公开(公告)号：US11803276B2

公开(公告)日：2023-10-31

申请号：US17116907

申请日：2020-12-09

Applicant: Apple Inc.

Inventor： Dhaval C. Patel ,  Eugene C. Cheung ,  Pey-Jiun Ko ,  Po-Jui Chen ,  Robert W. Rumford ,  Steve L. Terry ,  Wei Lin ,  Xiaofan Niu ,  Xiaoqi Zhou ,  Yi Gu ,  Yindar Chuo ,  Rasmi R. Das ,  Steven M. Scardato ,  Se Hyun Ahn ,  Victor H. Yin ,  Wookyung Bae ,  Christopher L. Boitnott ,  Chun-Hao Tung ,  Mookyung Son ,  Sunggu Kang ,  Nathan K. Gupta ,  John Z. Zhong

IPC: G06F3/044 ,  G02F1/1339 ,  G06F3/041 ,  G01L1/14 ,  G01L9/00

CPC classification number: G06F3/0443 ,  G01L1/146 ,  G02F1/13394 ,  G02F1/13398 ,  G06F3/041 ,  G06F3/0412 ,  G06F3/0446 ,  G06F3/0447 ,  G01L9/0052 ,  G06F3/04146 ,  G06F2203/04102 ,  G06F2203/04105

Abstract: An electronic device with a force sensing device is disclosed. The electronic device comprises a user input surface defining an exterior surface of the electronic device, a first capacitive sensing element, and a second capacitive sensing element capacitively coupled to the first capacitive sensing element. The electronic device also comprises a first spacing layer between the first and second capacitive sensing elements, and a second spacing layer between the first and second capacitive sensing elements. The first and second spacing layers have different compositions. The electronic device also comprises sensing circuitry coupled to the first and second capacitive sensing elements configured to determine an amount of applied force on the user input surface. The first spacing layer is configured to collapse if the applied force is below a force threshold, and the second spacing layer is configured to collapse if the applied force is above the force threshold.

公开(公告)号：US20230184939A1

公开(公告)日：2023-06-15

申请号：US17549917

申请日：2021-12-14

Applicant: Apple Inc.

Inventor： Yazan Z. Alnahhas ,  Eamon H. O'Connor ,  Jianmin Gong ,  Matthew C. Waldon ,  Mauro O. Magnaghi ,  Meng Zhang ,  Prabhakar Gulgunje ,  Wei Lin ,  Yohai Zmora

IPC: G01S17/10 ,  G01S7/4865 ,  G02B6/02

CPC classification number: G01S17/10 ,  G01S7/4865 ,  G02B6/02033

Abstract: A proximity sensor includes a light source configured to emit a beam of optical radiation and a detector configured to output an electrical signal in response to the optical radiation that is incident on the detector. A first optical multimode fiber is configured to receive the emitted beam and to direct the emitted beam toward an object. A second optical multimode fiber is configured to receive the optical radiation reflected from the object and to convey the received optical radiation to the detector. A processor is coupled to process the electrical signal so as to compute a distance to the object.

公开(公告)号：US11500228B1

公开(公告)日：2022-11-15

申请号：US17156139

申请日：2021-01-22

Applicant: Apple Inc.

Inventor： Wei Lin ,  Chih-Yao Chang ,  Nathan K. Gupta

IPC: G02F1/01 ,  F21V8/00 ,  G02B6/02 ,  G02B6/36

Abstract: An electronic device may have a display, a display cover layer, and a sheet-packed coherent fiber bundle. The coherent fiber bundle may have an input surface that receives an image from the display and a corresponding output surface to which the image is transported. The coherent fiber bundle may be placed between the display and the display cover layer and mounted to a housing. The coherent fiber bundle may have fiber cores with bends that help conceal the housing from view and make the display appear borderless. The coherent fiber bundle has filaments formed from elongated strands of binder in which multiple fiber cores are embedded. Sheets of filaments are stacked and fused together to form the coherent fiber bundle. By aligning and fusing the sheets with respect to each other the filaments are packed with a desired density and uniformity.

公开(公告)号：US20190179450A1

公开(公告)日：2019-06-13

申请号：US16212488

申请日：2018-12-06

Applicant: Apple Inc.

Inventor： Wei Lin ,  Henry E. Herman, III ,  Po-Jui Chen ,  Robert W. Rumford ,  Steve L. Terry ,  Yindar Chuo

IPC: G06F3/044

Abstract: An electronic device such as a device with a display may have a force sensor. The force sensor may include capacitive electrodes separated by a deformable layer such as a layer of an elastomeric polymer. The display or other layers in the electronic device may deform inwardly under applied force from a finger of a user or other external object. As the deformed layers contact the deformable layer, the deformable layer is compressed and the spacing between the capacitive electrodes of the force sensor decreases. This causes a measurable rise in the capacitance signal and therefore the force signal output of the force sensor. To prevent the deformable layer from sticking to the inner surface of the display layers, air flow promotion structures may be interposed between the deformable layer and the inner surface of the display. The air flow promotion structures may include spacer pads with anti-stick surfaces.

公开(公告)号：US10224304B2

公开(公告)日：2019-03-05

申请号：US15421194

申请日：2017-01-31

Applicant: Apple Inc.

Inventor： Wei Lin ,  Nathan K. Gupta ,  Po-Jui Chen

IPC: H01L23/00 ,  C09J9/02 ,  C09J11/04 ,  C08K7/00 ,  C08K9/02 ,  C08K3/08

Abstract: Conductive adhesive films can include a binding material having a first set of conductive particles therewithin. The binding material can be electrically non-conductive and can flow between and bond external electronic components during a bonding process. The first set of conductive particles can each have cores formed of a first material, such as polymer, and coatings surrounding the cores, the coatings formed of a second material that is electrically conductive, such as nickel. The binding material can also include a second set of smaller conductive particles formed of a third material that is electrically conductive, such as copper, which can have coatings formed of a fourth material that is electrically conductive, such as silver. The first set of conductive particles can each be sphere shaped, and the second set of conductive particles can each be flake shaped. The conductive particles can form electrical paths between the external electronic components.

公开(公告)号：US10098224B1

公开(公告)日：2018-10-09

申请号：US15871585

申请日：2018-01-15

Applicant: Apple Inc.

Inventor： Yindar Chuo ,  Nathan K. Gupta ,  Po-Jui Chen ,  Wei Lin ,  Wei-Hao Sun ,  Jui-Ming Yang

IPC: H05K1/00 ,  H05K1/02 ,  H01R12/77 ,  H01R12/59 ,  H05K1/03 ,  B32B38/00 ,  H01R43/02

Abstract: Reinforcement components for electrical connections with limited accessibility Shield structures with reduced spacing between adjacent insulation components and systems and methods for making the same are provided. In some embodiments, a reinforcement component may be compressed between two portions of a first electronic component in order to deform the reinforcement component for filling in a void between the reinforcement component and a coupling formed between the first electronic component and a second electronic component. The first electronic component may be a flexible circuit component that may be folded over the reinforcement component prior to the reinforcement component being compressed. This may enable the reinforcement component to be effectively positioned with respect to the first electronic component prior to being deformed for reinforcing one or more couplings made between the first electronic component and the second electronic component.