Abstract:
PROBLEM TO BE SOLVED: To prevent the oxidation of en electrode in case of burning or the like after the electrode is formed on a board. SOLUTION: An electrode, which is provided on a glass board forming the front surface plate or the back surface plate of a plasma display device, is formed of a metal electrode 22 and a transparent electrode laminated thereon. Since the metal electrode 22 is covered with the transparent electrode for protection, even in the case where the material, which is easy to be oxidized, is used for the material of the metal electrode 22, oxidation of the metal electrode 22 at the time of burning or the like can be prevented. Consequently, polishing for eliminating the metal oxide film in an electrode ejecting part is eliminated.
Abstract:
PURPOSE: To provide high-definition, low-resistance-value, stable electrodes, to achieve cost reduction and excellent productivity, and to deal with large panels. CONSTITUTION: In a gas-discharge display panel wherein plural groups of electrodes are placed on the opposite surfaces of two substrates 1, 2, the electrodes 4, 8 on the surface of at least one of the substrates are formed from one or plural patterned sheets of metallic foil. Either the surface of the substrate is laminated with the metallic foil serving as the electrode material and is then patterned or the surface is laminated with previously patterned metallic foil. Since the resistivity value of the metal used specifies the electrode resistance, the panel that has a low electrode resistance value and is stable can be obtained. Not only drawbacks of conventional screen printing method and vacuum film-forming method are eliminated but also advantages of both methods are retained.
Abstract:
PURPOSE: To form an electrode wiring and a resistance element which can cope with microstructure and high definition of an integrated circuit, etc. CONSTITUTION: After a conductive film 12 is formed on a substrate 1 by a thick film print method and photosensitive resin 13 which is patterned by photolithography is put on the conductive film 12, the following processes are executed; a first process for forming an electrode wiring by etching the conductive film 12 by using the photosensitive resin 13 as a mask material and a second process for forming a resistance element by putting photosensitive resin having a recessed part in a position corresponding to a resistance element by photolithography on a substrate and burying a resistance material in the recessed part and thereafter peeling the photosensitive resin. The first process and the second process can be inverted.
Abstract:
PURPOSE: To accurately align the elements of an electrode panel formed by photolithography with those of a panel formed by printing method by forming alignment marks on a substrate on which electrodes are to be formed. CONSTITUTION: A conductive film is formed after the formation of at least one alignment mark 31 on a substrate 2, and a layer of a photosensitive resin is formed over the conductive film. Next, a light shielding mask with an electrode pattern placed thereon is positioned with respect to the alignment mark 31, and pattern development is carried out after the exposure of the layer of the photosensitive resin via the light shielding mask. After the conductive film is chemically etched with the patterned photosensitive resin used as a mask, the patterned photosensitive resin is peeled.
Abstract:
PROBLEM TO BE SOLVED: To provide a substrate for a solar cell, which is capable of forming a solar cell excellent in moisture resistance.SOLUTION: A substrate 10 for a solar cell comprises: a metal substrate 1; an insulating layer 2 formed on the metal substrate and made of a resin having insulating properties; and an insulating layer removed portion 3 where the insulating layer is not formed on the metal substrate.
Abstract:
PROBLEM TO BE SOLVED: To provide a thin-film solar cell using a flexible glass substrate having small thickness, strong brittleness and high breakability wherein the glass substrate is prevented from being damaged and broken. SOLUTION: The problem is solved by the thin-film solar cell 10 comprising at least a glass substrate 1 with a thickness of 30 to 200 μm, a damage prevention layer 7 formed on at least one surface of the glass substrate 1, an electrode layer 2 provided on the glass substrate 1 or the damage prevention layer 7, and a chalcopyrite compound semiconductor layer 3 provided on the electrode layer 2. A metal oxide layer, a metal nitride layer, a metal oxynitride layer, or a metal carbide layer is preferable as the damage prevention layer 7. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To flatten the surface of a thick film dielectric layer of an EL element without involving, in contrast to existing techniques, the formation of a flattening layer, the addition of hydrostatic press and other processes for the thick film dielectric layer, and an increase in materials used. SOLUTION: A first electrode layer 3A, the thick film dielectric layer 4, a luminescent layer 5 and a second electrode layer 3B are laminated in order on a substrate 2, and the mean grain size of dielectric powder forming the thick film dielectric layer 4 is set at not larger than 0.3 μm. The thick film dielectric layer 4 may have a two-layer structure whose lower layer dielectric powder has a larger mean grain size. The standard of surface irregularities of the thick film dielectric layer 4 may be replaced with the standard of glossiness to provide preferable flatness and easy control. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a pattern forming method of an inorg. material with good accuracy at a low cost. SOLUTION: This method include at least a first process to apply slurry containing inorg. powder of 0.1 to 100 μm average particle size on a base body, a second process to irradiate only a necessary part of the applied slurry with laser light to fix the inorg. powder to the base body, and a third process to remove the part of the applied slurry not irradiated with laser light. By this method using laser, formation of a pattern with high accuracy at a low cost is possible compared to conventional screen printing method having problems of the pattern accuracy and conventional thin film method having problems of the cost.
Abstract:
PROBLEM TO BE SOLVED: To provide a method of forming electrodes which simplifies the correcting step and omits the baking step. SOLUTION: The method comprises step 1 of patterning a thick film conductor material into specified shape, at least contg. a conductive powder, glass frit and thermoplastic resin, step 2 of heat treating at temp. selected in a range from the thermoplastic resin wt. reducing start temp. due to its thermal decomposition to the glass frit softening point, step 3 of testing the conduction of the heat treated conductor material, and step 4 of baking this material above the glass frit softening temp. After patterning the conductor material, part of the resin is baked off to make the material conductive while the electrodes are tested. This facilitates correcting short-circuited parts of the electrodes and allows broken parts of the electrodes to be corrected and baking of the electrodes laminated with insulation layers to be omitted.
Abstract:
PROBLEM TO BE SOLVED: To provide a process for producing a substrate for display having flexibility. SOLUTION: The front surface of a metallic substrate consisting of a metal oxidizable by an anodic oxidation method of aluminum, etc., and having the thickness at which the desired flexibility is obtainable is oxidized by the anodic oxidation method to obtain a metallic substrate layer 31 and an oxidized layer 32. The oxidized layer 32 is removed by etching and thereafter, the surface of the metallic substrate layer 31 is again anodically oxidized to form the oxidized layer which is then again removed by etching. The surface of the metallic substrate layer 31 is polished by electrolytic polishing when such anodic oxidation and etching stages are alternately repeated. The flexible substrate is obtd. by ending the treatment where the oxidized layers are formed if the desired flatness is obtd. If TFT elements, etc., are formed on such substrate, the an active matrix substrate having the flexibility may be embodied and the liquid crystal display having durability may be embodied.