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公开(公告)号：US20190013274A1
公开(公告)日：2019-01-10
申请号：US15752476
申请日：2015-08-20
Applicant: Apple Inc.
Inventor： Daniel D. Sunshine , Paul S. Drzaic , Daniel A. Podhajny , David M. Kindlon , Hoon Sik Kim , Kathryn P. Crews , Yung-Yu Hsu
Abstract: A fabric-based item may include fabric such as woven fabric having insulating and conductive yarns or other strands of material. The conductive yarns may form signal paths. Electrical components can be embedded within pockets in the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The electrical device may be a light-emitting diode, a sensor, an actuator, or other electrical device. The electrical device may have contacts that are soldered to contacts on the interposer. The interposer may have additional contacts that are soldered to the signal paths. The fabric may have portions that form transparent windows overlapping the electrical components or that have other desired attributes.
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公开(公告)号：US12256812B1
公开(公告)日：2025-03-25
申请号：US17481167
申请日：2021-09-21
Applicant: Apple Inc.
Inventor： Kathryn P. Crews , Peter F. Coxeter , Yiwei Tao , Shantanu R. Ranade , Christopher I. Edwards , David M. Kindlon , Linda D. Benavente-Notaro
Abstract: A watch band for a smart watch can secure the smart watch to the user's wrist. The watch band can include a continuous loop of woven material to conform around the user's wrist. The watch band can further include an encasement formed from a rigid material to receive the smart watch. The encasement can protect the smart watch during activities. The watch band can include a retention portion formed from a transparent material to receive the smart watch. The watch band can also include light emitted diodes to increase visibility.
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公开(公告)号：US11998090B1
公开(公告)日：2024-06-04
申请号：US17554350
申请日：2021-12-17
Applicant: Apple Inc.
Inventor： Kathryn P. Crews , Peter F. Coxeter , Yiwei Tao , Shantanu R Ranade , Christopher I. Edwards , David M. Kindlon , Linda D. Benavente-Notaro
CPC classification number: A44C5/0053 , G06F3/011 , G06K19/0614
Abstract: Systems of the present disclosure can provide a watch band that provide a marker pattern to a computer-generated reality device. The watch band can include structures or features that provide an identifiable marker pattern to the computer-generated reality device. The structures or features that provide the marker pattern can be invisible or imperceptible to the user. Structures or features of the watch band can include infrared reflective thread, visually obscured markers, or lenticular lens assemblies.
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公开(公告)号：US20240068135A1
公开(公告)日：2024-02-29
申请号：US18504549
申请日：2023-11-08
Applicant: Apple Inc.
Inventor： Kyle L. Chatham , Kathryn P. Crews , Didio V. Gomes , Benjamin J. Grena , Storrs T. Hoen , Steven J. Keating , David M. Kindlon , Daniel A. Podhajny , Andrew L. Rosenberg , Daniel D. Sunshine , Lia M. Uesato , Joseph B. Walker , Felix Binder , Bertram Wendisch , Martin Latta , Ulrich Schläpfer , Franck Robin , Michael Baumann , Helen Wächter Fischer
CPC classification number: D03D1/0088 , B23K1/0008 , D03D41/00 , D03J1/00 , H05K1/038 , D10B2401/16 , D10B2401/18
Abstract: Interlacing equipment may be used to form fabric and to create a gap in the fabric. The fabric may include one or more conductive strands. An insertion tool may be used to align an electrical component with the conductive strands during interlacing operations. A soldering tool may be used to remove insulation from the conductive strands to expose conductive segments on the conductive strands. The soldering tool may be used to solder the conductive segments to the electrical component. The solder connections may be located in grooves in the electrical component. An encapsulation tool may dispense encapsulation material in the grooves to encapsulate the solder connections. After the electrical component is electrically connected to the conductive strands, the insertion tool may position and release the electrical component in the gap. A component retention tool may temporarily be used to retain the electrical component in the gap as interlacing operations continue.
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公开(公告)号：US11913143B2
公开(公告)日：2024-02-27
申请号：US16809445
申请日：2020-03-04
Applicant: Apple Inc.
Inventor： Kyle L Chatham , Kathryn P. Crews , Didio V. Gomes , Benjamin J. Grena , Storrs T. Hoen , Steven J. Keating , David M. Kindlon , Daniel A. Podhajny , Andrew L. Rosenberg , Daniel D. Sunshine , Lia M. Uesato , Joseph B. Walker , Felix Binder , Bertram Wendisch , Martin Latta , Ulrich Schläpfer , Franck Robin , Michael Baumann , Helen Wächter Fischer
CPC classification number: D03D1/0088 , B23K1/0008 , D03D41/00 , D03J1/00 , H05K1/038 , D10B2401/16 , D10B2401/18
Abstract: Interlacing equipment may be used to form fabric and to create a gap in the fabric. The fabric may include one or more conductive strands. An insertion tool may be used to align an electrical component with the conductive strands during interlacing operations. A soldering tool may be used to remove insulation from the conductive strands to expose conductive segments on the conductive strands. The soldering tool may be used to solder the conductive segments to the electrical component. The solder connections may be located in grooves in the electrical component. An encapsulation tool may dispense encapsulation material in the grooves to encapsulate the solder connections. After the electrical component is electrically connected to the conductive strands, the insertion tool may position and release the electrical component in the gap. A component retention tool may temporarily be used to retain the electrical component in the gap as interlacing operations continue.
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Patent Agency Ranking
公开(公告)号：US20230189445A1
公开(公告)日：2023-06-15
申请号：US18164180
申请日：2023-02-03
Applicant: Apple Inc.
Inventor： Bilal Mohamed Ibrahim Kani , Benjamin J. Grena , Kyusang Kim , David M. Kindlon , Pierpaolo Lupo , Kishore N. Renjan , Manoj Vadeentavida
CPC classification number: H05K1/186 , H05K1/189 , H05K1/0298 , H05K1/0274 , H05K2201/10083 , H05K2201/10106 , H05K2201/10121 , H05K2201/10151 , H05K2201/10159
Abstract: Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.
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公开(公告)号：US20230056922A1
公开(公告)日：2023-02-23
申请号：US17806412
申请日：2022-06-10
Applicant: Apple Inc.
Inventor： Bilal Mohamed Ibrahim Kani , Ali N. Ergun , Kishore N. Renjan , Kyusang Kim , Manoj Vadeentavida , Benjamin J. Grena , David M. Kindlon , Lan H. Hoang
IPC: H01L25/16 , H01L23/498 , H01R12/79 , H01R13/6581 , H01L23/31 , H01R12/62 , H01L21/56 , H01R43/20 , H01R12/59 , G01D11/24
Abstract: Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.
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公开(公告)号：US20220346228A1
公开(公告)日：2022-10-27
申请号：US17860839
申请日：2022-07-08
Applicant: Apple Inc.
Inventor： Daniel D. Sunshine , David M. Kindlon , Michael B. Nussbaum , Andrew L. Rosenberg , Andrew Sterian , Breton M. Saunders , Christopher A. Schultz , David A. Bolt , Mark J. Beesley , Peter W. Mash , Steven Keating , Chang Liu , Lan Hoang
Abstract: An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.
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公开(公告)号：US20210337671A1
公开(公告)日：2021-10-28
申请号：US17212983
申请日：2021-03-25
Applicant: Apple Inc.
Inventor： Bilal Mohamed Ibrahim Kani , Benjamin J. Grena , Kyusang Kim , David M. Kindlon , Pierpaolo Lupo , Kishore N. Renjan , Manoj Vadeentavida
Abstract: Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.
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公开(公告)号：US20210185808A1
公开(公告)日：2021-06-17
申请号：US17184927
申请日：2021-02-25
Applicant: Apple Inc.
Inventor： Daniel D. Sunshine , David M. Kindlon , Michael B. Nussbaum , Andrew L. Rosenberg , Andrew Sterian , Breton M. Saunders , Christopher A. Schultz , David A. Bolt , Mark J. Beesley , Peter W. Mash , Steven Keating , Chang Liu , Lan Hoang
Abstract: An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.
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