METHODS AND APPARATUS FOR CALCULATING ELECTROMAGNETIC SCATTERING PROPERTIES OF A STRUCTURE AND FOR ESTIMATION OF GEOMETRICAL AND MATERIAL PARAMETERS THEREOF
    31.
    发明申请
    METHODS AND APPARATUS FOR CALCULATING ELECTROMAGNETIC SCATTERING PROPERTIES OF A STRUCTURE AND FOR ESTIMATION OF GEOMETRICAL AND MATERIAL PARAMETERS THEREOF 审中-公开
    计算结构电磁散射特性的方法和装置及其几何和材料参数的估计

    公开(公告)号:WO2015078670A1

    公开(公告)日:2015-06-04

    申请号:PCT/EP2014/073702

    申请日:2014-11-04

    CPC classification number: G01B11/02 G03F7/705 G03F7/70625 G03F7/70633

    Abstract: In scatterometry, a merit function including a regularization parameter is used in an iterative process to find values for the scattering properties of the measured target. An optimal value for the regularization parameter is obtained for each measurement target and in each iteration of the iterative process. Various methods can be used to find the value for the regularization parameter, including the Discrepancy Principle, the chi-squared method and novel modifications of the Discrepancy Principle and the chi-squared method including a merit function.

    Abstract translation: 在散射法中,在迭代过程中使用包括正则化参数的优值函数来查找测量目标的散射特性的值。 为每个测量目标和迭代过程的每次迭代获得正则化参数的最优值。 可以使用各种方法来找出正则化参数的值,包括差异原理,卡方法和差异原理的新颖修改以及包括优值函数的卡方法。

    METHOD FOR DECREASING UNCERTAINTY IN MACHINE LEARNING MODEL PREDICTIONS

    公开(公告)号:EP3660744A1

    公开(公告)日:2020-06-03

    申请号:EP18209496.1

    申请日:2018-11-30

    Abstract: Described herein is a method for quantifying uncertainty in parameterized (e.g., machine learning) model predictions. The method comprising causing a machine learning model to predict multiple output realizations from the machine learning model for a given input; determining a variability of the predicted multiple output realizations for the given input, and using the determined variability in the predicted multiple output realizations to adjust the machine learning model to decrease an uncertainty of the machine learning model. The machine learning model comprises encoder-decoder architecture. The method comprises using the determined variability in the predicted multiple output realizations to adjust the machine learning model to decrease the uncertainty of the machine learning model for predicting wafer geometry, overlay, and/or other information as part of a semiconductor manufacturing process.

    SCATTEROMETER AND METHOD OF SCATTEROMETRY USING ACOUSTIC RADIATION

    公开(公告)号:EP3474074A1

    公开(公告)日:2019-04-24

    申请号:EP17196893.6

    申请日:2017-10-17

    Abstract: An acoustic scatterometer 502 has an acoustic source 520 operable to project acoustic radiation 526 onto a periodic structure 538 and 540 formed on a substrate 536. An acoustic detector 518 is operable to detect the -1st acoustic diffraction order 528 diffracted by the periodic structure 538 and 540 while discriminating from specular reflection (0th order 532). Another acoustic detector 522 is operable to detect the +1st acoustic diffraction order 530 diffracted by the periodic structure, again while discriminating from the specular reflection (0th order 532). The acoustic source and acoustic detector may be piezo transducers. The angle of incidence of the projected acoustic radiation 526 and location of the detectors 518 and 522 are arranged with respect to the periodic structure 538 and 540 such that the detection of the -1st and +1st acoustic diffraction orders 528 and 530 discriminates from the 0th order specular reflection 532.

    METHOD FOR DIRECT DECOMPOSITION OF STOCHASTIC CONTRIBUTORS

    公开(公告)号:EP3910418A1

    公开(公告)日:2021-11-17

    申请号:EP20174556.9

    申请日:2020-05-14

    Abstract: Described herein is a method for decomposing error contributions from multiple sources to multiple features of a pattern printed on a substrate. The method includes obtaining an image of the pattern on the substrate and obtaining, using the image, a plurality of measurement values (615;620;625) of a feature of the pattern. The measurement values are obtained for different sensor values. Further, the method includes correlating, using a decomposition algorithm (320), each measurement value of the plurality of measurement values to a linear mixture of the error contributions to generate a plurality of linear mixtures of the error contributions, and deriving, from the linear mixtures and using the decomposition algorithm, each of the error contributions (601;602;603).

    REMOVING AN ARTEFACT FROM AN IMAGE
    36.
    发明公开

    公开(公告)号:EP3889684A1

    公开(公告)日:2021-10-06

    申请号:EP20167449.6

    申请日:2020-04-01

    Abstract: An inspection tool comprising:
    an imaging system configured to image a portion of a semiconductor substrate; and
    an image analysis system configured to:
    obtain an image of a structure on the semiconductor substrate from the imaging system;
    encode the image of the structure into a latent space thereby forming a first encoding;
    subtract an artefact vector, representative of an artefact in the image, from the encoding thereby forming a second encoding; and
    decode the second encoding to obtain a decoded image.

    MACHINE LEARNING BASED IMAGE GENERATION OF AFTER-DEVELOPMENT OR AFTER-ETCH IMAGES

    公开(公告)号:EP4020085A1

    公开(公告)日:2022-06-29

    申请号:EP20216767.2

    申请日:2020-12-22

    Abstract: A method for training a machine learning model includes obtaining a set of unpaired after-development images (AD) and after-etch (AE) images associated with a substrate. Each AD image in the set is obtained at a location on the substrate that is different from the location at which any of the AE images is obtained. The method further includes training the machine learning model to generate a predicted AE image based on the AD images and the AE images, wherein the predicted AE image corresponds to a location from which an input AD image of the AD images is obtained, and corresponding non-transitory computer-readable medium.

Patent Agency Ranking