公开(公告)号：US09552022B2

公开(公告)日：2017-01-24

申请号：US14317858

申请日：2014-06-27

Applicant: Apple Inc.

Inventor： Todd F. Gotham ,  Andrew David Lauder ,  Tang Yew Tan ,  Erik L. Wang ,  Phillip Michael Hobson ,  Richard Hung Minh Dinh ,  Christopher Stringer ,  Richard Howarth ,  John Ternus ,  Rico Zorkendorfer

IPC: G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  H05K5/02

CPC classification number: G06F1/181 ,  G06F1/1601 ,  G06F1/1684 ,  H04R1/08 ,  H04R3/00 ,  H05K5/02 ,  H05K5/0243 ,  Y10T29/49002 ,  Y10T29/5116

Abstract: Electronic devices are provided with a protective housing having one or more housing components. A housing component can be formed from a single sheet of material to appear as if the housing component had been formed from a hollowed out solid block of material. The sheet of material may be deep drawn, forged, and machined to form the housing component. One or more holes may be formed through a portion of the housing component to provide an I/O interface.

Abstract translation: 电子设备设置有具有一个或多个壳体部件的保护壳体。 壳体部件可以由单张材料形成，看起来好像壳体部件是由中空的固体块形成的。 材料片可以被深拉，锻造和加工以形成壳体部件。 可以通过壳体部件的一部分形成一个或多个孔，以提供I / O接口。

公开(公告)号：US10248169B2

公开(公告)日：2019-04-02

申请号：US15402465

申请日：2017-01-10

Applicant: Apple Inc.

Inventor： Todd F. Gotham ,  Andrew David Lauder ,  Tang Yew Tan ,  Erik L. Wang ,  Phillip Michael Hobson ,  Richard Hung Minh Dinh ,  Christopher Stringer ,  Richard Howarth ,  John Ternus ,  Rico Zorkendorfer

IPC: G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  G06F1/18 ,  H05K5/02 ,  H04R3/00 ,  H04R1/08

Abstract: Electronic devices are provided with a protective housing having one or more housing components. A housing component can be formed from a single sheet of material to appear as if the housing component had been formed from a hollowed out solid block of material. The sheet of material may be deep drawn, forged, and machined to form the housing component. One or more holes may be formed through a portion of the housing component to provide an I/O interface.

公开(公告)号：US20170147041A1

公开(公告)日：2017-05-25

申请号：US15402465

申请日：2017-01-10

Applicant: Apple Inc.

Inventor： Todd F. Gotham ,  Andrew David Lauder ,  Tang Yew Tan ,  Erik L. Wang ,  Phillip Michael Hobson ,  Richard Hung Minh Dinh ,  Christopher Stringer ,  Richard Howarth ,  John Ternus ,  Rico Zorkendorfer

IPC: G06F1/18 ,  H04R3/00 ,  G06F1/16

CPC classification number: G06F1/181 ,  G06F1/1601 ,  G06F1/1684 ,  H04R1/08 ,  H04R3/00 ,  H05K5/02 ,  H05K5/0243 ,  Y10T29/49002 ,  Y10T29/5116

Abstract: Electronic devices are provided with a protective housing having one or more housing components. A housing component can be formed from a single sheet of material to appear as if the housing component had been formed from a hollowed out solid block of material. The sheet of material may be deep drawn, forged, and machined to form the housing component. One or more holes may be formed through a portion of the housing component to provide an I/O interface.