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公开(公告)号:US20220019108A1
公开(公告)日:2022-01-20
申请号:US17213824
申请日:2021-03-26
Applicant: BOE Technology Group Co., Ltd.
Inventor: Xiaoxin SONG , Feng ZHANG , Wenqu LIU , Zhijun LV , Liwen DONG , Zhao CUI , Detian MENG , Libo WANG , Dongfei HOU , Qi YAO
IPC: G02F1/1335 , F21V8/00
Abstract: The present disclosure can provide a transparent display panel, a preparation method thereof and a display device. The transparent display panel includes a bearing layer disposed between a base substrate and a liquid crystal layer and including a plurality of concave structures, and a plurality of reflecting structures located between the bearing layer and the liquid crystal layer, where an orthographic projection of the concave structure on the base substrate covers an orthographic projection of one or more reflecting structures on the base substrate.
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公开(公告)号:US20210167274A1
公开(公告)日:2021-06-03
申请号:US17039228
申请日:2020-09-30
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor: Feng ZHANG , Wenqu LIU , Zhijun LV , Liwen DONG , Xiaoxin SONG , Zhao CUI , Detian MENG , Libo WANG
IPC: H01L41/113 , H01L41/047 , H01L41/332
Abstract: A piezoelectric device includes: a base having at least one hole, a heat conductive portion disposed in the at least one hole and in contact with a wall of the at least one hole, and at least one piezoelectric sensor disposed on the base. A thermal conductivity of the heat conductive portion is greater than a thermal conductivity of the base. Each piezoelectric sensor includes: a first electrode, a piezoelectric pattern made of a piezoelectric material and a second electrode that are sequentially stacked in a thickness direction of the base.
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公开(公告)号:US20250123520A1
公开(公告)日:2025-04-17
申请号:US18293395
申请日:2022-06-30
Applicant: BOE Technology Group Co., Ltd.
Inventor: Wenqu LIU , Feng ZHANG , Qi YAO , Yong YU , Detian MENG , Zhao CUI , Zhijun LV , Yang YUE , Yuqiao LI , Dongfei HOU , Liwen DONG , Tianmin ZHOU
IPC: G02F1/1339 , G02F1/1333 , G02F1/1362 , G02F1/1368 , H10D86/40
Abstract: Provided is a display substrate. The display substrate includes: a substrate body; and a plurality of support pillars disposed on the substrate body, wherein the support pillar includes a first surface in contact with the substrate body, and a second surface opposite to the first surface; wherein in any direction parallel to the substrate body, a ratio of a width of the first surface to a width of the second surface is greater than or equal to 0.8, and is less than or equal to 1.2.
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公开(公告)号:US20250087865A1
公开(公告)日:2025-03-13
申请号:US18279381
申请日:2022-11-09
IPC: H01P1/18 , G02F1/1343 , H01Q3/36
Abstract: A phase shifter, a phase shifter array, an antenna array and an electronic device are provided and belong to the field of communication technology. The phase shifter includes: first and second dielectric substrates opposite to each other, a first transmission line and a second transmission line on a side of the first dielectric substrate close to the second dielectric substrate, patch electrodes on a side of the second dielectric substrate close to the first dielectric substrate, and a tunable dielectric layer between a layer where the transmission lines are located and a layer where the patch electrodes are located; wherein orthographic projections of two ends of each patch electrode on the first dielectric substrate overlap with orthographic projections of the first and second transmission lines on the first dielectric substrate, respectively; and at least two of the plurality of patch electrodes are connected to different first bias voltage lines.
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公开(公告)号:US20240365478A1
公开(公告)日:2024-10-31
申请号:US18769438
申请日:2024-07-11
Applicant: BOE Technology Group Co., Ltd.
Inventor: Guoteng LI , Shuilang DONG , Xinhong LU , Liuqing LI , Jingshang ZHOU , Baoman LI , Zhao CUI , Yingwei LIU
CPC classification number: H05K3/4691 , H05K1/111 , H05K3/16 , H05K3/4007 , H05K5/0069 , H05K2203/0143 , H05K2203/0723 , H05K2203/1377
Abstract: Embodiments of the present disclosure provide a circuit board, a display apparatus, and a manufacturing method for a circuit board. The manufacturing method for the circuit board includes: providing a precursor substrate; forming seed patterns and an auxiliary seed pattern on a side of the precursor substrate, where the seed patterns are located in the patterned areas, the auxiliary seed pattern is located in the non-patterned area, and the seed pattern and the auxiliary seed pattern are separated from each other; and forming a pad at a position of the seed pattern and an auxiliary pattern at a position of the auxiliary seed pattern by an electroplating process.
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公开(公告)号:US20240297426A1
公开(公告)日:2024-09-05
申请号:US18028012
申请日:2022-04-26
Applicant: BOE Technology Group Co., Ltd.
Inventor: Zhao CUI , Feng ZHANG , Liwen DONG , Dongfei HOU , Yuqiao LI , Wenqu LIU , Zhijun LV , Detian MENG , Qi YAO , Liuqing LI , Yong MA , Mengya SONG
Abstract: A phase shifter, a manufacturing method thereof and an electronic device are provided. The phase shifter includes opposite first and second substrates, and a tunable dielectric layer and first isolation components therebetween. The first substrate includes a first dielectric substrate and a first electrode on a side of the first dielectric substrate close to the tunable dielectric layer; the second substrate includes a second dielectric substrate and a second electrode on a side of the second dielectric substrate close to the tunable dielectric layer; the phase shifter includes a phase shift region and a peripheral region; the phase shift region includes overlapping regions; the first electrode and the second electrode are both in the phase shift region, and orthographic projections of the first electrode and the second electrode on the first dielectric substrate at least partly overlap with each other in the overlapping regions, to form overlapping capacitors.
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公开(公告)号:US20230215851A1
公开(公告)日:2023-07-06
申请号:US17922139
申请日:2021-05-14
Applicant: BOE Technology Group Co., Ltd.
Inventor: Zhijun LV , Feng ZHANG , Wenqu LIU , Xiaoxin SONG , Zhao CUI , Liwen DONG , Detian MENG , Libo WANG , Dongfei HOU , Lizhen ZHANG
CPC classification number: H01L25/167 , H01L27/124 , H01L33/0093 , H01L24/05 , H01L24/95 , H01F7/20 , H01F7/064 , H01L2224/05573 , H01L2224/06131 , H01L24/06 , H01L24/83 , H01L2224/2957 , H01L2224/29611 , H01L2224/29639 , H01L24/29 , H01L2224/83201 , H01L2224/95136 , H01L2224/95133
Abstract: A driving backplane, a transfer method for a light-emitting diode chip (21), and a display apparatus. The driving backplane comprises: a base substrate (10), a driving circuit, a plurality of electromagnetic structures (13), and a plurality of contact electrodes (12). The plurality of electromagnetic structures (13) in the driving backplane are symmetrically arranged relative to a first straight line (L1) and a second straight line (L2). A current signal can be applied to each electromagnetic structure (13) by means of the driving circuit. Stress generated by a transfer carrier plate (20) according to the magnetic force of each electromagnetic structure (13) moves the transfer carrier plate (20). When the transfer carrier plate (20) is stress balanced in each direction parallel to the surface of the transfer carrier plate (20), the light-emitting diode chip (21) is precisely aligned to corresponding contact electrodes (12).
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公开(公告)号:US20220223674A1
公开(公告)日:2022-07-14
申请号:US17359675
申请日:2021-06-28
Applicant: BOE Technology Group Co., Ltd.
Inventor: Wenqu LIU , Qi YAO , Detian MENG , Feng ZHANG , Zhao CUI , Liwen DONG , Xiaoxin SONG , Dongfei HOU , Libo WANG , Zhijun LV
IPC: H01L27/32 , H01L29/786 , H01L51/56
Abstract: Provided are a display substrate and a preparation method thereof, and a display apparatus. The display substrate includes a substrate, an active structure layer disposed on the substrate, a first source-drain structure layer disposed on a side of the active structure layer away from the substrate, and a second source-drain structure layer disposed on a side of the first source-drain structure layer away from the substrate. The active structure layer includes a first active layer and a second active layer. The first source-drain structure layer includes a first active via and a first source-drain electrode, and the first source-drain electrode is connected to the first active layer through the first active via; and the second source-drain structure layer includes a second active via and a second source-drain electrode, and the second source-drain electrode is connected to the second active layer through the second active via.
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公开(公告)号:US20210200985A1
公开(公告)日:2021-07-01
申请号:US16966394
申请日:2020-01-17
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor: Wenqu LIU , Xiufeng LI , Qi YAO , Feng ZHANG , Liwen DONG , Zhao CUI , Chuanxiang XU , Detian MENG , Xiaoxin SONG , Libo WANG , Yang YUE , Dongfei HOU , Zhijun LV
Abstract: A fingerprint identification module, a manufacturing method thereof and an electronic device are disclosed. The fingerprint identification module includes a substrate, a piezoelectric material layer, an auxiliary structure and a plurality of first driving electrodes; the piezoelectric material layer is on the substrate, the auxiliary structure is at least partially located on the substrate, and the plurality of first driving electrodes are on a side, away from the substrate, of the piezoelectric material and the auxiliary structure; each first driving electrode extends along a first direction and exceeds a first edge of the piezoelectric material layer in the first direction; the plurality of first driving electrodes are arranged at intervals along a second direction; the auxiliary structure is at least in contact with the first edge; the auxiliary structure includes a slope portion; and a thickness of the slope portion in a direction perpendicular to the functional substrate gradually decreases in a direction from the first edge to a position away from a center of the piezoelectric material layer. The fingerprint identification module can avoid the problems of wire disconnection and conductive material residue in the process of forming the plurality of first driving electrodes on the piezoelectric material layer, thereby improving the yield of products.
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公开(公告)号:US20210110761A1
公开(公告)日:2021-04-15
申请号:US17070338
申请日:2020-10-14
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor: Wenqu LIU , Qi YAO , Feng ZHANG , Zhijun LV , Liwen DONG , Zhao CUI , Xiaoxin SONG , Detian MENG , Libo WANG
Abstract: A driving backplane includes a base, and a pixel driving circuit, a first electrode and a first piezoelectric block that are disposed in the sub-pixel region. The pixel driving circuit is disposed on the base. The first electrode is disposed at a side of the pixel driving circuit away from the base. The first electrode includes a first sub-electrode pattern and a second sub-electrode pattern that are in a same layer and are spaced apart to be insulated from each other, and the first sub-electrode pattern is electrically connected to the pixel driving circuit. The first piezoelectric block is disposed between the pixel driving circuit and the first electrode, and the first sub-electrode pattern and the second sub-electrode pattern are in contact with the first piezoelectric block.
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