公开(公告)号：US20140362522A1

公开(公告)日：2014-12-11

申请号：US14297576

申请日：2014-06-05

Applicant: Apple Inc.

Inventor： Brett W. Degner ,  Eric R. Prather ,  David H. Narajowski ,  Frank F. Liang ,  Jay S. Nigen ,  Jesse T. Dybenko ,  Connor R. Duke ,  Eugene A. Whang ,  Christopher J. Stringer ,  Joshua D. Banko ,  Caitlin Elizabeth Kalinowski ,  Jonathan L. Berk ,  Matthew P. Casebolt ,  Kevin S. Fetterman ,  Eric J. Weirshauser

IPC: G06F1/20

CPC classification number: G06F1/181 ,  G02B6/0001 ,  G02B6/0008 ,  G02B6/001 ,  G06F1/182 ,  G06F1/183 ,  G06F1/185 ,  G06F1/188 ,  G06F1/20 ,  G06F1/206 ,  G06F3/00 ,  G08B5/36 ,  G08B21/18 ,  H01L23/4093 ,  H05K1/0203 ,  H05K5/03 ,  H05K7/20009 ,  H05K7/20145 ,  H05K7/20154 ,  H05K7/20163 ,  H05K7/20172 ,  H05K7/20209 ,  H05K7/2039 ,  H05K7/2049

Abstract: The present application describes various embodiments regarding systems and methods for providing efficient heat rejection for a lightweight and durable compact computing system having a small form factor. The compact computing system can take the form of a desktop computer. The desktop computer can include a monolithic top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing. A mixed flow fan is utilized to efficiently pull cooling air through the compact computing system.

Abstract translation: 本申请描述了关于用于为具有小外形尺寸的轻便且耐用的小型计算系统提供有效散热的系统和方法的各种实施例。 紧凑型计算系统可以采用台式计算机的形式。 台式计算机可以包括具有形成在其中的集成支撑系统的整体式顶壳，该集成支撑系统提供结构支撑，其通过顶壳分布施加的载荷，从而防止翘曲和弯曲。 利用混流风扇有效地将冷却空气拉过小型计算系统。

公开(公告)号：US12046534B2

公开(公告)日：2024-07-23

申请号：US17653633

申请日：2022-03-04

Applicant: Apple Inc.

Inventor： Simon J. Trivett ,  Brett W. Degner ,  Mahesh S. Hardikar ,  Michael E. Leclerc ,  Eric R. Prather ,  Kevin J. Ryan

IPC: H01L23/40 ,  G06F1/20 ,  H05K1/02 ,  H05K7/20

CPC classification number: H01L23/4093 ,  G06F1/206 ,  H05K1/0203 ,  H05K7/2039 ,  H05K2201/10515

Abstract: This application relates to modifications and enhancements to assemblies used with integrated circuits. In the described embodiments, multiple thermal components (e.g., vapor chambers, fin stacks, heat pipes) can be used to provide a dual-sided thermal energy extraction solution for a circuit board and an integrated circuit located on the circuit board. The thermal components can provide thermal energy dissipation capabilities for additional heat-generating components on the circuit board. Additionally, multiple plates can provide a compression force used to maintain contact between the integrated circuit and the circuit board, and in particular, between contact pads of the integrated circuit and pins, or springs, of a socket located on the circuit board.

公开(公告)号：US12016123B2

公开(公告)日：2024-06-18

申请号：US16889041

申请日：2020-06-01

Applicant: Apple Inc.

Inventor： Brett W. Degner ,  Michael E. Leclerc ,  Eric R. Prather ,  Scott J. Campbell ,  James M. Cuseo ,  Rodrigo Dutervil Mubarak ,  Ian A. Guy ,  Daniel D. Hershey ,  Mariel L. Lanas ,  Michael D. McBroom ,  David C. Parell ,  Bartley K. Andre ,  Danny L. McBroom ,  Houtan R. Farahani

IPC: H05K1/14 ,  H05K5/02 ,  H05K7/14 ,  H05K7/20

CPC classification number: H05K1/141 ,  H05K5/0273 ,  H05K5/0295 ,  H05K7/1405 ,  H05K7/1409 ,  H05K7/20163 ,  H05K7/20172 ,  H05K7/20209

Abstract: Computer modules that can have a high-capacity, can simplify the design of a computer system housing the modules, can utilize system resources in a highly configurable manner, can provide a variety of functionality, and can be readily inserted into, and removed from, a computer system.

公开(公告)号：US20230089080A1

公开(公告)日：2023-03-23

申请号：US18051745

申请日：2022-11-01

Applicant: Apple Inc.

Inventor： Eugene A. Whang ,  Christopher J. Stringer ,  Brett W. Degner ,  David H. Narajowski ,  Patrick Kessler ,  Eric R. Prather ,  Caitlin Elizabeth Kalinowski ,  Adam T. Stagnaro ,  Daniel L. McBroom ,  Matthew P. Casebolt ,  Michael D. McBroom

IPC: G06F1/18 ,  G06F1/20 ,  H05K7/20 ,  H01L23/40 ,  H05K5/03 ,  H05K1/02 ,  F21V8/00 ,  G06F3/00 ,  G08B5/36 ,  G08B21/18 ,  H04R1/02

Abstract: A desktop computing system having at least a central core surrounded by housing having a shape that defines a volume in which the central core resides is described. The housing includes a first opening and a second opening axially displaced from the first opening. The first opening having a size and shape in accordance with an amount of airflow used as a heat transfer medium for cooling internal components, the second opening defined by a lip that engages a portion of the airflow in such a way that at least some of the heat transferred to the air flow from the internal components is passed to the housing.

公开(公告)号：US11339793B2

公开(公告)日：2022-05-24

申请号：US16452074

申请日：2019-06-25

Applicant: Apple Inc.

Inventor： Anthony J. Aiello ,  Cheng P. Tan ,  Jesse T. Dybenko ,  Arash Naghib Lahouti ,  Eric R. Prather ,  Philippe P. Herrou ,  Ashkan Rasouli ,  Brett W. Degner ,  Michael E. LeClerc

IPC: F04D27/02 ,  F04D29/40 ,  F04D1/10 ,  F04D29/32

Abstract: Systems and methods are provided for mitigating recirculation of backflow fluid through a fan. The fan includes a housing having a channel that extends from an inlet to an outlet of the housing. A rotor assembly is positioned within the channel and is configured to direct a fluid flow from the inlet to the outlet. The rotor assembly includes a hub, a plurality of fan blades, and a shroud disposed about a circumference of the fan blades, where a radial gap extends between the shroud and the housing. The radial gap is configured to receive a portion of the fluid flow from the outlet as backflow fluid. The rotor assembly also includes an inlet flange that is configured receive the backflow fluid from the radial gap and to direct the backflow fluid in a direction away from the inlet prior to discharge of the backflow fluid from the radial gap.

公开(公告)号：US11297732B2

公开(公告)日：2022-04-05

申请号：US16867405

申请日：2020-05-05

Applicant: Apple Inc.

Inventor： Eric R. Prather ,  Clark E. Waterfall ,  Reuben J. Williams ,  Vinh H. Diep

IPC: H05K7/20 ,  F28D15/02 ,  H01L23/427 ,  H01L23/467 ,  F28F1/12

Abstract: An electronic device includes an outer housing having an upper enclosure and a foot coupled thereto, a heat generating component, and a fan assembly integrated into the foot and situated proximate a bottom surface of the heat generating component. The foot can include inlet and outlet vents. The fan assembly can include an inlet, outlet, impeller with blades, shroud and fin stack. The electronic device can also include a heat pipe, a heat transfer stage, a PCB, and a bottom shield. Airflow through the electronic device can be directed across the fin stack, heat pipe, heat transfer stage, and bottom shield. Airflow can occur over a substantially level path through the electronic device from the inlet to outlet vents.

公开(公告)号：US20210059071A1

公开(公告)日：2021-02-25

申请号：US16867405

申请日：2020-05-05

Applicant: Apple Inc.

Inventor： Eric R. Prather ,  Clark E. Waterfall ,  Reuben J. Williams ,  Vinh H. Diep

IPC: H05K7/20 ,  F28D15/02 ,  H01L23/427

Abstract: An electronic device includes an outer housing having an upper enclosure and a foot coupled thereto, a heat generating component, and a fan assembly integrated into the foot and situated proximate a bottom surface of the heat generating component. The foot can include inlet and outlet vents. The fan assembly can include an inlet, outlet, impeller with blades, shroud and fin stack. The electronic device can also include a heat pipe, a heat transfer stage, a PCB, and a bottom shield. Airflow through the electronic device can be directed across the fin stack, heat pipe, heat transfer stage, and bottom shield. Airflow can occur over a substantially level path through the electronic device from the inlet to outlet vents.

公开(公告)号：US20200150729A1

公开(公告)日：2020-05-14

申请号：US16746829

申请日：2020-01-18

Applicant: Apple Inc.

Inventor： Eugene A. Whang ,  Christopher J. Stringer ,  Brett W. Degner ,  David H. Narajowski ,  Patrick Kessler ,  Eric R. Prather ,  Caitlin Elizabeth Kalinowski ,  Adam T. Stagnaro ,  Daniel L. McBroom ,  Matthew P. Casebolt ,  Michael D. McBroom

IPC: G06F1/18 ,  H05K7/20 ,  G08B21/18 ,  G08B5/36 ,  G06F3/00 ,  G06F1/20 ,  F21V8/00 ,  H05K1/02 ,  H05K5/03 ,  H01L23/40

Abstract: A desktop computing system having at least a central core surrounded by housing having a shape that defines a volume in which the central core resides is described. The housing includes a first opening and a second opening axially displaced from the first opening. The first opening having a size and shape in accordance with an amount of airflow used as a heat transfer medium for cooling internal components, the second opening defined by a lip that engages a portion of the airflow in such a way that at least some of the heat transferred to the air flow from the internal components is passed to the housing.

公开(公告)号：US10606325B2

公开(公告)日：2020-03-31

申请号：US15994753

申请日：2018-05-31

Applicant: Apple Inc.

Inventor： Brett W. Degner ,  Eric R. Prather ,  William K. Smith ,  Anthony Joseph Aiello ,  Jesse T. Dybenko ,  Arash Naghib Lahouti ,  Kristopher P. Laurent

IPC: G06F1/20 ,  F28D15/02 ,  H05K7/20 ,  F28F1/32 ,  G06F1/16 ,  F04D29/42 ,  F04D25/16 ,  F04D29/44 ,  F28D21/00

Abstract: A thermal management system that includes a fan assembly, a heat exchanger, and an insulating box is described. The fan assembly can have two impellers and a housing that includes two scroll portions. An internal portion of the scroll wall can be truncated. A motor housing can be connected to the fan housing via multiple struts. The struts can be oriented angularly with a tangential component and can slope inward to increase the effective inlet area. The heat exchanger can be formed of a fin stack that has a curved body that defines an airflow path that turns radially from the inlet to the exhaust. The heat exchanger can have an inlet that is smaller than the exhaust. The heat exchanger can be connected to one or more heat pipes. The insulating box can have a grid that directs air to certain specific directions.

公开(公告)号：US20160349806A1

公开(公告)日：2016-12-01

申请号：US15234629

申请日：2016-08-11

Applicant: Apple Inc.

Inventor： Eugene A. Whang ,  Christopher J. Stringer ,  Brett W. Degner ,  David H. Narajowski ,  Patrick Kessler ,  Eric R. Prather ,  Caitlin Elizabeth Kalinowski ,  Adam T. Stagnaro ,  Daniel L. McBroom ,  Matthew P. Casebolt ,  Michael D. McBroom

IPC: G06F1/18 ,  G06F1/20

CPC classification number: G06F1/181 ,  G02B6/0001 ,  G02B6/0008 ,  G02B6/001 ,  G06F1/182 ,  G06F1/183 ,  G06F1/185 ,  G06F1/188 ,  G06F1/20 ,  G06F1/206 ,  G06F3/00 ,  G08B5/36 ,  G08B21/18 ,  H01L23/4093 ,  H05K1/0203 ,  H05K5/03 ,  H05K7/20009 ,  H05K7/20145 ,  H05K7/20154 ,  H05K7/20163 ,  H05K7/20172 ,  H05K7/20209 ,  H05K7/2039 ,  H05K7/2049

Abstract: A desktop computing system having at least a central core surrounded by housing having a shape that defines a volume in which the central core resides is described. The housing includes a first opening and a second opening axially displaced from the first opening. The first opening having a size and shape in accordance with an amount of airflow used as a heat transfer medium for cooling internal components, the second opening defined by a lip that engages a portion of the airflow in such a way that at least some of the heat transferred to the air flow from the internal components is passed to the housing.

Abstract translation: 描述了至少具有由外壳包围的中心芯片的桌面计算系统，所述外壳具有限定其中心芯所在的卷的形状。 壳体包括从第一开口轴向移动的第一开口和第二开口。 第一开口具有根据用作冷却内部部件的传热介质的气流量的尺寸和形状，第二开口由唇缘限定，该唇缘以一定的方式接合气流的一部分，使得至少一些 传递到来自内部部件的空气流的热量被传递到壳体。