公开(公告)号：US20140227833A1

公开(公告)日：2014-08-14

申请号：US14252596

申请日：2014-04-14

Applicant: Apple Inc.

Inventor： Shawn X. Arnold ,  Terry L. Gilton ,  Matthew E. Last

IPC: H01L23/00

CPC classification number: H05K1/183 ,  G06F1/16 ,  G06F3/041 ,  G06K9/00053 ,  H01L23/24 ,  H01L24/11 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/85 ,  H01L29/0657 ,  H01L2224/43 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48479 ,  H01L2224/85 ,  H01L2224/85051 ,  H01L2224/85186 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/10155 ,  H01L2924/10253 ,  H05K1/111 ,  H05K2201/09036 ,  H05K2201/10151 ,  H01L2924/20752 ,  H01L2224/48471 ,  H01L2224/4554

Abstract: Various methods for forming a low profile assembly are described. The low profile assembly may include an integrated circuit. The integrated circuit as well as components associated with the integrated circuit may be positioned below a surface plane of a printed circuit board in which the integrated circuit is located. The integrated circuit may include bond wires configured to electrically connect the integrated circuits to other components. The low profile assembly may include forming various layers over a substrate and later removing some of the layers.

Abstract translation: 描述了用于形成低轮廓组件的各种方法。 薄型组件可以包括集成电路。 集成电路以及与集成电路相关的部件可以位于集成电路所在的印刷电路板的表面的下方。 集成电路可以包括配置成将集成电路电连接到其他部件的接合线。 薄型组件可以包括在衬底上形成各种层并且随后去除一些层。