中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

75 records (took 0.026 seconds)

    35.
    发明专利
    未知

    公开(公告)号：AT483250T

    公开(公告)日：2010-10-15

    申请号：AT07728600

    申请日：2007-04-27

    Applicant: ERICSSON TELEFON AB L M

    Inventor： LIGANDER PER

    IPC: H01L23/31

    Abstract: The present invention relates to a microwave chip supporting structure comprising a first microwave laminate layer, with a first side and a second side, and an outer limit. At least one conductor is formed on said first side extending towards said outer limit. The microwave chip supporting structure further comprises a second microwave laminate layer, with a first side and a second side, the second side of the second laminate layer being fixed to at least a part of the first side of the first laminate layer. The first laminate layer and/or the second laminate layer comprises at least one recess arranged for receiving a microwave chip intended to be connected to said conductor. The second laminate layer extends outside the outer limit of the first laminate layer, said conductors continuing on the second side of the second laminate layer without contacting the first laminate layer.

    36.
    发明专利
    未知

    公开(公告)号：DE69923205T2

    公开(公告)日：2005-06-23

    申请号：DE69923205

    申请日：1999-10-05

    Applicant: ERICSSON TELEFON AB L M

    Inventor： BERGSTEDT LEIF ,  LIGANDER PER ,  BOUSTEDT KATARINA

    IPC: H05K1/18 ,  H05K3/38 ,  H05K3/46 ,  H05K1/03 ,  H05K1/16

    Abstract: Methods of manufacturing a printed board assembly. In one embodiment, a substrate is coated with an electrically conducting material; electrical components are mounted on some areas of the substrate; non-conducting material is disposed in areas between the electrical components; the substrate, electrical components and non-conducting material are sandwiched between two sheets of resin coated conducting foil, wherein the resin on the foils faces the substrate and buries the electrical components; circuit patterns are etched in the exposed surfaces of the resin coated conducting foils; and, electrical connections are established between at least one of the resin coated conducting foils and the electronic components.

    37.
    发明专利
    未知

    公开(公告)号：SE517845C2

    公开(公告)日：2002-07-23

    申请号：SE0004494

    申请日：2000-12-05

    Applicant: ERICSSON TELEFON AB L M

    Inventor： BERGSTEDT LEIF ,  LEWIN THOMAS ,  LIGANDER PER ,  GEVORGIAN SPARTAK

    IPC: H01Q15/14

    Abstract: The present invention relates an antenna arrangement (23, 330, 430, 530, 630) comprising a fit layer (331, 431, 531, 631) consisting of a dielectric material and a second reflective layer (335, 435, 535, 640, The dielectric material has variable dielectric characteristics. An electromagnetic radiation (50) passing through said first layer (331, 431, 531, 631) and at least partly reflected by said second layer (335, 435, 535, 640) is modulated by varying said variable dielectric characteristics of said first layer.

    40.
    发明专利
    未知

    公开(公告)号：SE9901831L

    公开(公告)日：2000-11-20

    申请号：SE9901831

    申请日：1999-05-19

    Applicant: ERICSSON TELEFON AB L M

    Inventor： BERGSTEDT LEIF ,  LIGANDER PER

    IPC: H01L23/12 ,  H01L21/48 ,  H01L23/15 ,  H01L23/36 ,  H01L23/373

    Abstract: A carrier intended for one or several electronic components and having spaces provided for the components on at least one surface is provided. The carrier has an at least partly conductive Low Temperature Cofire Ceramic (LTCC) material with good thermal conduction capacity, so that the carrier provides mechanical support for the components and conducts heat generated by the components.

Patent Agency Ranking