may be less resistive to liquid ingress than the acoustic port. As such, the reservoir and bleed channel may redirect liquid from the external opening away from the acoustic port. In some implementations, the reservoir and/or the bleed channel may be defined by one or more acoustically permeable barriers such as meshes that cover the acoustic port, compressible materials such as foams that form a perimeter around the acoustic port, and/or adhesive layers that couple the acoustic device, the housing, and/or one or more other components.

公开(公告)号：US20170374465A1

公开(公告)日：2017-12-28

申请号：US15684790

申请日：2017-08-23

Applicant: Apple Inc.

Inventor： Afrooz Family ,  Anthony P. Bidmead ,  Erik L. Wang ,  Gary P. Geaves ,  Martin E. Johnson ,  Matthew I. Brown ,  Michael B. Howes ,  Sylvain J. Choisel ,  Tomlinson M. Holman

IPC: H04R3/12 ,  H04S7/00 ,  G10L19/008

CPC classification number: H04R3/12 ,  G10L19/008 ,  H04R27/00 ,  H04S7/30 ,  H04S7/302 ,  H04S7/303

Abstract: An audio system is described that includes one or more speaker arrays that emit sound corresponding to one or more pieces of sound program content into associated zones within a listening area. Using parameters of the audio system (e.g., locations of the speaker arrays and the audio sources), the zones, the users, the pieces of sound program content, and the listening area, one or more beam pattern attributes may be generated. The beam pattern attributes define a set of beams that are used to generate audio beams for channels of sound program content to be played in each zone. The beam pattern attributes may be updated as changes are detected within the listening environment. By adapting to these changing conditions, the audio system is capable of reproducing sound that accurately represents each piece of sound program content in various zones.

公开(公告)号：US09838059B2

公开(公告)日：2017-12-05

申请号：US15226086

申请日：2016-08-02

Applicant: Apple Inc. ,  Vincent Keane Seid

Inventor： Phillip Michael Hobson ,  Erik L. Wang ,  Kenneth A. Jenks ,  Robert J. Hill ,  Robert W. Schlub ,  Richard Hung Minh Dinh ,  Tang Yew Tan ,  Adam D. Mittleman ,  Bartley K. Andre ,  Daniel J. Coster ,  Daniele de Iuliis ,  Richard P. Howarth ,  Jonathan P. Ive ,  Steven P. Jobs ,  Duncan Robert Kerr ,  Shin Nishibori ,  Matthew Dean Rohrbach ,  Douglas B. Satzger ,  Calvin Q. Seid ,  Christopher J. Stringer ,  Eugene Antony Whang ,  Rico L. Zörkendörfer

IPC: H04B1/3827 ,  G06F3/041 ,  H04M1/02 ,  H04M1/03

CPC classification number: H04B1/3833 ,  H04M1/0266 ,  H04M2250/22 ,  H04M2250/74

Abstract: A handheld electronic device may be provided that contains a conductive housing and other conductive elements. Transceiver circuitry, such as radio frequency (RF) transceiver circuitry configured to transmit and receive RF signals, may be connected to the resonating elements by transmission lines such as coaxial cables. The electronic device may have an integrated touch screen display in which a user can control the device by interacting directly with the display.

公开(公告)号：US09716934B2

公开(公告)日：2017-07-25

申请号：US14695357

申请日：2015-04-24

Applicant: APPLE INC.

Inventor： Phillip Qian ,  Edward Siahaan ,  Erik L. Wang ,  Esge B. Andersen

IPC: H04R1/00 ,  H04R1/08

CPC classification number: H04R1/086

Abstract: An acoustic device such as a microphone or speaker is positioned with and coupled to a housing to connect an acoustic port of the acoustic device with an external opening of the housing. A reservoir is connected to the external opening via a bleed channel. The bleed channel may be less resistive to liquid ingress than the acoustic port. As such, the reservoir and bleed channel may redirect liquid from the external opening away from the acoustic port. In some implementations, the reservoir and/or the bleed channel may be defined by one or more acoustically permeable barriers such as meshes that cover the acoustic port, compressible materials such as foams that form a perimeter around the acoustic port, and/or adhesive layers that couple the acoustic device, the housing, and/or one or more other components.

公开(公告)号：US09496668B1

公开(公告)日：2016-11-15

申请号：US14720059

申请日：2015-05-22

Applicant: Apple Inc.

Inventor： John J. Baker ,  Brad G. Boozer ,  Craig M. Stanley ,  Erik L. Wang ,  Nathan P. Bosscher ,  Phillip Michael Hobson ,  Stephen P. Zadesky

IPC: H01R13/74 ,  H01R13/73 ,  H01R35/02 ,  H01R13/50 ,  H01R25/00 ,  H01R27/02 ,  H01R13/717 ,  H01R13/66

CPC classification number: H01R35/02 ,  H01R12/91 ,  H01R13/50 ,  H01R13/665 ,  H01R13/6683 ,  H01R13/717 ,  H01R25/006 ,  H01R27/02

Abstract: An electronic device may have a rigid support structure to which electrical components are mounted. The rigid support structure may be an electronic device housing structure such as a housing wall having openings that receive the electrical components. The electrical components may have electrical component connectors. A printed circuit board may be used to convey signals for the electrical components. Connectors may be mounted to the printed circuit board. Lateral shift accommodation structures may be formed between the electrical component connectors and the electrical components or in the vicinity of the connectors on the printed circuit to allow the connectors on the printed circuit to mate with the electrical component connectors of the rigidly mounted electrical components.

Abstract translation: 电子设备可以具有刚性支撑结构，电气部件被安装到该刚性支撑结构上。 刚性支撑结构可以是电子设备壳体结构，例如具有容纳电气部件的开口的壳体壁。 电气部件可以具有电气部件连接器。 印刷电路板可用于传送电气部件的信号。 连接器可以安装到印刷电路板上。 可以在电气部件连接器和电气部件之间或印刷电路上的连接器附近形成侧向移动容纳结构，以允许印刷电路上的连接器与刚性安装的电气部件的电气部件连接器配合。

公开(公告)号：US20160233913A1

公开(公告)日：2016-08-11

申请号：US15098742

申请日：2016-04-14

Applicant: Apple Inc.

Inventor： Erik L. Wang ,  Phillip Michael Hobson ,  Kenneth A. Jenks ,  Adam D. Mittleman ,  Bartley K. Andre ,  Daniel J. Coster ,  Daniele De Iuliis ,  Richard P. Howarth ,  Jonathan P. Ive ,  Steven P. Jobs ,  Duncan Robert Kerr ,  Shin Nishibori ,  Matthew Dean Rohrbach ,  Douglas B. Satzger ,  Calvin Q. Seid ,  Christopher J. Stringer ,  Eugene Anthony Whang ,  Rico Zorkendorfer

IPC: H04B1/3888 ,  H04M1/02

CPC classification number: H04B1/3888 ,  G06F1/1626 ,  G06F1/1637 ,  G06F1/1656 ,  G06F1/1658 ,  H04M1/0252 ,  H04M1/026 ,  H04M1/0266 ,  H04M1/0274 ,  H04M1/0277 ,  H04M2250/22 ,  Y10T29/49002

Abstract: Portable electronic devices are provided. Each device may be formed from two parts. A first part may be provided with components such as a display, a touch screen, a cover glass, and a frame. A second part may be provided with a plastic housing, circuit boards containing electrical components, and a bezel. Engagement members may be connected to the first and second parts. The engagement members may be formed from metal clips with holes and springs with flexible spring prongs that mate with the holes in the clips. The metal clips may be welded to frame struts on the frame and the springs may be welded to the bezel. During assembly, the first part may be rotated into place within the second part. Retention clips attached to the frame may be used to secure the two parts together. Assembly instructions and associated connector numbers may be provided within the devices.