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公开(公告)号：US12218424B2
公开(公告)日：2025-02-04
申请号：US17832421
申请日：2022-06-03
Applicant: Apple Inc.
Inventor： Bhaskara R. Rupakula , Harish Rajagopalan , Hao Xu , Jennifer M. Edwards , Bilgehan Avser , Siwen Yong
Abstract: An electronic device may be provided with a conductive sidewall. An aperture may be formed in the sidewall. The sidewall may have a cavity that extends from the aperture towards the interior of the device. The cavity may be filled with an injection-molded plastic substrate. A dielectric block having a dielectric constant greater than that of the injection-molded plastic substrate and the antenna layers may be embedded in the injection-molded plastic substrate. The dielectric block may at least partially overlap an antenna. The antenna may convey radio-frequency signals at a frequency greater than 10 GHz through the cavity, the dielectric block, the injection-molded plastic substrate, and the aperture. The dielectric block may increase the effective dielectric constant of the cavity, allowing the antenna to cover relatively low frequencies without increasing the size of the aperture.
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公开(公告)号：US11955717B2
公开(公告)日：2024-04-09
申请号：US17471037
申请日：2021-09-09
Applicant: Apple Inc.
Inventor： Thomas Wu Yang , Michael D. Quinones , Harish Rajagopalan , Gareth L. Rose , Bhaskara R. Rupakula , Jiechen Wu , Hao Xu
IPC: H01Q21/08 , H01Q1/22 , H01Q13/06 , H04B7/0413 , H04B7/12
CPC classification number: H01Q21/08 , H01Q1/2283 , H01Q13/06 , H04B7/0413 , H04B7/12
Abstract: A radio frequency system package may include waveguides and loading blocks. The loading blocks may include dielectric material having a high dielectric constant between 13 and 20. Additionally, the loading blocks may be made of mold, epoxy, or the like material, and the loading blocks may fit into a region cut out of the waveguides. Moreover, the loading blocks may lower the cut-off frequency for wireless communication otherwise provided by the waveguides without the loading blocks (e.g., 28 GHz). In particular, the loading blocks may facilitate communication in low mmWave frequencies, such as 24 GHz.
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公开(公告)号：US20240079784A1
公开(公告)日：2024-03-07
申请号：US18458710
申请日：2023-08-30
Applicant: Apple Inc.
Inventor： Han Wang , Victor C. Lee , Jingni Zhong , Ming Chen , Bhaskara R. Rupakula , Yiren Wang , Yuan Tao , Christopher Q. Ma , Zhiheng Zhou , Sherry Cao , Kevin M. Froese , Hao Xu , Hongfei Hu , Mattia Pascolini
CPC classification number: H01Q9/0414 , H01Q9/0442 , H01Q9/40
Abstract: An electronic device may be provided with an antenna having a resonating element and a light source module mounted to a flexible printed circuit and a metal cowling. The module may emit light through a rear housing wall. The printed circuit may be interposed between the metal cowling and a conductive support plate in the rear housing wall. The printed circuit may include a ground trace coupled to the resonating element. A dimpled pad may couple the ground trace to the support plate. Compressive foam may be used to exert a force against the flexible printed circuit that presses the dimpled pad against the conductive support plate. The ground trace and the dimpled pad may form a return path to ground for the resonating element. The dimpled pad may occupy less height within the device than other structures such as metal springs.
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公开(公告)号：US20240079782A1
公开(公告)日：2024-03-07
申请号：US18458916
申请日：2023-08-30
Applicant: Apple Inc.
Inventor： Alden T. Rush , Han Wang , Jingni Zhong , Ming Chen , Yiren Wang , Yuan Tao , Hao Xu , Hongfei Hu , Mattia Pascolini
Abstract: An electronic device may be provided with a housing and an antenna. The antenna may be on a first substrate mounted to a second substrate. The housing may include a dielectric cover, a conductive plate on the dielectric cover, and a mid-chassis. The second substrate may be mounted to the mid-chassis. The antenna may include a conductive patch extending from a segment of a conductive ring on the first substrate. The conductive plate may have an opening aligned with the conductive patch. The first substrate may be separated from the dielectric cover by an air gap. A conductive gasket may couple the conductive ring to the conductive plate and may laterally surround the air gap and the opening. The antenna may convey ultra-wideband (UWB) signals through the air gap, the opening, and the dielectric cover layer.
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公开(公告)号：US20240079761A1
公开(公告)日：2024-03-07
申请号：US18458835
申请日：2023-08-30
Applicant: Apple Inc.
Inventor： Jingni Zhong , Ming Chen , Han Wang , Alden T Rush , Behnam Ghassemiparvin , Bhaskara R Rupakula , Yiren Wang , Yuan Tao , Hao Xu , Jennifer M Edwards , Hongfei Hu , Mattia Pascolini
CPC classification number: H01Q1/243 , H01Q1/48 , H01Q9/0407
Abstract: An electronic device may be provided with a flexible printed circuit and a rigid printed circuit mounted to the flexible printed circuit using a board-to-board (B2B) connector. The flexible printed circuit may include signal conductors coupled to one or more antennas on the rigid printed circuit through the B2B connector. A given one of the signal conductors may include a phase shifter segment on the flexible printed circuit and/or a thick impedance matching segment on the rigid printed circuit that help to form a smooth impedance transition from the flexible printed circuit to the rigid printed circuit and the antenna(s). The B2B connector may include signal contacts interleaved with a ground contacts. The B2B connector may include ground bars laterally surrounding the signal and ground contacts to maximize the strength of mechanical coupling between the flexible printed circuit and the rigid printed circuit.
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Patent Agency Ranking
公开(公告)号：US20240072417A1
公开(公告)日：2024-02-29
申请号：US18502979
申请日：2023-11-06
Applicant: Apple Inc.
Inventor： Jennifer M. Edwards , Harish Rajagopalan , Simone Paulotto , Bilgehan Avser , Hao Xu , Rodney A. Gomez Angulo , Siwen Yong , Matthew A. Mow , Mattia Pascolini
CPC classification number: H01Q1/243 , H01Q1/38 , H01Q3/26 , H01Q3/2605 , H01Q3/2658 , H01Q9/0414 , H01Q21/061 , H01Q21/065 , H01Q21/22
Abstract: An electronic device may be provided with a dielectric cover layer, a dielectric substrate, and a phased antenna array on the dielectric substrate for conveying millimeter wave signals through the dielectric cover layer. The array may include conductive traces mounted against the dielectric layer. The conductive traces may form patch elements or parasitic elements for the phased antenna array. The dielectric layer may have a dielectric constant and a thickness selected to form a quarter wave impedance transformer for the array at a wavelength of operation of the array. The substrate may include fences of conductive vias that laterally surround each of the antennas within the array. When configured in this way, signal attenuation, destructive interference, and surface wave generation associated with the presence of the dielectric layer over the phased antenna array may be minimized.
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公开(公告)号：US11811133B2
公开(公告)日：2023-11-07
申请号：US17314740
申请日：2021-05-07
Applicant: Apple Inc.
Inventor： Jennifer M. Edwards , Harish Rajagopalan , Simone Paulotto , Bilgehan Avser , Hao Xu , Rodney A. Gomez Angulo , Siwen Yong , Matthew A. Mow , Mattia Pascolini
CPC classification number: H01Q1/243 , H01Q1/38 , H01Q3/26 , H01Q3/2605 , H01Q3/2658 , H01Q21/061 , H01Q21/065 , H01Q21/22
Abstract: An electronic device may be provided with a dielectric cover layer, a dielectric substrate, and a phased antenna array on the dielectric substrate for conveying millimeter wave signals through the dielectric cover layer. The array may include conductive traces mounted against the dielectric layer. The conductive traces may form patch elements or parasitic elements for the phased antenna array. The dielectric layer may have a dielectric constant and a thickness selected to form a quarter wave impedance transformer for the array at a wavelength of operation of the array. The substrate may include fences of conductive vias that laterally surround each of the antennas within the array. When configured in this way, signal attenuation, destructive interference, and surface wave generation associated with the presence of the dielectric layer over the phased antenna array may be minimized.
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公开(公告)号：US11728569B2
公开(公告)日：2023-08-15
申请号：US17111131
申请日：2020-12-03
Applicant: Apple Inc.
Inventor： Bilgehan Avser , Harish Rajagopalan , Simone Paulotto , Jennifer M. Edwards , Hao Xu , Rodney A. Gomez Angulo , Matthew D. Hill , Mattia Pascolini
CPC classification number: H01Q9/0485 , H01Q1/243 , H01Q21/0075
Abstract: An electronic device may be provided with a phased antenna array and a display cover layer. The phased antenna array may include a dielectric resonator antenna. The dielectric resonator antenna may include a dielectric resonating element embedded in a lower permittivity dielectric substrate. The substrate and the resonating element may be mounted to a flexible printed circuit. A slot may be formed in ground traces on the flexible printed circuit and aligned with the resonating element. The slot may excite resonant modes of the resonating element. The resonating element may convey corresponding radio-frequency signals through the cover layer. A dielectric matching layer may be interposed between the resonating element and the cover layer. If desired, the slot may radiate additional radio-frequency signals and the matching layer may have a tapered shape. Dielectric resonator antennas for covering different polarizations and frequencies may be interleaved across the array.
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公开(公告)号：US20220094078A1
公开(公告)日：2022-03-24
申请号：US17031780
申请日：2020-09-24
Applicant: Apple Inc.
Inventor： Kexin Ma , Siwen Yong , Jiangfeng Wu , Simon G. Begashaw , Madhusudan Chaudhary , Lijun Zhang , Yi Jiang , Hao Xu , Mattia Pascolini
Abstract: An electronic device may include first and second phased antenna arrays that convey radio-frequency signals at frequencies greater than 10 GHz. The second array may have fewer antennas than the first array. Control circuitry may control the first and second arrays in a diversity mode and in a simultaneous array mode. In the diversity mode, the first array may form a first signal beam while the second array is inactive. When the first array is blocked by an object or otherwise exhibits unsatisfactory performance, the second array may form a second signal beam while the first array is inactive. In the simultaneous mode, the first and second arrays may form a combined array that produces a third signal beam. The combined array may maximize gain. Hierarchical beam searching operations may be performed. The arrays may be distributed across one or more modules.
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公开(公告)号：US11139588B2
公开(公告)日：2021-10-05
申请号：US15950677
申请日：2018-04-11
Applicant: Apple Inc.
Inventor： Jennifer M. Edwards , Harish Rajagopalan , Simone Paulotto , Bilgehan Avser , Hao Xu , Rodney A. Gomez Angulo , Siwen Yong , Matthew A. Mow , Mattia Pascolini
Abstract: An electronic device may be provided with a dielectric cover layer, a dielectric substrate, and a phased antenna array on the dielectric substrate for conveying millimeter wave signals through the dielectric cover layer. The array may include conductive traces mounted against the dielectric layer. The conductive traces may form patch elements or parasitic elements for the phased antenna array. The dielectric layer may have a dielectric constant and a thickness selected to form a quarter wave impedance transformer for the array at a wavelength of operation of the array. The substrate may include fences of conductive vias that laterally surround each of the antennas within the array. When configured in this way, signal attenuation, destructive interference, and surface wave generation associated with the presence of the dielectric layer over the phased antenna array may be minimized.
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