Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device including an internal circuit operating at constant voltage not depending on power source voltage supplied from outside and an internal circuit operating at the power source voltage, which suppresses the occurrence of malfunction caused due to large variation in power source voltage supplied from outside.SOLUTION: A semiconductor device comprises an internal circuit and an internal voltage generating circuit for generating an internal voltage stabilized with respect to variation in power source voltage supplied from outside and for supplying the internal voltage to the internal circuit. The internal voltage generating circuit stops the stabilization operation with respect to the internal voltage when the power source voltage has increased over a predetermined value, and controls the internal voltage to increase along with the increase in power source voltage.
Abstract:
PROBLEM TO BE SOLVED: To provide a multiport memory that increases the speed of data communication between a plurality of information processing devices, and also to provide an information processing system that is fast and easy to use. SOLUTION: In an information processing system, a plurality of information processing devices CHIP0 and CHIP1 are connected to multiport memory MPMEM0 that has a plurality of ports, and memory areas in multiport memory MPMEM0 can be altered to memory areas occupied by certain ports and memory areas shared by a plurality of ports. In this occasion, immediately after the occurrence of a request from each port, the status of this request may be outputted from other ports. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor memory device provided with a plurality of ports, which reduces a clock cycle required for data transfer between a common memory cell array and an exclusive memory cell array. SOLUTION: A DualPortDRAM 70 is provided with internal address generating circuits 726, 727, 728 and control circuits 729, 730. The internal address generating circuits 726 and 727 generate an address of transfer source or transfer destination in data transfer. Also, the control circuit 729 causes the internal address generating circuit 727 to generate an address of transfer source based on a data transfer command, while causing the internal address generating circuit 726 to generate an address of transfer destination, and inputs successively data output by burst-read from a memory cell array 716 as a transfer source to a memory cell array 705 as a transfer destination through an internal data bus. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor storage device which increases access speed and reduces a wiring area for an IO bus in the center of the chip by equalizing a distance between each memory cell and DQ pads to reduce variation in access time. SOLUTION: The semiconductor storage device has a memory cell array composed of blocks divided into a plurality of data IO pads, and the memory cell array is divided into a plurality of banks. The bank has a plurality of divided memory cell areas, the block formed by the memory cell area for each bank, and a preset number of data IO pads prepared correspondingly to the memory cell in the block. The IO pads are arranged in the vicinity of the corresponding block. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor memory in which refreshing of rational, highly reliable and low power consumption can be performed in line with a retention time of a memory cell, and a refreshing method of the semiconductor memory. SOLUTION: When the semiconductor memory is entered to a refresh-mode, a retention time of a memory cell is measured for each word line, a plurality of refresh-periods corresponding to the retention time of the memory cell are set, and the memory cell is refreshed according to the plurality of refresh-periods. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a memory system capable of realizing high-speed operation by reducing influence or the like by a reflection signal by branch and impedance mismatching of various kinds of wiring between a memory controller and a memory module, and influence or the like by transmission delay of data, command addresses or clock signals in the memory module. SOLUTION: This memory system is provided with the memory controller, and the memory module with DRAMs mounted. The memory system is so structured that a buffer is mounted on the memory module, and the buffer is connected to the memory controller through data wiring, command address wiring and clock wiring; and the DRAMs on the memory module are connected to the buffer through internal data wiring, internal command address wiring and internal clock wiring. The data wiring, the command address wiring and the clock wiring may be cascaded with a buffer of another memory module. High-speed data transmission is carried out between the DRAMs on the memory module and the buffer by using a data phase signal synchronized with the clock signal. COPYRIGHT: (C)2004,JPO